Patents by Inventor Hien Ly
Hien Ly has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12185476Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.Type: GrantFiled: September 18, 2023Date of Patent: December 31, 2024Assignee: Jabil Inc.Inventors: Wenlu Wang, Mark A. Tudman, Michael Piring Santos, Ross Kristensen Benz, Hien Ly, Gary Fang
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Patent number: 12150971Abstract: Coronavirus Disease 2019 (COVID-19) remains a threat with the emergence of new variants, especially Delta and Omicron, without specific effective therapeutic drugs. The present invention provides a method and a composition for preventing and treating COVID-19 (SARS-CoV-2) coronavirus infection which includes administering to a subject in need thereof one or more therapeutically effective doses of Virofree which comprises a pharmaceutically acceptable combination of grape seed extract, acerola cherry extract, olive leaf extract, marigold extract, green tea extract, pomegranate extract, yeast beta-glucan and soya bean extract for a treatment period.Type: GrantFiled: September 11, 2023Date of Patent: November 26, 2024Assignee: GLOBAL PREVENTIVE MEDICINE BIOTECH COMPANY LIMITEDInventors: Mei-Nan Tuan, Hien Ly Doan, Zi-Yi Huang, Chia-Yin Lee, Thuc Anh Nguyen
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Publication number: 20240108681Abstract: Coronavirus Disease 2019 (COVID-19) remains a threat with the emergence of new variants, especially Delta and Omicron, without specific effective therapeutic drugs. The present invention provides a method and a composition for preventing and treating COVID-19 (SARS-CoV-2) coronavirus infection which includes administering to a subject in need thereof one or more therapeutically effective doses of Virofree which comprises a pharmaceutically acceptable combination of grape seed extract, acerola cherry extract, olive leaf extract, marigold extract, green tea extract, pomegranate extract, yeast beta-glucan and soya bean extract for a treatment period.Type: ApplicationFiled: September 11, 2023Publication date: April 4, 2024Applicant: GLOBAL PREVENTIVE MEDICINE BIOTECH COMPANY LIMITEDInventors: MEI-NAN TUAN, HIEN LY DOAN, ZI-YI HUANG, CHIA-YIN LEE, THUC ANH NGUYEN
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Publication number: 20240008189Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.Type: ApplicationFiled: September 18, 2023Publication date: January 4, 2024Applicant: Jabil Inc.Inventors: Wenlu Wang, Mark A. Tudman, Michael Piring Santos, Ross Kristensen Benz, Hien Ly, Gary Fang
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Patent number: 11806380Abstract: Coronavirus Disease 2019 (COVID-19) remains a threat with the emergence of new variants, especially Delta and Omicron, without specific effective therapeutic drugs. The present invention provides a method and a composition for preventing and treating COVID-19 (SARS-CoV-2) coronavirus infection which includes administering to a subject in need thereof one or more therapeutically effective doses of Virofree which comprises a pharmaceutically acceptable combination of grape seed extract, acerola cherry extract, olive leaf extract, marigold extract, green tea extract, pomegranate extract, yeast beta-glucan and soya bean extract for a treatment period.Type: GrantFiled: June 7, 2022Date of Patent: November 7, 2023Assignee: GLOBAL PREVENTIVE MEDICINE BIOTECH COMPANY LIMITEDInventors: Mei-Nan Tuan, Hien Ly Doan, Zi-Yi Huang, Chia-Yin Lee, Thuc Anh Nguyen
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Patent number: 11765837Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.Type: GrantFiled: October 19, 2021Date of Patent: September 19, 2023Assignee: Jabil Inc.Inventors: Wenlu Wang, Mark A. Tudman, Michael Piring Santos, Ross Kristensen Benz, Hien Ly, Gary Fang
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Publication number: 20220387541Abstract: Coronavirus Disease 2019 (COVID-19) remains a threat with the emergence of new variants, especially Delta and Omicron, without specific effective therapeutic drugs. The present invention provides a method and a composition for preventing and treating COVID-19 (SARS-CoV-2) coronavirus infection which includes administering to a subject in need thereof one or more therapeutically effective doses of Virofree which comprises a pharmaceutically acceptable combination of grape seed extract, acerola cherry extract, olive leaf extract, marigold extract, green tea extract, pomegranate extract, yeast beta-glucan and soya bean extract for a treatment period.Type: ApplicationFiled: June 7, 2022Publication date: December 8, 2022Applicant: GLOBAL PREVENTIVE MEDICINE BIOTECH COMPANY LIMITEDInventors: MEI-NAN TUAN, HIEN LY DOAN, ZI-YI HUANG, CHIA-YIN LEE, THUC ANH NGUYEN
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Publication number: 20220095463Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.Type: ApplicationFiled: October 19, 2021Publication date: March 24, 2022Applicant: Jabil Inc.Inventors: Wenlu Wang, Mark A. Tudman, Michael Piring Santos, Ross Kristensen Benz, Hien Ly, Gary Fang
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Patent number: 11191169Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.Type: GrantFiled: September 30, 2020Date of Patent: November 30, 2021Assignee: Jabil Inc.Inventors: Wenlu Wang, Mark A. Tudman, Michael Piring Santos, Ross Kristensen Benz, Hien Ly, Gary Fang
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Patent number: 11009561Abstract: A method of identifying opposing ends of a cable within a cabling assembly having a plurality of cables. The method includes transmitting a signal to a first end of a cable of the plurality of cables, receiving the signal at a second end of the cable of the plurality of cables, transmitting an output signal from a connector operably coupled to the second end of the cable of the plurality of cables to a processor. The connector is one of a plurality of connectors. The method additionally includes identifying using an indicator device the connector of the plurality of connectors that is operably coupled to the second end of the cable.Type: GrantFiled: March 21, 2019Date of Patent: May 18, 2021Assignee: JABIL INC.Inventors: Wieslaw Mariusz Januszko, Hien Ly, Jennifer Lindsey Gamboa, Vincy Wan Sze Li, Corey Matthew Smith
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Publication number: 20210014977Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.Type: ApplicationFiled: September 30, 2020Publication date: January 14, 2021Applicant: Jabil Inc.Inventors: Wenlu Wang, Mark A. Tudman, Michael Piring Santos, Ross Kristensen Benz, Hien Ly, Gary Fang
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Patent number: 10813230Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.Type: GrantFiled: September 5, 2019Date of Patent: October 20, 2020Assignee: Jabil Inc.Inventors: Wenlu Wang, Mark A. Tudman, Michael Piring Santos, Ross Kristensen Benz, Hien Ly, Gary Fang
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Publication number: 20200300904Abstract: A method of identifying opposing ends of a cable within a cabling assembly having a plurality of cables. The method includes transmitting a signal to a first end of a cable of the plurality of cables, receiving the signal at a second end of the cable of the plurality of cables, transmitting an output signal from a connector operably coupled to the second end of the cable of the plurality of cables to a processor. The connector is one of a plurality of connectors. The method additionally includes identifying using an indicator device the connector of the plurality of connectors that is operably coupled to the second end of the cable.Type: ApplicationFiled: March 21, 2019Publication date: September 24, 2020Inventors: Wieslaw Mariusz Januszko, Hien Ly, Jennifer Lindsey Gamboa, Vincy Wan Sze Li, Corey Matthew Smith
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Publication number: 20190394885Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.Type: ApplicationFiled: September 5, 2019Publication date: December 26, 2019Applicant: Jabil Inc.Inventors: Wenlu Wang, Mark A. Tudman, Michael Piring Santos, Ross Kristensen Benz, Hien Ly, Gary Fang
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Patent number: 10448517Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.Type: GrantFiled: November 4, 2016Date of Patent: October 15, 2019Assignee: Jabil Inc.Inventors: Wenlu Wang, Mark A. Tudman, Michael Piring Santos, Ross Kristensen Benz, Hien Ly, Gary Fang
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Publication number: 20180132360Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.Type: ApplicationFiled: November 4, 2016Publication date: May 10, 2018Applicant: Jabil Circuit, Inc.Inventors: Wenlu Wang, Mark A. Tudman, Michael Piring Santos, Ross Kristensen Benz, Hien Ly, Gary Fang
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Patent number: 6790464Abstract: Methods and compositions are disclosed for prevention or treatment of prostate disorders and ameliorating symptoms thereof, including prostatitis, benign prostate hyperplasia and prostatic carcinoma.Type: GrantFiled: January 16, 2003Date of Patent: September 14, 2004Assignee: Healthaid Enterprise Pte. Ltd.Inventors: Koon Yong Kuok, Hien Ly
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Publication number: 20040142001Abstract: Methods and compositions are disclosed for prevention or treatment of prostate disorders and ameliorating symptoms thereof, including prostatitis, benign prostate hyperplasia and prostatic carcinoma.Type: ApplicationFiled: January 16, 2003Publication date: July 22, 2004Inventors: Koon Yong Kuok, Hien Ly