Abstract: Transparent conductors including a silver layer with high transparency and low sheet resistance are described. In some examples, the silver layer can be located between two transparent conductive oxide layers. The transparent conductor can further include additional transparent conductive oxide layers, optical layers, and/or additional conductive layers (e.g., layers including ITO or another fully or partially transparent conductive material), for example. In some examples, transparent conductors including a silver layer can be included in a touch screen device. For example, one or more shielding layers or one or more touch electrodes can include transparent conductors with a silver layer. In some examples, the silver layer can improve transparency, sheet resistance, and/or infrared reflection characteristics of the transparent conductor.

Abstract: The present invention generally comprises a top shield for shielding a shadow frame within a PVD chamber. The top shield may remain in a stationary position and at least partially shield the shadow frame to reduce the amount of material that may deposit on the shadow frame during processing. The top shield may be cooled to reduce the amount of fluxuation in temperature of the top shield and shadow frame during processing and/or during down time.

Abstract: The present invention generally comprises a top shield for shielding a shadow frame within a PVD chamber. The top shield may remain in a stationary position and at least partially shield the shadow frame to reduce the amount of material that may deposit on the shadow frame during processing. The top shield may be cooled to reduce the amount of fluxuation in temperature of the top shield and shadow frame during processing and/or during down time.

Abstract: A semiconductor assembly is described with a thin metal oxide layer interposed between a transparent conductive oxide and an amorphous silicon layer, along with methods for making this structure. The metal oxide layer has a refractive index or range of refractive indices intermediate between that of the transparent conductive oxide and the amorphous silicon layer, and thus tends to reduce reflection at the interface. Such a layer can be used at the light-facing surface of a light-sensitive device such as a photovoltaic cell to maximize the amount of incident light entering the cell. Titanium oxide is a suitable metal oxide, and has a refractive index between those of silicon and of both indium tin oxide and aluminum-doped zinc oxide, two common transparent conductive oxides.

Abstract: A physical vapor deposition target assembly is configured to isolate a target-bonding layer from a processing region. In one embodiment, the target assembly comprises a backing plate, a target having a first surface and a second surface, and a bonding layer disposed between the backing plate and the second surface. The first surface of the target is in fluid contact with a processing region and the second surface of the target is oriented toward the backing plate. The target assembly may include multiple targets.

Abstract: Embodiments of an apparatus and method of monitoring and controlling a large area substrate processing chamber are provided. Multiple types of metrology tools can be installed in the substrate processing system to measure film properties after substrate processing in a processing chamber. Several number of a particular type of metrology tools can also be installed in the substrate processing system to measure film properties after substrate processing in a processing chamber. The metrology tools can be installed in a metrology chamber, a process chamber, a transfer chamber, or a loadlock.

Abstract: A method for making a film stack containing one or more metal-containing layers and a substrate processing system for forming the film stack on a substrate are provided. The substrate processing system includes at least one transfer chamber coupled to at least one load lock chamber, at least one first physical vapor deposition (PVD) chamber configured to deposit a first material layer on a substrate, and at least one second PVD chamber for in-situ deposition of a second material layer over the first material layer within the same substrate processing system without breaking the vacuum or taking the substrate out of the substrate processing system to prevent surface contamination, oxidation, etc. The substrate processing system is configured to provide high throughput and compact footprint for in-situ sputtering of different material layers in designated PVD chambers.

Abstract: The present invention generally comprises a top shield for shielding a shadow frame within a PVD chamber. The top shield may remain in a stationary position and at least partially shield the shadow frame to reduce the amount of material that may deposit on the shadow frame during processing. The top shield may be cooled to reduce the amount of fluxuation in temperature of the top shield and shadow frame during processing and/or during down time.

Abstract: A method and apparatus for electrically coupling a plurality of target together is disclosed. Individually powered targets allow greater control over depositing during a sputtering process. By individually powering the targets, different power levels may be applied to different targets. The targets may additionally be coupled together with a resistor. The resistor allows the targets to have a more controlled power level.

Abstract: In certain embodiments, the invention comprises a backing plate for accommodating large area sputtering targets is disclosed. The backing plate assembly has cavities carved into the back surface of the backing plate. The backing plate may further include cooling channels that run through the backing plate to control the temperature of the backing plate and the target. The cavities may be filled with a material that has a lower density than the backing plate. Additionally, the entire back surface may be covered with the material to produce a smooth surface upon which a magnetron may move during a PVD process.

Abstract: A physical vapor deposition target assembly is configured to isolate a target-bonding layer from a processing region. In one embodiment, the target assembly comprises a backing plate, a target having a first surface and a second surface, and a bonding layer disposed between the backing plate and the second surface. The first surface of the target is in fluid contact with a processing region and the second surface of the target is oriented toward the backing plate. The target assembly may include multiple targets.

Abstract: An integrated gimbal suspension includes a flexure with an integrated, built-in gimbal, and includes a limiter structure that constrains motions of the gimbal in multi-degrees of freedom. The limiter structure includes one or more tab-shaped limiters and corresponding stops integrally formed into the gimbal assembly at strategic locations, which interact to provide the desired constraints to the motions of the flexure gimbal to prevent permanent damage from over-straining the gimbal or flexure beyond its designed range. The limiters may be pre-formed tab-shaped structures that are bent from the plane of the flexure. As the gimbal moves from its nominal position, one or more limiters engage the stops before such motion reaches the limit of the designed range of motion of the gimbal.

Abstract: An integrated suspension for a hard disk drive is formed as a single-piece flat assembly. The design eliminates the need for mechanical reinforcement such as flange forming, and requires no additional weld processing to form the functional portion of the assembly. A partial etch process is used to reduce local thicknesses in the gimbal and hinge areas to reduce the overall stiffness of the suspension. The proximal end structure of the suspension is also built by partial etching to achieve higher natural frequencies. The suspension design also incorporates built-in load/unload features and two-sided, opposite-facing limiters to limit excessive slider displacement during the manufacturing process, loading/unloading, and non-operational shock environments.

Abstract: An integrated gimbal suspension comprises a flexure with an integrated, built-in gimbal, and includes a limiter structure that constrains motions of the gimbal in multi-degrees of freedom. The limiter structure includes one or more tab-shaped limiters and corresponding stops integrally formed into the gimbal assembly at strategic locations, which interact to provide the desired constraints to the motions of the flexure gimbal to prevent permanent damage from overstraining the gimbal or flexure beyond its designed range. The limiters may be pre-formed tab-shaped structures that are bent from the plane of the flexure. As the gimbal moves from its nominal position, one or more limiters engage the stops before such motion reaches the limit of the designed range of motion of the gimbal.

Abstract: A suspension design for improving the curing process for head bonding application and a method for same is disclosed. Vias are formed in the load beam and the flexure so that UV light is allowed to pass to cure the UV sensitive adhesive thereby bonding the slider to the head gimbal assembly.

Abstract: A hard disk drive has actuator arms with a load beam or suspension extending from one end. Each suspension carries an integrated lead layer with electrical traces which are connected to a magnetic read/write heads for interacting with magnetic disks in the disk drive. Each suspension also has a pair of polymer pads on each side of the traces. Each pad has a series of bumps which give the pads a greater thickness than the lead layer for preventing contact between the traces, suspensions and magnetic disks during shock vibration. The pads also prevent contact between the trace conductors and the head separator during the separation process.