Abstract: In a pattern formation device 10, a mold 100 for forming a pattern on a substrate 200 is heated to a temperature T1 equal to or higher than the glass transition temperature Tg of the surface area of the substrate 200 and in this state, the mold 100 is pressed against the substrate 200 having a temperature equal to or lower than the glass transition temperature Tg to transfer the pattern of the mold 100. Then, a heater is turned off, the mold 100 is cooled by a cooling block, and the mold 100 is then separated from the substrate 200. A pattern forming system comprising a feeding device taking substrates 200 one by one from a magazine and feeds the same to the pattern formation device 10 is preferably formed.