Abstract: A wiring board includes a core substrate, a first laminated structure formed on a surface of the substrate and including conductive and insulation layers, and a second laminated structure formed on the opposite surface of the substrate and including conductive and insulation layers. The substrate has a connection conductor made of a plating. The insulation layers of the first laminated structure have connection conductors stacked one over another and made of platings. The insulation layers of the second laminated structure have connection conductors stacked one over another and made of platings. The connection conductors of the laminated structures are stacked on the connection conductor of the substrate. The connection conductors of the laminated structures include outer-layer connection conductors which have positions shifted in a substantially same direction from the position of the connection conductor of the substrate.

Abstract: A wiring board including a core insulation layer having a connection conductor formed in a hole of the core layer, and an interlayer insulation layer laminated on one side of the core layer. The conductor of the core layer includes plating filling the hole of the core layer. The interlayer layer has a connection conductor formed in a hole of the interlayer layer. The conductor of the interlayer layer includes plating filling the hole of the interlayer layer. The conductor of the interlayer layer is stacked on the conductor of the core insulation layer. The conductors of the core and interlayer layers have lands formed on the core and interlayer layers and including metal foils and plating on the foils. The foil of the land on the core layer has a thickness which is thicker than a thickness of the foil of the land on the interlayer layer.

Abstract: A wiring board includes a core substrate, a first laminated structure formed on a surface of the substrate and including conductive and insulation layers, and a second laminated structure formed on the opposite surface of the substrate and including conductive and insulation layers. The substrate has a connection conductor made of a plating. The insulation layers of the first laminated structure have connection conductors stacked one over another and made of platings. The insulation layers of the second laminated structure have connection conductors stacked one over another and made of platings. The connection conductors of the laminated structures are stacked on the connection conductor of the substrate. The connection conductors of the laminated structures include outer-layer connection conductors which have positions shifted in a substantially same direction from the position of the connection conductor of the substrate.

Abstract: A wiring board includes a core substrate, a first laminated structure formed on a surface of the substrate and including conductive and insulation layers, and a second laminated structure formed on the opposite surface of the substrate and including conductive and insulation layers. The substrate has a connection conductor made of a plating. The insulation layers of the first laminated structure have connection conductors stacked one over another and made of platings. The insulation layers of the second laminated structure have connection conductors stacked one over another and made of platings. The connection conductors of the laminated structures are stacked on the connection conductor of the substrate. The connection conductors of the laminated structures include outer-layer connection conductors which have positions shifted in a substantially same direction from the position of the connection conductor of the substrate.

Abstract: A wiring board including a core insulation layer having a connection conductor formed in a hole of the core layer, and an interlayer insulation layer laminated on one side of the core layer. The conductor of the core layer includes plating filling the hole of the core layer. The interlayer layer has a connection conductor formed in a hole of the interlayer layer. The conductor of the interlayer layer includes plating filling the hole of the interlayer layer. The conductor of the interlayer layer is stacked on the conductor of the core insulation layer. The conductors of the core and interlayer layers have lands formed on the core and interlayer layers and including metal foils and plating on the foils. The foil of the land on the core layer has a thickness which is thicker than a thickness of the foil of the land on the interlayer layer.