Patents by Inventor Hiep Le

Hiep Le has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method to increase system availability of critical hardware components
    Patent number: 7558192
    Abstract: One embodiment of the invention includes a system for overriding an operation of an electronic device. The system includes an override hardware logic that is communicatively coupled with a monitoring system. The monitoring system can output an electronic command signal in response to a detected point of failure associated with the system. In response to receiving the electronic command signal, the override hardware logic can override the operation performed by the electronic device in order to compensate for the detected point of failure.
    Type: Grant
    Filed: May 3, 2004
    Date of Patent: July 7, 2009
    Assignee: Cisco Technology, Inc.
    Inventors: Alex Van Truong, David Lai, Tien D. Tran, Hiep Le, Eugene Wang
  • Press-fit semiconductor package
    Patent number: 6160309
    Abstract: A press-fit package, such as a press-fit rectifier, includes an improved cup design which incorporates a mold lock formed within the inner wall of the cavity. a well is provided between the inner cavity wall and the die bond area to assist in mechanical decoupling of the press-fit force and the semiconductor die. An insert profile is formed along the outer surface of the cup to assist in proper alignment of the press-fit package during assembly, and a small lip is formed around the perimeter of the die bond area.
    Type: Grant
    Filed: March 25, 1999
    Date of Patent: December 12, 2000
    Inventor: Hiep Le