Patents by Inventor Hijiri Hayashi
Hijiri Hayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220320034Abstract: This mounting apparatus is provided with: a plurality of bonding stations each comprising a bonding apparatus for bonding a semiconductor chip onto a substrate wafer, and a chip supply apparatus for supplying the semiconductor chip to the bonding apparatus; and a single wafer transfer apparatus which transfers the substrate wafer in order to supply the substrate wafer to each of the plurality of bonding stations and to collect the substrate wafer from each of the plurality of bonding stations.Type: ApplicationFiled: July 15, 2020Publication date: October 6, 2022Applicant: SHINKAWA LTD.Inventors: Hijiri HAYASHI, Tetsuya UTANO, Kohei SEYAMA
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Patent number: 11302666Abstract: A mounting apparatus is equipped with: an attachment including a surface for attaching a semiconductor die; a heater which is disposed on a side of the attachment opposite to the surface and heats the semiconductor die attached to the surface; a suction hole which penetrates through the attachment and the heater integrally and opens in the surface; and a body portion which is disposed on a side of the heater opposite to the attachment and on which a vacuum suction path in communication with the suction hole is arranged. The vacuum suction path includes a storage portion which stores a foreign matter consisting of a liquid formed by condensation of a gas suctioned from the suction hole or a solid formed by solidification of the liquid.Type: GrantFiled: November 17, 2017Date of Patent: April 12, 2022Assignee: SHINKAWA LTD.Inventors: Manato Nishide, Kohei Seyama, Hijiri Hayashi
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Publication number: 20200051947Abstract: A mounting apparatus is equipped with: an attachment including a surface for attaching a semiconductor die; a heater which is disposed on a side of the attachment opposite to the surface and heats the semiconductor die attached to the surface; a suction hole which penetrates through the attachment and the heater integrally and opens in the surface; and a body portion which is disposed on a side of the heater opposite to the attachment and on which a vacuum suction path in communication with the suction hole is arranged. The vacuum suction path includes a storage portion which stores a foreign matter consisting of a liquid formed by condensation of a gas suctioned from the suction hole or a solid formed by solidification of the liquid.Type: ApplicationFiled: November 17, 2017Publication date: February 13, 2020Applicant: SHINKAWA LTD.Inventors: Manato NISHIDE, Kohei SEYAMA, Hijiri HAYASHI
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Patent number: 6362014Abstract: Instead of using the ordinary pulse train command inputted from a computer to the control circuit, an offset signal outputted from an offset compensation circuit is employed for performing scrubbing of a bonding surface of, for instance, a semiconductor device. The offset compensation circuit controls a DC motor in drive amounts smaller than the resolution of the DC motor which moves an XY table having a bonding tool which performs the scrubbing, and the drive amounts smaller than the resolution outputted from the offset compensation circuit are controlled by a computer.Type: GrantFiled: October 13, 2000Date of Patent: March 26, 2002Assignee: Kabushiki Kaisha ShinkawaInventors: Kuniyuki Takahashi, Hijiri Hayashi
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Patent number: 6302312Abstract: Instead of using the ordinary pulse train command inputted from a computer to the control circuit, an offset signal outputted from an offset compensation circuit is employed for performing scrubbing of a bonding surface of, for instance, a semiconductor device. The offset compensation circuit controls a DC motor in drive amounts smaller than the resolution of the DC motor which moves an XY table having a bonding tool which performs the scrubbing, and the drive amounts smaller than the resolution outputted from the offset compensation circuit are controlled by a computer.Type: GrantFiled: May 27, 1999Date of Patent: October 16, 2001Assignee: Kabushiki Kaisha ShinkawaInventors: Kuniyuki Takahashi, Hijiri Hayashi
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Patent number: 6206266Abstract: In a bonding method and apparatus, a bonding arm having a bonding tool at one end thereof is controlled to stop at a constant height position by a computer that incudes a memory containing positional deviation correction values which correct deviations at stopping positions of the bonding arm so that a bonding arm position controller is controlled by the positional deviation correction values.Type: GrantFiled: October 1, 1998Date of Patent: March 27, 2001Assignee: Kabushiki Kaisha ShinkawaInventors: Kuniyuki Takahashi, Hijiri Hayashi
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Patent number: 6119917Abstract: A bonding apparatus for manufacturing, for instance, a semiconductor device including a computer system which calculates a limit value of a driving current that flows to a linear motor controlling a bonding arm, and the computer system including a memory which stores correction current values that are used to correct the driving force of a plate spring at various height positions of the bonding arm, and limit values of the driving current according to a bonding load.Type: GrantFiled: April 2, 1998Date of Patent: September 19, 2000Assignee: Kabushiki Kaisha ShinkawaInventors: Kuniyuki Takahashi, Hijiri Hayashi
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Patent number: 6119914Abstract: A wire bonding method and apparatus using a computer that has a memory which stores correction values that correct positional discrepancies in the height position of a bonding arm and limit values that limit an electric power not only in a state in which no load is applied but also in a state in which a weight is mounted on a supporting frame so that a load equal to a bonding load is applied to a linear motor that raises and lowers the bonding arm.Type: GrantFiled: June 30, 1999Date of Patent: September 19, 2000Assignee: Kabushiki Kaisha ShinkawaInventors: Kuniyuki Takahashi, Hijiri Hayashi
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Patent number: 6095396Abstract: A wire bonding method and apparatus using a computer that has a memory which stores correction values that correct positional discrepancies in the height position of a bonding arm and limit values that limit an electric power not only in a state in which no load is applied but also in a state in which a weight is mounted on a supporting frame so that a load equal to a bonding load is applied to a linear motor that raises and lowers the bonding arm.Type: GrantFiled: May 6, 1998Date of Patent: August 1, 2000Assignee: Kabushiki Kaisha ShinkawaInventors: Kuniyuki Takahashi, Hijiri Hayashi
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Patent number: 6070778Abstract: In a bonding method and apparatus, a bonding arm having a bonding tool at one end thereof is controlled to stop at a constant height position by a computer that incudes a memory containing positional deviation correction values which correct deviations at stopping positions of the bonding arm so that a bonding arm position controller is controlled by the positional deviation correction values.Type: GrantFiled: May 14, 1998Date of Patent: June 6, 2000Assignee: Kabushiki Kaisha ShinkawaInventors: Kuniyuki Takahashi, Hijiri Hayashi
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Patent number: 5949208Abstract: A circuit and method for controlling a rotating or oscillating element of a DC motor, including a positional deviation correction signal generator in addition to a position sensor which detects an amount of rotation or oscillation and position of the rotating or oscillating element, a main control circuit that includes a DC motor driving circuit, and a computer which controls the main control circuit. The output signal of the positional deviation correction signal generator is controlled by the computer based upon positional deviation correction information and signals from the position sensor, so that the positional deviation correction signal generator compensates for any positional deviation of the rotating or oscillating element of the DC motor at a stopping position thereof.Type: GrantFiled: March 24, 1998Date of Patent: September 7, 1999Assignee: Kabushiki Kaisha ShinkawaInventors: Kuniyuki Takahashi, Hijiri Hayashi
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Patent number: 5485063Abstract: A motor control circuit for a wire bonding apparatus for manufacturing semiconductor devices, etc. using a feedback gain circuit which performs feedback control of a synthesized signal that drives a Z-axis motor for moving a capillary up and down. The gain value of the feedback gain circuit is controlled by a computer, thus allowing smooth and stable control of the motor operation even after rotational speed change of the Z-axis motor, and assuring a stable wire bonding.Type: GrantFiled: July 30, 1993Date of Patent: January 16, 1996Assignee: Kabushiki Kaisha ShinkawaInventors: Tooru Mochida, Yoshimitsu Terakado, Hijiri Hayashi
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Patent number: 5046654Abstract: An ultrasonic wire bonding apparatus including a ultrasonic oscillation control circuit which causes a transducer having a bonding tool fastened at one end to be vibrated by ultrasonic oscillation voltage. The control circuit includes an electric current amplifier connected to the transducer, an A/D converter to which an electric current amplified by an electric current amplifier is supplied so as to be converted into digital signal which is supplied to a microcomputer, an ultrasonic oscillating circuit, and an output control circuit to which ultrasonic oscillation voltage is supplied from the ultrasonic oscillating circuit. The output control circuit controls the ultrasonic oscillating voltage by comparing it to the ultrasonic oscillating output data supplied from the computer and supplies the thus controlled voltage to the transducer through a power amplifier so as to vibrate the transducer.Type: GrantFiled: October 25, 1989Date of Patent: September 10, 1991Assignee: Kabushiki Kaisha ShinkawaInventors: Nobuto Yamazaki, Yoshimitsu Terakado, Yuji Ohashi, Hijiri Hayashi
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Patent number: 5016803Abstract: A wire bonding apparatus in which an air guide blows air against a bonding wire so that tension is applied to the bonding wire between a wire spool and a bonding tool so that the bonding wire comes in contact with a wire-contact. An optical sensor is provided near the wire-contact so that the sensor is prevented from contacting the bonding wire. Thus, the presence of the bonding wire is detected by the optical sensor which senses when the bonding wire is in contact with the wire-contact.Type: GrantFiled: October 31, 1989Date of Patent: May 21, 1991Assignee: Kabushiki Kaisha ShinkawaInventors: Yuji Ohashi, Yoshimitsu Terakado, Hijiri Hayashi