Patents by Inventor Hien Ly

Hien Ly has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240108681
    Abstract: Coronavirus Disease 2019 (COVID-19) remains a threat with the emergence of new variants, especially Delta and Omicron, without specific effective therapeutic drugs. The present invention provides a method and a composition for preventing and treating COVID-19 (SARS-CoV-2) coronavirus infection which includes administering to a subject in need thereof one or more therapeutically effective doses of Virofree which comprises a pharmaceutically acceptable combination of grape seed extract, acerola cherry extract, olive leaf extract, marigold extract, green tea extract, pomegranate extract, yeast beta-glucan and soya bean extract for a treatment period.
    Type: Application
    Filed: September 11, 2023
    Publication date: April 4, 2024
    Applicant: GLOBAL PREVENTIVE MEDICINE BIOTECH COMPANY LIMITED
    Inventors: MEI-NAN TUAN, HIEN LY DOAN, ZI-YI HUANG, CHIA-YIN LEE, THUC ANH NGUYEN
  • Publication number: 20240095509
    Abstract: In one example, a neural network device comprises a first plurality of synapses configured to receive a first plurality of inputs and to generate therefrom a first plurality of outputs, wherein the first plurality of synapses comprises a plurality of memory cells, each of the plurality of memory cells configured to store a weight value corresponding to a number of electrons on its floating gate and the plurality of memory cells are configured to generate the first plurality of outputs based upon the first plurality of inputs and the stored weight values.
    Type: Application
    Filed: November 27, 2023
    Publication date: March 21, 2024
    Inventors: Hieu Van Tran, STANLEY HONG, ANH LY, THUAN VU, HIEN PHAM, KHA NGUYEN, HAN TRAN
  • Publication number: 20240095508
    Abstract: In one example, a system comprises a vector-by-matrix multiplication array comprising non-volatile memory cells organized into rows and columns; a plurality of word lines coupled respectively to rows of the vector-by-matrix multiplication array; and a word line driver coupled to the plurality of word lines, the word line driver comprising a plurality of select transistors coupled to a common control line and the plurality of word lines, and a plurality of bias transistors coupled to the plurality of select transistors and capable of providing a bias voltage to a single select transistor in the plurality of select transistors or to all of plurality of select transistors in response to control signals.
    Type: Application
    Filed: November 27, 2023
    Publication date: March 21, 2024
    Inventors: HIEU VAN TRAN, STANLEY HONG, AHN LY, THUAN VU, HIEN PHAM, KHA NGUYEN, HAN TRAN
  • Publication number: 20240008189
    Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.
    Type: Application
    Filed: September 18, 2023
    Publication date: January 4, 2024
    Applicant: Jabil Inc.
    Inventors: Wenlu Wang, Mark A. Tudman, Michael Piring Santos, Ross Kristensen Benz, Hien Ly, Gary Fang
  • Patent number: 11806380
    Abstract: Coronavirus Disease 2019 (COVID-19) remains a threat with the emergence of new variants, especially Delta and Omicron, without specific effective therapeutic drugs. The present invention provides a method and a composition for preventing and treating COVID-19 (SARS-CoV-2) coronavirus infection which includes administering to a subject in need thereof one or more therapeutically effective doses of Virofree which comprises a pharmaceutically acceptable combination of grape seed extract, acerola cherry extract, olive leaf extract, marigold extract, green tea extract, pomegranate extract, yeast beta-glucan and soya bean extract for a treatment period.
    Type: Grant
    Filed: June 7, 2022
    Date of Patent: November 7, 2023
    Assignee: GLOBAL PREVENTIVE MEDICINE BIOTECH COMPANY LIMITED
    Inventors: Mei-Nan Tuan, Hien Ly Doan, Zi-Yi Huang, Chia-Yin Lee, Thuc Anh Nguyen
  • Patent number: 11765837
    Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.
    Type: Grant
    Filed: October 19, 2021
    Date of Patent: September 19, 2023
    Assignee: Jabil Inc.
    Inventors: Wenlu Wang, Mark A. Tudman, Michael Piring Santos, Ross Kristensen Benz, Hien Ly, Gary Fang
  • Publication number: 20220387541
    Abstract: Coronavirus Disease 2019 (COVID-19) remains a threat with the emergence of new variants, especially Delta and Omicron, without specific effective therapeutic drugs. The present invention provides a method and a composition for preventing and treating COVID-19 (SARS-CoV-2) coronavirus infection which includes administering to a subject in need thereof one or more therapeutically effective doses of Virofree which comprises a pharmaceutically acceptable combination of grape seed extract, acerola cherry extract, olive leaf extract, marigold extract, green tea extract, pomegranate extract, yeast beta-glucan and soya bean extract for a treatment period.
    Type: Application
    Filed: June 7, 2022
    Publication date: December 8, 2022
    Applicant: GLOBAL PREVENTIVE MEDICINE BIOTECH COMPANY LIMITED
    Inventors: MEI-NAN TUAN, HIEN LY DOAN, ZI-YI HUANG, CHIA-YIN LEE, THUC ANH NGUYEN
  • Publication number: 20220095463
    Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.
    Type: Application
    Filed: October 19, 2021
    Publication date: March 24, 2022
    Applicant: Jabil Inc.
    Inventors: Wenlu Wang, Mark A. Tudman, Michael Piring Santos, Ross Kristensen Benz, Hien Ly, Gary Fang
  • Patent number: 11191169
    Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: November 30, 2021
    Assignee: Jabil Inc.
    Inventors: Wenlu Wang, Mark A. Tudman, Michael Piring Santos, Ross Kristensen Benz, Hien Ly, Gary Fang
  • Patent number: 11009561
    Abstract: A method of identifying opposing ends of a cable within a cabling assembly having a plurality of cables. The method includes transmitting a signal to a first end of a cable of the plurality of cables, receiving the signal at a second end of the cable of the plurality of cables, transmitting an output signal from a connector operably coupled to the second end of the cable of the plurality of cables to a processor. The connector is one of a plurality of connectors. The method additionally includes identifying using an indicator device the connector of the plurality of connectors that is operably coupled to the second end of the cable.
    Type: Grant
    Filed: March 21, 2019
    Date of Patent: May 18, 2021
    Assignee: JABIL INC.
    Inventors: Wieslaw Mariusz Januszko, Hien Ly, Jennifer Lindsey Gamboa, Vincy Wan Sze Li, Corey Matthew Smith
  • Publication number: 20210014977
    Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.
    Type: Application
    Filed: September 30, 2020
    Publication date: January 14, 2021
    Applicant: Jabil Inc.
    Inventors: Wenlu Wang, Mark A. Tudman, Michael Piring Santos, Ross Kristensen Benz, Hien Ly, Gary Fang
  • Patent number: 10813230
    Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.
    Type: Grant
    Filed: September 5, 2019
    Date of Patent: October 20, 2020
    Assignee: Jabil Inc.
    Inventors: Wenlu Wang, Mark A. Tudman, Michael Piring Santos, Ross Kristensen Benz, Hien Ly, Gary Fang
  • Publication number: 20200300904
    Abstract: A method of identifying opposing ends of a cable within a cabling assembly having a plurality of cables. The method includes transmitting a signal to a first end of a cable of the plurality of cables, receiving the signal at a second end of the cable of the plurality of cables, transmitting an output signal from a connector operably coupled to the second end of the cable of the plurality of cables to a processor. The connector is one of a plurality of connectors. The method additionally includes identifying using an indicator device the connector of the plurality of connectors that is operably coupled to the second end of the cable.
    Type: Application
    Filed: March 21, 2019
    Publication date: September 24, 2020
    Inventors: Wieslaw Mariusz Januszko, Hien Ly, Jennifer Lindsey Gamboa, Vincy Wan Sze Li, Corey Matthew Smith
  • Publication number: 20190394885
    Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.
    Type: Application
    Filed: September 5, 2019
    Publication date: December 26, 2019
    Applicant: Jabil Inc.
    Inventors: Wenlu Wang, Mark A. Tudman, Michael Piring Santos, Ross Kristensen Benz, Hien Ly, Gary Fang
  • Patent number: 10448517
    Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.
    Type: Grant
    Filed: November 4, 2016
    Date of Patent: October 15, 2019
    Assignee: Jabil Inc.
    Inventors: Wenlu Wang, Mark A. Tudman, Michael Piring Santos, Ross Kristensen Benz, Hien Ly, Gary Fang
  • Publication number: 20180132360
    Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.
    Type: Application
    Filed: November 4, 2016
    Publication date: May 10, 2018
    Applicant: Jabil Circuit, Inc.
    Inventors: Wenlu Wang, Mark A. Tudman, Michael Piring Santos, Ross Kristensen Benz, Hien Ly, Gary Fang
  • Patent number: 6790464
    Abstract: Methods and compositions are disclosed for prevention or treatment of prostate disorders and ameliorating symptoms thereof, including prostatitis, benign prostate hyperplasia and prostatic carcinoma.
    Type: Grant
    Filed: January 16, 2003
    Date of Patent: September 14, 2004
    Assignee: Healthaid Enterprise Pte. Ltd.
    Inventors: Koon Yong Kuok, Hien Ly
  • Publication number: 20040142001
    Abstract: Methods and compositions are disclosed for prevention or treatment of prostate disorders and ameliorating symptoms thereof, including prostatitis, benign prostate hyperplasia and prostatic carcinoma.
    Type: Application
    Filed: January 16, 2003
    Publication date: July 22, 2004
    Inventors: Koon Yong Kuok, Hien Ly