Abstract: A display panel includes a plurality of first unit pixels (Pix) each including: a first data input terminals (PDIN); a first data output terminal (PDOUT); a display element (48); and a first waveform shaping section (42, 22), in which the display element (48) is configured to perform display based on first data (PD) inputted to the first data input terminal (PDIN), and the first waveform shaping section (42, 44) is provided on a signal path from the first data input terminal (PDIN) to the first data output terminal (PDOUT).

Abstract: An optical fiber and lens substrate assembly includes: an optical fiber component including an optical fiber core wire, and an end-surface-fixing resin block in which the optical fiber core wire is embedded, and cross section of an optical fiber element wire and a secondary coating that constitute the optical fiber core wire are exposed to a smooth surface thereof; and a lens substrate attached to the smooth surface of the end-surface-fixing resin block.

Abstract: An image pickup panel (1) includes: photodetection sections (10) each including a photodetector (11-1) and a receiver (11-2) which are integrally molded and having solder bumps (12) formed thereon, the photodetector converting received light into a current signal, the. receiver converting the current signal into a voltage signal; and a wiring layer (20) including a wiring pattern installed therein and allowing the photodetection sections to be mounted thereon for respective pixels by the solder bumps, the wiring pattern being connected to the photodetection sections.

Abstract: A light emitting device-light receiving device assembly includes: a mount substrate having first and second surfaces, and including a first base as a raised portion on the first surface; a light receiving device having first and second surfaces, the first surface of the light receiving device being anchored on the first base; and a light emitting device, the light receiving device including a light passage portion allowing for passage of light emitted by the light emitting device, the light emitted by the light emitting device emerging to outside through the light passage portion, the first base, and the mount substrate, the light receiving device receiving externally incident light through the mount substrate and the first base, the light receiving device including an annular second base as a raised portion on the second surface of the light receiving device, and the light emitting device being anchored on the second base.

Abstract: An optical communication device, reception apparatus, transmission apparatus and transmission and reception system are disclosed. The optical communication device includes a drive circuit substrate. A first through via extends through the drive circuit substrate and is configured to electrically connect an optical element disposed on a first surface side of the drive circuit substrate to a drive circuit disposed on a second surface side of the drive circuit substrate. A positioning element is attached to an interposer substrate and is configured to align optical axes of a first lens that is attached to a lens substrate and that faces a second lens that is disposed on the first surface side of the drive circuit substrate. A second through via extends through the interposer substrate and electrically connects the drive circuit to a signal processing circuit disposed on a signal processing substrate positioned above the interposer substrate.

Abstract: There is provided an optical communication device including a lens substrate configured to have a first face on which a plurality of lenses corresponding to a plurality of channels of optical communication are two-dimensionally formed, and a ferrule configured to be disposed facing a second face that is the opposite face of the first face of the lens substrate and to be provided with through holes into which optical fibers are inserted in positions corresponding to each of the plurality of lenses.

Abstract: A connector includes: an electric transmission section; an optical transmission section; and a partition section provided between the electric transmission section and the optical transmission section.

Abstract: An optical transmission module includes: a main substrate having a front surface and a back surface; an optical connector having a connector substrate; a first transparent substrate disposed between the connector substrate and the main substrate; a heat source element disposed between the connector substrate and the back surface of the main substrate, and electrically connected to the main substrate; one or a plurality of wirings electrically connecting the heat source element to the main substrate, and each configured to transfer heat generated from the heat source element and the first transparent substrate, to the main substrate; a first special region preventing the heat generated from the heat source element and the first transparent substrate, from being transferred to the connector substrate; and a second special region providing a function of transferring the heat generated from the heat source element and the first transparent substrate.

Abstract: A semiconductor device includes a base substrate on which a substrate electrode is arranged, and a semiconductor element which includes a chip electrode electrically connected via solder to the substrate electrode and in which a light absorbing layer is formed on a lower surface side.

Abstract: A semiconductor device includes a first semiconductor electronic component which includes a pad electrode, a solder bump, and a metal layer between a pad and solder that is configured to have an underlying metal layer formed between the pad electrode and the solder bump and connected to the pad electrode, and a main metal layer formed on the underlying metal layer, and in which the main metal layer has an eave portion at an outer edge portion thereof.

Abstract: A method of manufacturing a mounting substrate, the method includes: transferring part or all of a plurality of devices on a device substrate onto a wiring substrate, and temporarily fixing the transferred devices to the wiring substrate with use of a fixing layer having viscosity, the device substrate including a support substrate and the plurality of devices fixed on the support substrate; and performing a reflow process on the wiring substrate to electrically connect the transferred devices with the wiring substrate, and thereby forming the mounting substrate.

Abstract: An image pickup panel (1) includes: photodetection sections (10) each including a photodetector (11-1) and a receiver (11-2) which are integrally molded and having solder bumps (12) formed thereon, the photodetector converting received light into a current signal, the. receiver converting the current signal into a voltage signal; and a wiring layer (20) including a wiring pattern installed therein and allowing the photodetection sections to be mounted thereon for respective pixels by the solder bumps, the wiring pattern being connected to the photodetection sections.

Abstract: A method for mounting a second member on a first member, wherein a pad layer is provided on the first member, and wherein an annular aperture portion exposing the first member to the bottom and having at least one discontinuous portion is provided in a region of the pad layer for mounting the second member having a mount face, the annular aperture portion having the same outer shape as the mount face of the second member is disclosed. The method includes: filling the aperture portion with a solder paste layer; and disposing the mount face of the second member on the solder paste layer, and melting and cooling the solder paste layer to mount the second member on the first member.

Abstract: A semiconductor laser device that enables flip-chip assembly by having an embedding section around a mesa section, and that has an improved emission lifetime, as well as a photoelectric converter and an optical information processing unit each having such a semiconductor laser device. The semiconductor laser device includes: a mesa section including an active layer, and having a first electrode on a top surface; an embedding section covering the mesa section, and having a first connection aperture that reaches the first electrode; and a first wiring provided on the embedding section overlaying the first connection aperture, the first wiring being electrically connected to the first electrode through the first connection aperture.

Abstract: There are provided a pixel chip capable of preventing false lighting of a light emitting device, a display panel including the pixel chip as a pixel, a lighting panel including the pixel chip as a pixel, a display unit including the display panel, and a lighting unit including the lighting panel. The pixel chip includes: one or a plurality of light emitting devices; a driver IC driving the light emitting devices; a connection section that is arranged between the light emitting devices and the driver IC, and electrically connects the light emitting devices to the driver IC; and a light shielding section that is arranged between the light emitting devices and the driver IC, and blocks direct entrance of light emitted from each of the light emitting devices into the driver IC together with the connection section.

Abstract: A method for mounting a second member on a first member, wherein a pad layer is provided on the first member, and wherein an annular aperture portion exposing the first member to the bottom and having at least one discontinuous portion is provided in a region of the pad layer for mounting the second member having a mount face, the annular aperture portion having the same outer shape as the mount face of the second member is disclosed. The method includes: filling the aperture portion with a solder paste layer; and disposing the mount face of the second member on the solder paste layer, and melting and cooling the solder paste layer to mount the second member on the first member.

Abstract: There is provided a semiconductor laser device that enables flip-chip assembly by providing an embedding section around a mesa section, and has an improved emission lifetime. There is also provided a photoelectric converter and an optical information processing unit each having the semiconductor laser device. The semiconductor laser device includes: a mesa section including an active layer, and having a first electrode on a top surface; an embedding section covering the mesa section, and having a first connection aperture that reaches the first electrode; and a first wiring provided on the embedding section to be laid across the first connection aperture, the first wiring being electrically connected to the first electrode through the first connection aperture.

Abstract: A connector includes: a fiber attachment path in which at least a part thereof has a height less than an outer diameter of an optical fiber; and a light-direction changing section provided at an end of the fiber attachment path.

Abstract: There is provided a semiconductor laser device that enables flip-chip assembly by providing an embedding section around a mesa section, and has an improved emission lifetime. There is also provided a photoelectric converter and an optical information processing unit each having the semiconductor laser device. The semiconductor laser device includes: a mesa section including an active layer, and having a first electrode on a top surface; an embedding section covering the mesa section, and having a first connection aperture that reaches the first electrode; and a first wiring provided on the embedding section to be laid across the first connection aperture, the first wiring being electrically connected to the first electrode through the first connection aperture.

Abstract: There are provided a pixel chip capable of preventing false lighting of a light emitting device, a display panel including the pixel chip as a pixel, a lighting panel including the pixel chip as a pixel, a display unit including the display panel, and a lighting unit including the lighting panel. The pixel chip includes: one or a plurality of light emitting devices; a driver IC driving the light emitting devices; a connection section that is arranged between the light emitting devices and the driver IC, and electrically connects the light emitting devices to the driver IC; and a light shielding section that is arranged between the light emitting devices and the driver IC, and blocks direct entrance of light emitted from each of the light emitting devices into the driver IC together with the connection section.