Patents by Inventor Hikaru Ikeda
Hikaru Ikeda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220316591Abstract: A shift mechanism of an outboard motor has an electric actuator having a movable rod, and a guide structure for guiding a linear motion of a sliding body connected to the movable rod. In addition, the shift mechanism includes a link rod connected to the sliding body and bent to extend in a direction different from the direction of the linear motion of the sliding body. Furthermore, the shift mechanism includes a shift shaft part which is connected to the link rod, performs a rotational motion on the basis of a displacement of the link rod, and switches a range of a transmission mechanism provided below on the basis of the rotational motion.Type: ApplicationFiled: June 7, 2019Publication date: October 6, 2022Inventors: Makoto Yazaki, Toru Kimura, Naoki Aikawa, Tsuyoshi Harada, Yasukata Kohashi, Hikaru Ikeda
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Patent number: 10912164Abstract: A heating device for an exhaust catalyst includes a first antenna and a second antenna. The heating device executes a specific radiation control for controlling operation of an electromagnetic wave generator to set a radiation state of an electromagnetic wave from the first antenna to be a different state from a radiation state of an electromagnetic wave from the second antenna. In such a case, the heating device acquires an intensity of an electromagnetic wave, of electromagnetic waves incident on the first antenna, and acquires an intensity of an electromagnetic wave, of electromagnetic waves incident on the second antenna. The heating device acquires a first temperature-correlated value for the first part based on the first electromagnetic wave intensity, and acquires a second temperature-correlated value for the second part based on the second electromagnetic wave intensity.Type: GrantFiled: March 22, 2018Date of Patent: February 2, 2021Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Hiroshi Otsuki, Norio Inami, Shinji Ikeda, Hikaru Ikeda
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Patent number: 10800699Abstract: Provided is a glass for radiation detection having high fluorescence detection sensitivity and high weather resistance. A glass for radiation detection, comprising, in mol %, 0.1 to 30% of SiO2+B2O3, 0 to 20% of SiO2, 0 to 10% of B2O3, 40 to 70% of P2O5, 10 to 30% of Al2O3, 10 to 30% of Na2O, and 0.01 to 2% of Ag2O.Type: GrantFiled: January 30, 2018Date of Patent: October 13, 2020Assignee: NIPPON ELECTRIC GLASS CO., LTD.Inventors: Hikaru Ikeda, Masaru Iwao, Shingo Nakane, Yoshihisa Takayama, Yoshinori Yamazaki
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Publication number: 20200053843Abstract: A heating device for an exhaust catalyst includes a first antenna and a second antenna. The heating device executes a specific radiation control for controlling operation of an electromagnetic wave generator to set a radiation state of an electromagnetic wave from the first antenna to be a different state from a radiation state of an electromagnetic wave from the second antenna. In such a case, the heating device acquires an intensity of an electromagnetic wave, of electromagnetic waves incident on the first antenna, and acquires an intensity of an electromagnetic wave, of electromagnetic waves incident on the second antenna. The heating device acquires a first temperature-correlated value for the first part based on the first electromagnetic wave intensity, and acquires a second temperature-correlated value for the second part based on the second electromagnetic wave intensity.Type: ApplicationFiled: March 22, 2018Publication date: February 13, 2020Inventors: Hiroshi OTSUKI, Norio INAMI, Shinji Dwayne IKEDA, Hikaru IKEDA
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Publication number: 20190381455Abstract: The catalyst heating device includes: an irradiation unit; and a control unit. The irradiation unit includes an antenna and is configured to radiate a microwave through the antenna to a catalyst device which has microwave absorbability and is configured to purify gas, to heat the catalyst device. The control unit has a function of allowing the irradiation unit to make irradiation with the microwave under an irradiation condition including at least any of a frequency of the microwave and a position of the antenna, and has a function of changing the irradiation condition.Type: ApplicationFiled: January 10, 2018Publication date: December 19, 2019Applicants: PANASONIC CORPORATION, TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Hikaru IKEDA, Hiroshi OTSUKI, Shinji IKEDA, Norio INAMI
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Publication number: 20190367406Abstract: Provided is a glass for radiation detection having high fluorescence detection sensitivity and high weather resistance. A glass for radiation detection, comprising, in mol %, 0.1 to 30% of SiO2+B2O3, 0 to 20% of SiO2, 0 to 10% of B2O3, 40 to 70% of P2O5, 10 to 30% of Al2O3, 10 to 30% of Na2O, and 0.01 to 2% of Ag2O.Type: ApplicationFiled: January 30, 2018Publication date: December 5, 2019Inventors: Hikaru IKEDA, Masaru IWAO, Shingo NAKANE, Yoshihisa TAKAYAMA, Yoshinori YAMAZAKI
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Publication number: 20180093524Abstract: A mechanical pencil includes a main body in which a mechanism for discharging a pencil lead is located, and a clip attached to the main body wherein the clip includes a container for storing a refill for a pencil lead.Type: ApplicationFiled: December 7, 2017Publication date: April 5, 2018Inventors: Ryo SHIRANE, Eiko TANAKA, Ryo KAWAMURA, Masako OKUYAMA, Rei TAKAHASHI, Honami YAMAZAKI, Koyo USHIKI, Hikaru IKEDA
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Publication number: 20160071777Abstract: A semiconductor package or a semiconductor device includes a heat sink onto which a semiconductor or a matching circuit is to be placed, a lead terminal which is to be electrically-connected to the semiconductor or the matching circuit on the heat sink, and a securing member which secures the lead terminal to the heat sink, wherein the securing member is formed by a composite resin material in which a resin and a ceramic powder are mixed.Type: ApplicationFiled: March 13, 2014Publication date: March 10, 2016Inventors: Kazuhiro YAHATA, Takashi UNO, Hikaru IKEDA
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Patent number: 9252090Abstract: A resin package includes: a die pad having a main surface on which a semiconductor substrate and a matching circuit substrate is mounted; at least one lead terminal electrically connected to the semiconductor substrate and the matching circuit substrate; a thin plate fixed to at least one of the main surface of the die pad and a main surface of the at least one lead terminal; and molding resin which covers the semiconductor substrate, the matching circuit substrate, and the thin plate.Type: GrantFiled: February 14, 2013Date of Patent: February 2, 2016Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Kazuhiro Yahata, Takashi Uno, Hikaru Ikeda
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Patent number: 9203358Abstract: A radio frequency amplifier circuit includes a transistor and an output-side matching circuit. The output-side matching circuit includes a first distributed constant line to which a radio frequency signal from the transistor is transmitted, a flat plate lead terminal transmitting the radio frequency signal from the first distributed constant line to an outside of the package, and a capacitive element having one electrode that is connected to the lead terminal and the other electrode that is grounded. A back surface of the lead terminal is joined to a resin substrate, and the capacitive element and the first distributed constant line are disposed adjacent to each other, with an alignment direction of the capacitive element and the first distributed constant line intersecting an alignment direction of the first distributed constant line and the lead terminal.Type: GrantFiled: March 15, 2013Date of Patent: December 1, 2015Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Tomohide Kamiyama, Hiroshi Naitou, Takashi Uno, Motoyoshi Iwata, Kazuhiro Yahata, Hikaru Ikeda
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Patent number: 8947166Abstract: A radio frequency power amplifier includes: an amplifying element which amplifies an input signal and outputs the signal from an output terminal; and an output load circuit which includes a first resonant circuit and a second resonant circuit that are connected to the output terminal. The first resonant circuit has a resonance frequency higher than the frequency of the second harmonic of the input signal, and the second resonant circuit has a resonance frequency lower than the frequency of the third harmonic of the input signal. The output load circuit has such an impedance looking from the output terminal that a phase of a reflection coefficient at the second harmonic of the input signal is greater than 180 degrees and less than 360 degrees, and a phase of a reflection coefficient at the third harmonic of the input signal is greater than 0 degrees and less than 180 degrees.Type: GrantFiled: May 22, 2012Date of Patent: February 3, 2015Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventors: Takashi Uno, Hikaru Ikeda, Kazuhiro Yahata, Motoyoshi Iwata, Hiroshi Naitou, Tomohide Kamiyama
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Patent number: 8937374Abstract: A semiconductor package according to the present invention includes: a semiconductor element where a high frequency signal is input or output; a planar lead terminal having an end electrically connected to an input terminal or an output terminal of the semiconductor element; an encapsulation resin for encapsulating the lead terminal and the semiconductor element, the lead terminal having another end exposed from the resin; and a ground enhancing metal body encapsulated in the encapsulation resin, having a first main surface facing the lead terminal and a second main surface exposed from the encapsulation resin, wherein the ground enhancing metal body has a shape with a cross section parallel to the second main surface and having a smaller area than an area of the first main surface.Type: GrantFiled: October 24, 2012Date of Patent: January 20, 2015Assignee: Panasonic CorporationInventors: Takashi Uno, Hikaru Ikeda, Kazuhiro Yahata, Motoyoshi Iwata, Hiroshi Naitou, Tomohide Kamiyama
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Publication number: 20140239470Abstract: A resin package includes: a die pad having a main surface on which a semiconductor substrate and a matching circuit substrate is mounted; at least one lead terminal electrically connected to the semiconductor substrate and the matching circuit substrate; a thin plate fixed to at least one of the main surface of the die pad and a main surface of the at least one lead terminal; and molding resin which covers the semiconductor substrate, the matching circuit substrate, and the thin plate.Type: ApplicationFiled: February 14, 2013Publication date: August 28, 2014Applicant: PANASONIC CORPORATIONInventors: Kazuhiro Yahata, Takashi Uno, Hikaru Ikeda
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Patent number: 8814615Abstract: In an outboard motor having a prime mover, a gear mechanism transmitting a driving force of the prime mover to a propeller, and a gear case housing the gear mechanism, it is configured to have a drain bolt fastened to a drain hole bored at the gear case and constituted as a magnetic member; a stacked portion provided at an exposed part of the drain bolt in an inside of the gear case and having a conductor, an insulator and a resistive element partially making contact with the conductor that are stacked in a gravitational direction; a current detector detecting a current value conducted from the conductor to the drain bolt under a condition where voltage is applied to the conductor; and a wear debris amount detector adapted to detect an amount of wear debris of the gear mechanism deposited at the drain bolt based on the conducted current value.Type: GrantFiled: November 7, 2012Date of Patent: August 26, 2014Assignee: Honda Motor Co., Ltd.Inventors: Koji Kuriyagawa, Norikazu Shimizu, Hikaru Ikeda
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Publication number: 20140231418Abstract: An aspect of the present invention provides a microwave heating device for an object having a plurality of parts, the microwave heating device including: a plurality of antennas which emits microwaves to a heating chamber inside; a sensor which detects information from a block model assigned the information indicating a characteristic of each of the parts; a display and input operation unit configured to receive an input of heating conditions for the object; an electromagnetic field analysis unit configured to derive a heating profile by electromagnetic field analysis based on the information detected by the sensor and the heating conditions inputted to the display and input operation unit, the heating profile including microwave emitting conditions for the object; and a control unit configured to control performance of the microwaves emitted from the antennas based on the derived heating profile.Type: ApplicationFiled: February 15, 2013Publication date: August 21, 2014Applicant: PANASONIC CORPORATIONInventors: Hikaru Ikeda, Motoyoshi Iwata, Tomohide Kamiyama
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Publication number: 20140191809Abstract: A radio frequency amplifier circuit includes a transistor and an output-side matching circuit. The output-side matching circuit includes a first distributed constant line to which a radio frequency signal from the transistor is transmitted, a flat plate lead terminal transmitting the radio frequency signal from the first distributed constant line to an outside of the package, and a capacitive element having one electrode that is connected to the lead terminal and the other electrode that is grounded. A back surface of the lead terminal is joined to a resin substrate, and the capacitive element and the first distributed constant line are disposed adjacent to each other, with an alignment direction of the capacitive element and the first distributed constant line intersecting an alignment direction of the first distributed constant line and the lead terminal.Type: ApplicationFiled: March 15, 2013Publication date: July 10, 2014Inventors: Tomohide Kamiyama, Hiroshi Naitou, Takashi Uno, Motoyoshi Iwata, Kazuhiro Yahata, Hikaru Ikeda
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Patent number: 8698564Abstract: A radio frequency amplifier circuit includes: low-output transistors, each of which includes an input terminal, an output terminal, and a ground terminal, and amplifies a radio frequency signal; a harmonic processing circuit provided for each of the low-output transistors to be connected to the output terminal of the low-output transistor, and processing a secondary harmonic included in an amplified radio frequency signal, and a resistor connected to the output terminal of each of the low-output transistors. The input terminal of each of the low-output transistors is connected to an input terminal of the radio frequency amplifier circuit via an inductor, and the output terminal of each of the low-output transistors is connected to the other output terminal via the resistance and is further connected to an output terminal of the radio frequency amplifier circuit via an inductor.Type: GrantFiled: April 25, 2012Date of Patent: April 15, 2014Assignee: Panasonic CorporationInventors: Tomohide Kamiyama, Hiroshi Naitou, Takashi Uno, Motoyoshi Iwata, Kazuhiro Yahata, Hikaru Ikeda
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Publication number: 20140077345Abstract: A semiconductor package according to the present invention includes: a semiconductor element where a high frequency signal is input or output; a planar lead terminal having an end electrically connected to an input terminal or an output terminal of the semiconductor element; an encapsulation resin for encapsulating the lead terminal and the semiconductor element, the lead terminal having another end exposed from the resin; and a ground enhancing metal body encapsulated in the encapsulation resin, having a first main surface facing the lead terminal and a second main surface exposed from the encapsulation resin, wherein the ground enhancing metal body has a shape with a cross section parallel to the second main surface and having a smaller area than an area of the first main surface.Type: ApplicationFiled: October 24, 2012Publication date: March 20, 2014Applicant: Panasonic CorporationInventors: Takashi Uno, Hikaru Ikeda, Kazuhiro Yahata, Motoyoshi Iwata, Hiroshi Naitou, Tomohide Kamiyama
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Patent number: 8555856Abstract: In an apparatus for controlling a speed of an internal combustion engine installed in an outboard motor and having an actuator connected to a throttle valve of the engine to open and close the throttle valve, and up/down command signal outputting devices that output an up/down command signal to increase/decrease the engine speed when manipulated by an operator, the engine speed is controlled to change in response to the up or down command signal with an engine speed change amount per unit time made different depending on whether the detected engine speed exceeds a reference speed or not, thereby enabling to finely and precisely control the engine speed in the low speed range, while facilitating speed regulation.Type: GrantFiled: July 21, 2010Date of Patent: October 15, 2013Assignee: Honda Motor Co., Ltd.Inventors: Hideaki Shimamura, Yoshio Ohtomo, Mitsuaki Kubota, Takeshi Inaba, Hikaru Ikeda
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Publication number: 20130176079Abstract: A radio frequency power amplifier includes: an amplifying element which amplifies an input signal and outputs the signal from an output terminal; and an output load circuit which includes a first resonant circuit and a second resonant circuit that are connected to the output terminal. The first resonant circuit has a resonance frequency higher than the frequency of the second harmonic of the input signal, and the second resonant circuit has a resonance frequency lower than the frequency of the third harmonic of the input signal. The output load circuit has such an impedance looking from the output terminal that a phase of a reflection coefficient at the second harmonic of the input signal is greater than 180 degrees and less than 360 degrees, and a phase of a reflection coefficient at the third harmonic of the input signal is greater than 0 degrees and less than 180 degrees.Type: ApplicationFiled: May 22, 2012Publication date: July 11, 2013Applicant: Panasonic CorporationInventors: Takashi Uno, Hikaru IKeda, Kazuhiro Yahata, Motoyoshi Iwata, Hiroshi Naitou, Tomohide Kamiyama