Patents by Inventor Hienminh H. Le

Hienminh H. Le has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ADHESION BETWEEN AZO AND AG FOR THE BACK CONTACT IN TANDEM JUNCTION CELL BY METAL ALLOY
    Publication number: 20100224243
    Abstract: Methods of promoting adhesion between a reflective backing layer and a solar cell substrate are provided. The reflective backing layer is formed over a conductive metal oxide layer as an alloy using reflective and adhesive components, the adhesive components being present in levels generally below about 5 atomic percent. Techniques are disclosed for depositing varying the concentration of the reflective backing layer to localize the adhesive components in an adhesion region near the conductive metal oxide layer. Techniques are also disclosed for boosting bonding species in the conductive metal oxide layer to further enhance adhesion.
    Type: Application
    Filed: August 17, 2009
    Publication date: September 9, 2010
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Hienminh H. Le, David Tanner
  • ADHESION BETWEEN AZO AND AG FOR THE BACK CONTACT IN TANDEM JUNCTION CELL BY METAL ALLOY
    Publication number: 20100132775
    Abstract: Methods of promoting adhesion between a reflective backing layer and a solar cell substrate are provided. The reflective backing layer is formed over a conductive metal oxide layer as an alloy using reflective and adhesive components, the adhesive components being present in levels generally below about 5 atomic percent. Techniques are disclosed for depositing varying the concentration of the reflective backing layer to localize the adhesive components in an adhesion region near the conductive metal oxide layer. Techniques are also disclosed for boosting bonding species in the conductive metal oxide layer to further enhance adhesion.
    Type: Application
    Filed: March 5, 2009
    Publication date: June 3, 2010
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Hienminh H. Le, David Tanner
  • Elastomer bonding of large area sputtering target
    Patent number: 7550055
    Abstract: Embodiments of the present invention generally relate to sputtering targets used in semiconductor manufacturing. In particular, the invention relates to bonding the sputtering target to a backing plate that supports the sputtering target in a deposition chamber. In one embodiment, a method of bonding at least one sputtering target tile to a backing plate comprises providing an elastomeric adhesive layer between the at least one sputtering target tile and the backing plate, and providing at least one metal mesh within the elastomeric adhesive layer, wherein at least a portion of the at least one metal mesh contacts both the at least one sputtering target tile and the backing plate, and the at least a portion of the at least one metal mesh is made of metal wire with diameter greater than 0.5 mm.
    Type: Grant
    Filed: September 12, 2005
    Date of Patent: June 23, 2009
    Assignee: Applied Materials, Inc.
    Inventors: Hienminh H. Le, Akihiro Hosokawa