Abstract: Provided is a means for sufficiently removing residues remaining on the surface of a polished object and reducing the surface roughness of the polished object. The present invention relates to a surface treatment composition containing components (A) to (C), and having pH of more than 7.0: the component (A): a cyclic amine compound having a nitrogen-containing non-aromatic heterocyclic ring, the component (B): a nonionic polymer, the component (C): a buffer represented by a formula: A-COO?NH4+ wherein A is an alkyl group having from 1 to 10 carbon atoms, or a phenyl group.

Abstract: An imaging device includes: an imaging portion; a memory capable of storing images imaged by the imaging portion; a display portion; and a touch panel arranged to overlap with the display portion and capable of detecting a distance to an indicator. When the distance is equal to or less than a first distance and more than a second distance less than the first distance, the memory stores the images at predetermined time intervals. Then, when the distance becomes equal to or less than the second distance and equal to or more than 0, the display portion displays the image that is stored in the memory before the distance becomes equal to or less than the second distance and equal to or more than 0.

Abstract: An imaging device includes: an imaging portion; a memory capable of storing images imaged by the imaging portion; a display portion; and a touch panel arranged to overlap with the display portion and capable of detecting a distance to an indicator. When the distance is equal to or less than a first distance and more than a second distance less than the first distance, the memory stores the images at predetermined time intervals. Then, when the distance becomes equal to or less than the second distance and equal to or more than 0, the display portion displays the image that is stored in the memory before the distance becomes equal to or less than the second distance and equal to or more than 0.

Abstract: A solder coated lid for a package for an electronic device has a lead-free solder layer comprising a Sn—Sb based solder with a liquidus temperature of at least 220 degrees C. provided on at least a region of the lid where the lid is to be joined to a base of a package. The lid can be joined to a base of a package at a low temperature, thereby reducing vaporization of solder components and adhesion thereof to electronic devices within the package.

Abstract: A solder coated lid for a package for an electronic device has a lead-free solder layer comprising a Sn—Sb based solder with a liquidus temperature of at least 220 degrees C. provided on at least a region of the lid where the lid is to be joined to a base of a package. The lid can be joined to a base of a package at a low temperature, thereby reducing vaporization of solder components and adhesion thereof to electronic devices within the package.

Abstract: A solder coated lid for a package for an electronic device has a lead-free solder layer comprising a Sn—Sb based solder with a liquidus temperature of at least 220 degrees C. provided on at least a region of the lid where the lid is to be joined to a base of a package. The lid can be joined to a base of a package at a low temperature, thereby reducing vaporization of solder components and adhesion thereof to electronic devices within the package.

Abstract: A portable cellular phone including the ability to customize a ring signal. The device accepts a spoken voice signal entered via a microphone and converts that signal into a digital audio signal. The device then obtains musical scale information from the digital audio signal by extracting frequency components. The device uses those frequency components to generate an audio output signal based on the extracted musical scale frequency components. This output signal can then be used as the ring signal, or for other purposes. Thus, a user can input a desired musical scale using the user's voice to customize the ring signal without relying solely on keypad operations.

Abstract: A lid for sealing a semiconductor package containing a semiconductor chip, a semiconductor package making use of the lid, and a method for producing the lid. The lid has a solder layer along the peripheral side of a ceramic plate. The solder layer has a portion of an increased solder thickness and a portion of a reduced solder thickness extending along the peripheral direction. When sealing the semiconductor package, a gas confined within the inside of the semiconductor chip mounting site of the package substrate may be discharged from the semiconductor package for realizing hermetic sealing.