Abstract: A gas barrier film is provided including a polymer film substrate and a gas barrier layer containing at least zinc oxide and silicon dioxide on at least one surface of the polymer film substrate, wherein the gas barrier layer satisfies at least one of the following [I] to [III]: [I] with regard to X-ray absorption near edge structure (XANES) spectrum at K absorption edge of zinc, the value of (spectrum intensity at 9664.0 eV)/(spectrum intensity at 9668.0 eV) is in the range of 0.910 to 1.000; [II] the value obtained by dividing atomic concentration of zinc with atomic concentration of silicon is in the range of 0.1 to 1.5, and structural density index represented by the following equation: structural density index={density of the gas barrier layer obtained by X-ray reflectometry (XRR)}/{(theoretical density calculated from compositional ratio determined by X-ray photoelectron spectroscopy (XPS)} is 1.20 to 1.

Abstract: A non-contact IC tag includes an insulating substrate, an IC tag having an IC chip and a matching-circuit equipped dipole antenna connected with the IC chip, and a first and second parasitic antenna both provided at the other side of the insulating substrate. The matching-circuit equipped dipole antenna has two antenna sections, a connecting terminal section and a matching circuit section. Projection images of the first and second parasitic antennae onto the one side of the insulating substrate respectively overlap at least portions of the two antenna sections of the matching-circuit equipped dipole antenna. The first and second parasitic antennae are made electrically conductive by a connected portion, and the projection images of the first and second parasitic antennae, and the connected portion onto the one side of the insulating substrate do not overlap the IC chip and the connecting terminal section of the matching-circuit equipped dipole antenna.

Abstract: A non-contact IC tag includes an insulating substrate, an IC tag having an IC chip and a matching-circuit equipped dipole antenna connected with the IC chip, and a first and second parasitic antenna both provided at the other side of the insulating substrate. The matching-circuit equipped dipole antenna has two antenna sections, a connecting terminal section and a matching circuit section. Projection images of the first and second parasitic antennae onto the one side of the insulating substrate respectively overlap at least portions of the two antenna sections of the matching-circuit equipped dipole antenna. The first and second parasitic antennae are made electrically conductive by a connected portion, and the projection images of the first and second parasitic antennae, and the connected portion onto the one side of the insulating substrate do not overlap the IC chip and the connecting terminal section of the matching-circuit equipped dipole antenna.