Patents by Inventor Hideyuki Yakiyama

Hideyuki Yakiyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic component mounting apparatus and electronic component mounting method
    Patent number: 7275314
    Abstract: In an electronic component mounting apparatus for taking out a chip 6 from a component supply portion 4 to mount to a board 16 held by a board holding portion 10, an image of a supply portion reference mark provided at a mark post 18 of the component supply portion 2 is taken by a second camera 35 moved by a camera moving mechanism, a camera coordinates system is calibrated based on a result of taking the image, thereafter, a position of the chip 6 is recognized by the second camera 35 and the chip 6 is picked up by a mounting head based on a result of the recognition. Thereby, stable pick up accuracy can be ensured by calibrating an aging variation of the coordinates system owing to thermal elongation or contraction of the camera moving mechanism.
    Type: Grant
    Filed: March 23, 2005
    Date of Patent: October 2, 2007
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hideyuki Yakiyama, Yasuhiro Emoto, Tadashi Shinozaki
  • Electronic component mounting apparatus and electronic component mounting method
    Patent number: 6999184
    Abstract: Jig interchanging mechanism for supplying and carrying out a component holding jig to and from an electronic component supply portion is moved by a component image taking camera moving mechanism for moving the component image taking camera above the electronic component supply portion, the compact electronic component mounting apparatus and the electronic component mounting method excellent in an operational efficiency can be realized.
    Type: Grant
    Filed: October 22, 2004
    Date of Patent: February 14, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hideyuki Yakiyama, Yasuhiro Emoto
  • Electronic component mounting apparatus and electronic component mounting method
    Publication number: 20050210667
    Abstract: In an electronic component mounting apparatus for taking out a chip 6 from a component supply portion 4 to mount to a board 16 held by a board holding portion 10, an image of a supply portion reference mark provided at a mark post 18 of the component supply portion 2 is taken by a second camera 35 moved by a camera moving mechanism, a camera coordinates system is calibrated based on a result of taking the image, thereafter, a position of the chip 6 is recognized by the second camera 35 and the chip 6 is picked up by a mounting head based on a result of the recognition. Thereby, stable pick up accuracy can be ensured by calibrating an aging variation of the coordinates system owing to thermal elongation or contraction of the camera moving mechanism.
    Type: Application
    Filed: March 23, 2005
    Publication date: September 29, 2005
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hideyuki Yakiyama, Yasuhiro Emoto, Tadashi Shinozaki
  • Electronic component mounting apparatus and electronic component mounting method
    Publication number: 20050088666
    Abstract: Jig interchanging mechanism for supplying and carrying out a component holding jig to and from an electronic component supply portion is moved by a component image taking camera moving mechanism for moving the component image taking camera above the electronic component supply portion, the compact electronic component mounting apparatus and the electronic component mounting method excellent in an operational efficiency can be realized.
    Type: Application
    Filed: October 22, 2004
    Publication date: April 28, 2005
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hideyuki Yakiyama, Yasuhiro Emoto