Abstract: Methods, and systems, are presented for a Structural Bridge for Electrically Isolated Metal Clips by mounting on a substrate a first and a second circuit. These first and second circuits can include Component on Package (CoP) electronic parts that are electrically contacted to the substrate with metal clips mounted on the surface of the substrate. The metal clips are electrically connected to respective circuit first and second circuits by an electrical connection on or in the substrate. The metal clips are folded over the respective first and second circuits. The folded-over portion of the first metal clip and the folded-over portion of the second metal clip are electrically isolated from each other. A third circuit package that is mounted on and electrically connected to a folded-over portion of the first metal clip and to a folded-over portion of the second metal clip.

Abstract: An electronic device is disclosed. The electronic device can include a molded integrated device package, where the molded integrated device package comprising a substrate, at least one electronic element mounted to the substrate, and a molding compound in which the electronic element is at least partially embedded, a slot formed through the molding compound. The integrated package can include a conductor comprising a horizontal section and a vertical section extending nonparallel from the horizontal section, the horizontal section having a lower side attached by an adhesive to an upper portion of the molding compound and the vertical section inserted into the slot and electrically connected to the substrate or to pads on the substrate by a conductive adhesive, such as solder.

Abstract: In one embodiment, an electronic assembly can include: a first electronic device package configured to be mounted on and electrically connected with a system substrate; a second electronic device package electrically connected to the system substrate; and an electrical pathway configured to extend from the system substrate through the first electronic device package and connected to an input terminal of the second electronic device package, the electrical pathway bypassing processing circuitry of the first electronic device package.

Abstract: In one embodiment, an electronic assembly can include: a first electronic device package configured to be mounted on and electrically connected with a system substrate; a second electronic device package electrically connected to the system substrate; and an electrical pathway configured to extend from the system substrate through the first electronic device package and connected to an input terminal of the second electronic device package, the electrical pathway bypassing processing circuitry of the first electronic device package.