Patents by Inventor Hikaru HAYASHIDA

Hikaru HAYASHIDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SILVER POWDER AND METHOD OF PRODUCING SAME
    Publication number: 20240227002
    Abstract: Provided are a silver powder having powder physical properties enabling reduction of volume resistivity after firing and a method of producing this silver powder. The silver powder has a tap density of 4.8 g/mL or more, a TAP/D50 value (value determined by dividing the tap density (g/mL) by the volume-based median diameter (?m)) of not less than 7 and not more than 15, and a specific surface area of not less than 0.75 m2/g and not more than 1.3 m2/g.
    Type: Application
    Filed: March 2, 2022
    Publication date: July 11, 2024
    Applicant: DOWA Electronics Materials Co., Ltd.
    Inventors: Kaori TOKUSADA, Hikaru HAYASHIDA
  • SILVER POWDER AND METHOD OF PRODUCING SAME
    Publication number: 20240131580
    Abstract: Provided are a silver powder having powder physical properties enabling reduction of volume resistivity after firing and a method of producing this silver powder. The silver powder has a tap density of 4.8 g/mL or more, a TAP/D50 value (value determined by dividing the tap density (g/mL) by the volume-based median diameter (?m)) of not less than 7 and not more than 15, and a specific surface area of not less than 0.75 m2/g and not more than 1.3 m2/g.
    Type: Application
    Filed: March 2, 2022
    Publication date: April 25, 2024
    Applicant: DOWA Electronics Materials Co., Ltd.
    Inventors: Kaori TOKUSADA, Hikaru HAYASHIDA