Abstract: A thin-film magnetic head includes a slider substrate and a write element. The slider substrate has an air bearing surface at one side thereof. The write element has a recording magnetic pole film. The recording magnetic pole film is disposed on a plane crossing the air bearing surface over the slider substrate and has a large-width portion and a small-width portion continuously arranged in the named order toward the air bearing surface. The small-width portion has a smaller width than the large-width portion. Of the large-width portion and the small-width portion, at least the small-width portion has a first portion and a second portion. The second portion is continuous with an upper end of the first portion and has both side faces inclined in such a direction as to increase the width. An external angle of the first portion formed by a plane parallel to a bottom face and the side face is larger than an external angle of the second portion formed by a plane parallel to the bottom face and the side face.

Abstract: The present invention relates to a method of making a mask for patterning a thin film. The method includes a step of forming an inorganic material, which is resolvable into alkali solution, on a substrate; a step of forming the inorganic material in a predetermined pattern; and a step of narrowing the inorganic material with the alkali solution to form the mask.

Abstract: In the present invention, provided is a method of forming a mask pattern by which a fine thin film pattern may be formed more easily with higher resolution and precision. In the method of forming a mask pattern, a photoresist pattern having an opening is formed on a substrate, then, an inorganic film is formed so as to cover the upper surface of the photoresist pattern and the inside of the opening, then the inorganic film on the upper surface of the photoresist pattern is removed by a dry etching process. Subsequently, an inorganic mask pattern is formed by removing the photoresist pattern. The inorganic mask pattern thus formed hardly produces an issue of deformation such as physical displacement even when it is heated in the dry etching process.

Abstract: The present invention relates to a magnetic head, a manufacturing method therefor, a head assembly, and a magnetic recording/reproducing apparatus. According to the present invention, it includes a magnetic pole layer, a non-magnetic layer, a trailing gap layer, and a trailing shield layer. The magnetic pole layer has a pole tip exposed on a magnetic medium-facing surface. The non-magnetic layer is laid on the magnetic pole layer. The trailing shield layer is exposed on the magnetic medium-facing surface and laid over the magnetic pole layer and the non-magnetic layer with the trailing gap layer between. The magnetic pole layer and the non-magnetic layer have a continuous tapered face opposed to a lower side of the trailing shield layer. Moreover, the tapered face extends from a trailing edge of the pole tip at a constant inclination angle.

Abstract: The present invention relates to a method of making a mask for patterning a thin film The method includes a step of forming an inorganic material, which is resolvable into alkali solution, on a substrate; a step of forming the inorganic material in a predetermined pattern; and a step of narrowing the inorganic material with the alkali solution to form the mask.

Abstract: A thin-film magnetic head includes a slider substrate and a write element. The slider substrate has an air bearing surface at one side thereof. The write element has a recording magnetic pole film. The recording magnetic pole film is disposed on a plane crossing the air bearing surface over the slider substrate and has a large-width portion and a small-width portion continuously arranged in the named order toward the air bearing surface. The small-width portion has a smaller width than the large-width portion. Of the large-width portion and the small-width portion, at least the small-width portion has a first portion and a second portion. The second portion is continuous with an upper end of the first portion and has both side faces inclined in such a direction as to increase the width. An external angle of the first portion formed by a plane parallel to a bottom face and the side face is larger than an external angle of the second portion formed by a plane parallel to the bottom face and the side face.

Abstract: A method of forming a magnetic pole section of a perpendicular magnetic recording type thin-film magnetic head and a method of manufacturing a perpendicular magnetic recording type thin-film magnetic head that include forming on an under layer a resist pattern having an opening, forming a first nonmagnetic layer, forming a first magnetic layer forming a magnetic layer pattern, removing the resist pattern and then applying a resist layer onto a first nonmagnetic layer and a magnetic layer pattern, developing or ashing partway the applied resist layer and baking the remaining resist layer, removing the first nonmagnetic layer from at least a side surface of the magnetic layer pattern by etching with the baked resist layer being left, removing all of the resist layer and then forming a second nonmagnetic layer on at least the magnetic layer pattern, and forming a second magnetic layer on the formed second nonmagnetic layer.

Abstract: The micropattern formation of the invention comprises forming a resist pattern, and then forming a carbon-containing film on the surface of the resist pattern, followed by ashing of the carbon-containing film and a portion of the resist surface constituting the resist pattern. Thus, the discharge state of ashing just after the initiation of discharge is so stabilized that the ashing rate distribution can be improved, and sensitive pattern slimming can be implemented with ease and high precision.

Abstract: The present invention relates to a magnetic head, a manufacturing method therefor, a head assembly, and a magnetic recording/reproducing apparatus. According to the present invention, it includes a magnetic pole layer, a non-magnetic layer, a trailing gap layer, and a trailing shield layer. The magnetic pole layer has a pole tip exposed on a magnetic medium-facing surface. The non-magnetic layer is laid on the magnetic pole layer. The trailing shield layer is exposed on the magnetic medium-facing surface and laid over the magnetic pole layer and the non-magnetic layer with the trailing gap layer between. The magnetic pole layer and the non-magnetic layer have a continuous tapered face opposed to a lower side of the trailing shield layer. Moreover, the tapered face extends from a trailing edge of the pole tip at a constant inclination angle.

Abstract: A main magnetic pole includes a first part extending from a medium facing surface to a point at a predetermined distance from the medium facing surface, and a second part other than the first part. An accommodation part for accommodating the main magnetic pole includes: a first layer having a groove; a second layer lying between the first layer and the main magnetic pole in the first layer's groove; and a third layer interposed in part between the second layer and the main magnetic pole in the first layer's groove. The second layer is formed of a metal material different from a material used to form the first layer. The third layer is formed of an inorganic insulating material. The second and third layers lie between the first layer and the first part. The second layer lies between the bottom of the first layer's groove and the second part, but the third layer does not. The distance between the bottom of the first layer's groove and the second part is smaller than that between the bottom and the first part.

Abstract: A method of forming a magnetic pole section of a perpendicular magnetic recording type thin-film magnetic head and a method of manufacturing a perpendicular magnetic recording type thin-film magnetic head that include forming on an under layer a resist pattern having an opening, forming a first nonmagnetic layer, forming a first magnetic layer, forming a magnetic layer pattern, removing the resist pattern and then applying a resist layer onto a first nonmagnetic layer and a magnetic layer pattern, developing or ashing partway the applied resist layer and baking the remaining resist layer, removing the first nonmagnetic layer from at least a side surface of the magnetic layer pattern by etching with the baked resist layer being left, removing all of the resist layer and then forming a second nonmagnetic layer on at least the magnetic layer pattern, and forming a second magnetic layer on the formed second nonmagnetic layer.

Abstract: The process of forming a plated film according to the invention is designed such that the surface asperities of the inorganic film formed by the tracing of a standing wave occurring at the inner wall surface of the first opening in the resist at the resist pattern-formation step are reduced or eliminated. It is thus possible to form, efficiently yet in a short period of time, a high aspect-ratio plated film portion having an aspect ratio of greater than 1. In addition, the formed plated film quality is extremely improved for the absence of pores (cavities).

Abstract: A main magnetic pole includes a first part extending from a medium facing surface to a point at a predetermined distance from the medium facing surface, and a second part other than the first part. An accommodation part for accommodating the main magnetic pole includes: a first layer having a groove; a second layer lying between the first layer and the main magnetic pole in the first layer's groove; and a third layer interposed in part between the second layer and the main magnetic pole in the first layer's groove. The second layer is formed of a metal material different from a material used to form the first layer. The third layer is formed of an inorganic insulating material. The second and third layers lie between the first layer and the first part. The second layer lies between the bottom of the first layer's groove and the second part, but the third layer does not. The distance between the bottom of the first layer's groove and the second part is smaller than that between the bottom and the first part.

Abstract: Provided is a planarizing method in which a planarization with high flatness can be performed, without being restricted by the distribution of film thickness in the applied resist film. The planarizing method comprises the steps of: forming a resist film on a film to be planarized formed on a substrate; exposing the resist film with the amounts of exposure light in respective sections into which an area in which the film to be planarized is formed is divided, the amounts of exposure light being determined so as to realize film thicknesses to be left for planarization of the resist film in the respective sections; developing the exposed resist film, to form a resist film pattern with a controlled distribution of film thickness; and etching the resist film pattern and the film to be planarized, until eliminating the thickness amounts to be eliminated of the film to be planarized.

Abstract: Provided is a thin-film magnetic head in which the concentration of magnetic flux in the shield layer and the magnetic pole layer is suppressed. The thin-film magnetic head comprises a plurality of magnetic layers that have front surfaces reaching a head end surface on the ABS side. Further in this head, at least one of the plurality of magnetic layers has a shape in which: each of edges corresponding to both side surfaces extends so as to spread obliquely rearward with each other from an end of a straight edge in a track width direction corresponding to the front surface; and the front surface reaching the head end surface has a shape in which upper and lower corner portions in each of both end portions in the track width direction form obtuse angles or rounded shapes.

Abstract: An alignment method of mask patterns includes forming a first layer by transferring a first mask pattern onto a wafer, forming a second layer by transferring a second mask pattern onto the first layer, and particularly a first alignment step, forming the first layer, which performs alignment for minimizing offset between a center position of the wafer and a center position of the first mask pattern and a residual rotation error between the wafer and the first mask pattern and additional alignment for compensating an amount of possible deviation of superposition of the second layer pattern on the first layer pattern, and a second alignment step, forming the second layer, which performs only alignment for minimizing offset between a center position of the first layer pattern and a center position of the second mask pattern and a residual rotation error between the first layer pattern and the second mask pattern.

Abstract: A method of forming a metal trench pattern in a thin-film device includes a step of depositing an electrode film on a substrate or on a base layer, a step of forming a resist pattern layer having a trench forming portion used to make a trench pattern, on the deposited electrode film, a step of forming a metal layer for filling spaces in the trench forming portion and for covering the trench forming portion, by performing plating through the formed resist pattern layer using the deposited electrode film as an electrode, a step of planarizing at least a top surface of the formed metal layer until the trench forming portion of the resist pattern layer is at least exposed, and a step of removing the exposed trench forming portion of the resist pattern layer.

Abstract: There is a thin-film magnetic head provided, which comprises a perpendicular recording head portion including a thin-film coil adapted to generate a magnetic flux, and a main magnetic pole layer that extends rearward from a recording medium opposite plane facing a recording medium and has a main magnetic pole adapted to release a magnetic flux produced at the thin-film coil toward the recording medium. A given concave groove form that is more constricted as the lower end draws nearer is provided at or near the flare point of the front end of the main magnetic pole, so that the flow of the magnetic flux through the main magnetic pole is focused on the upper end edge (gap portion), thereby improving overwrite performance and holding back the occurrence of pole erasure.

Abstract: The micropattern formation of the invention comprises forming a resist pattern, and then forming a carbon-containing film on the surface of the resist pattern, followed by ashing of the carbon-containing film and a portion of the resist surface constituting the resist pattern. Thus, the discharge state of ashing just after the initiation of discharge is so stabilized that the ashing rate distribution can be improved, and sensitive pattern slimming can be implemented with ease and high precision.

Abstract: In the present invention, provided is a method of forming a mask pattern by which a fine thin film pattern may be formed more easily with higher resolution and precision. In the method of forming a mask pattern, a photoresist pattern having an opening is formed on a substrate, then, an inorganic film is formed so as to cover the upper surface of the photoresist pattern and the inside of the opening, then the inorganic film on the upper surface of the photoresist pattern is removed by a dry etching process. Subsequently, an inorganic mask pattern is formed by removing the photoresist pattern. The inorganic mask pattern thus formed hardly produces an issue of deformation such as physical displacement even when it is heated in the dry etching process.