Patents by Inventor Hiep X. Nguyen

Hiep X. Nguyen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9040117
    Abstract: An adhesion promotion process and composition for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. The composition contains a corrosion inhibitor, an inorganic acid, and an alcohol which is effective to increase copper-loading in the composition.
    Type: Grant
    Filed: March 27, 2012
    Date of Patent: May 26, 2015
    Assignee: Enthone Inc.
    Inventors: Abayomi I. Owei, Hiep X. Nguyen, Eric Yakobson
  • Publication number: 20130078367
    Abstract: An adhesion promotion process and composition for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. The composition contains a corrosion inhibitor, an inorganic acid, and an alcohol which is effective to increase copper-loading in the composition.
    Type: Application
    Filed: March 27, 2012
    Publication date: March 28, 2013
    Applicant: ENTHONE INC.
    Inventors: Abayomi I. Owei, Hiep X. Nguyen, Eric Yakobson
  • Patent number: 8142840
    Abstract: An adhesion promotion process and composition for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. The composition contains a corrosion inhibitor, an inorganic acid, and an alcohol which is effective to increase copper-loading in the composition.
    Type: Grant
    Filed: June 7, 2007
    Date of Patent: March 27, 2012
    Assignee: Enthone Inc.
    Inventors: Abayomi I. Owei, Hiep X. Nguyen, Eric Yakobson
  • Patent number: 7682432
    Abstract: An adhesion promotion process and composition for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. The composition contains a corrosion inhibitor, an inorganic acid, and an alcohol which is effective to increase copper-loading in the composition.
    Type: Grant
    Filed: June 7, 2007
    Date of Patent: March 23, 2010
    Assignee: Enthone Inc.
    Inventors: Abayomi I. Owei, Hiep X. Nguyen, Eric Yakobson
  • Patent number: 7232478
    Abstract: An adhesion promotion process and composition for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. The composition contains a corrosion inhibitor, an inorganic acid, and an alcohol which is effective to increase copper-loading in the composition.
    Type: Grant
    Filed: July 14, 2003
    Date of Patent: June 19, 2007
    Assignee: Enthone Inc.
    Inventors: Abayomi I. Owei, Hiep X. Nguyen, Eric Yakobson
  • Patent number: 7106273
    Abstract: There is disclosed an apparatus for mounting antennas on a utility pole. The apparatus comprises a group of brackets that encircle the utility pole and support the antennas. Each bracket comprises at least one support arm capable of attaching to an antenna and a faceplate that presses against the surface of the utility pole. The apparatus also includes tightening or closure means, such as nut and bolt assemblies, that connect the brackets together. When tightened, the tightening means draw the brackets encircling the utility pole closer together, thereby pressing the faceplates of each bracket more firmly against the utility pole. This clamps the apparatus tightly in place at selected points on the utility pole.
    Type: Grant
    Filed: December 21, 1998
    Date of Patent: September 12, 2006
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: James S. Brunson, Hiep X. Nguyen
  • Patent number: 6594148
    Abstract: A high efficiency multi-directional airflow system for a telecommunications equipment assembly used for housing electronic apparatuses which facilitate telecommunications functionality. The equipment assembly defines an internal cavity which can be divided into a plurality of air flow channels. Each of the plurality of air flow channels captures a sub-portion of the overall volume provided by the internal cavity. The smaller volume flow channels provide a smaller cross-sectional area through which the majority of air travels. Since the cross-sectional area is smaller, the velocity of the air through the flow channels is increased. Since the air velocity is increased, the heat transfer coefficient is also increased, thus allowing for the more efficient removal of heat from the electronic apparatuses. A set of fan trays can include a plurality of fans each directionally positioned to work in series to cause air to flow through the plurality of flow channels.
    Type: Grant
    Filed: January 16, 2002
    Date of Patent: July 15, 2003
    Assignee: Cisco Technology, Inc.
    Inventors: Hiep X. Nguyen, Maurice M. Guy, Osvaldo Garcia