Patents by Inventor Hiep M. Le

Hiep M. Le has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of passivating a semiconductor substrate
    Patent number: 5908316
    Abstract: A method of passivating a semiconductor substrate includes singulating (13) a semiconductor substrate (23) from a semiconductor wafer, coupling (14) a heatsink (21) to the semiconductor substrate (23), etching (15) the semiconductor substrate (23) in a chamber of an etch tool, and passivating (17) the semiconductor substrate (23) with an oxide layer (31). The semiconductor substrate (23) is kept in the chamber of the etch tool from the etching (15) step through the passivating (17) step. The etching (15) of the semiconductor substrate (23) does not substantially etch the heatsink (21), and the passivating (17) of the semiconductor substrate (23) does not substantially passivate the heatsink (21).
    Type: Grant
    Filed: December 18, 1995
    Date of Patent: June 1, 1999
    Assignee: Motorola, Inc.
    Inventors: Hiep M. Le, Lonne L. Mays, Albert E. Tavares
  • Semiconductor diode device with non-planar heatsink and method of manufacture
    Patent number: 5751061
    Abstract: A semiconductor diode device (10) includes two heatsinks (11, 12), a semiconductor substrate (15) having a p-n junction (35) and located between the two heatsinks (11, 12), solder (13, 14) between the heatsinks (11, 12) and the semiconductor substrate (15), and a packaging material (16) covering the semiconductor substrate (15), the solder (13, 14), and a portion of the two heatsinks (11, 12). The two heatsinks (11, 12) each have a curved surface (21, 22), which reduces tilting of the semiconductor substrate (15), reduces temperature gradients across surfaces (23, 24) of the semiconductor substrate (15), and improves the reliability of the semiconductor diode device (10). The two heatsinks (11, 12) also include protrusions (19, 20), which help to keep the packaging material (16) covering the curved surfaces (21, 22) of the heatsinks (11, 12).
    Type: Grant
    Filed: December 18, 1995
    Date of Patent: May 12, 1998
    Assignee: Motorola, Inc.
    Inventors: Lonne L. Mays, Jean-Baptiste Martin, Hiep M. Le, James G. Lippmann
  • Rectifier and method
    Patent number: 5005069
    Abstract: A rectifier (60) is formedf by soldering a diode chip (66) in a cavity (64) in a metal base (62) having a metal sidewall (69), soldering the head (72) of an axial lead (70) to the chip (66), and filling the cavity (64) with an encapsulation (88). An outward leaning partition (80) is provided in the cavity (64) around and at about the same elevation as the chip (66). The encapsulation (88) covers the lead head (72) and the partition (80), and fills the space between the partition (80) and the base sidewall (69). This locks all the parts together, giving improved reliability and lead stiffnes at low cost.
    Type: Grant
    Filed: April 30, 1990
    Date of Patent: April 2, 1991
    Assignee: Motorola Inc.
    Inventors: William D. Wasmer, Peter J. Gillespie, James G. Lippmann, Hiep M. Le