Abstract: The problem of the present invention is to provide a substrate with high versatility, a method for producing the substrate, and a method for producing a unit cell using the substrate. The problem is solved by providing a substrate comprising a plurality of alkali metal azide spots on a substantially flat surface.

Abstract: The present disclosure appropriately encourages provision of a service according to a location or provision of a location according to a service. A controller of a server apparatus that is an information processing apparatus according to the present disclosure acquires, from an apparatus of a location provider, attribute information of a location that the location provider is able to provide. The controller acquires, from an apparatus of a service provider, attribute information of a service that the service provider is able to provide. The controller performs, at least one of transmission, to the apparatus of the location provider, of a notification encouraging rental of the location to the service provider and transmission, to the apparatus of the service provider, of a notification encouraging use of the location when the attribute information of the location and the attribute information of the service satisfy a predetermined condition.

Abstract: The present disclosure makes it possible to further improve convenience of customers and the like accompanying purchase of merchandise. An autonomous traveling unit is provided with: a driving portion including an autonomous traveling ability, the driving portion being configured to be movable together with a storing portion configured to store merchandise; and a controlling portion configured to execute: acquiring settlement completion information about the merchandise stored in the storing portion, the merchandise being merchandise in a store; and controlling the driving portion to cause the merchandise storing portion to move to a first point outside the store after acquiring the settlement completion information.

Abstract: Provided is an optical film that can eliminate rainbow unevenness when viewed with the naked eyes and provide favorable color tone uniformity when viewed at an oblique angle. This optical film has a low-refractive index layer on a plastic film, the plastic film has a slow axis that is an axis with the largest refractive index in a plane, and a fast axis that is an axis orthogonal to the slow axis in the plane of the plastic film, and the low-refractive index layer is located on the surface of the optical film. Linearly polarized light is incident, under predetermined conditions, from a surface on a side opposite to the low-refractive index layer of the optical film, and transmitted light of the linearly polarized light is used to measure the a* value and b* value of the L*a*b* color system at 11 measurement points with different angles.

Abstract: A diagnostic optical microscope according to the present embodiment includes at least one laser light source (11) configured to generate laser light for illuminating a sample (40) containing a light absorbing material, a lens configured to focus the laser light to be focused on the sample (40), scanning means for changing a focusing position of the laser light on the sample (40), and a light detector (31) configured to detect laser light transmitted through the sample (40) as signal light. A laser light intensity is changed to obtain a nonlinear region in which the laser light intensity and a signal light intensity have a nonlinear relation due to occurrence of saturation of absorption in the light absorbing material when the laser light intensity is maximized. An image is generated based on a nonlinear component of the signal light based on the saturation of absorption in the light absorbing material.

Abstract: An interconnect substrate includes a pad for external connection and an insulating layer, wherein part of a lower surface of the pad is covered with the insulating layer, wherein the pad is situated in a recess formed in an upper surface of the insulating layer, such that a groove is present between the pad and a perimeter of the recess around the pad in a plan view of the interconnect substrate, and wherein a bottom surface of the groove is coplanar with the lower surface of the pad.

Abstract: A circuit board includes an insulating layer that is layered on a substrate; and a dam member in a form of a rectangular frame that is formed on the insulating layer. A corner part of the dam member includes a slope that slopes down from an inner wall surface to a surface of the insulating layer in a lower part that makes contact with the surface of the insulating layer; and a perpendicular part that is perpendicular to the surface of the insulating layer in an upper part separated from the surface of the insulating layer.

Abstract: An interconnect substrate includes a pad for external connection and an insulating layer, wherein a portion of a lower surface of the pad is covered with the insulating layer, wherein an upper surface of the pad is situated at a lower position than an upper surface of the insulating layer, and wherein a groove whose bottom surface is formed by the insulating layer is formed around the pad in a plan view, and has an opening on an upper surface side of the insulating layer.

Abstract: A wiring board includes a pad configured to make an external electrical connection, and an insulating layer. A portion of a lower surface of the pad is covered with the insulating layer. The pad includes a base portion, and an extending portion formed integrally with the base portion and extending toward an outer periphery of a side surface of the base portion in a plan view at a lower end of the side surface of the base portion. The insulating layer is provided with a groove that is located in a periphery of the pad in the plan view, exposes a side surface of the pad, and opens to an upper surface of the insulating layer.

Abstract: A wiring board includes: a wiring layer; an insulating layer laminated on the wiring layer; an opening portion penetrating through the insulating layer to the wiring layer; a recess portion formed in a surface of the wiring layer exposed from the opening portion of the insulating layer; and a conductor film formed in the opening portion of the insulating layer and the recess portion of the wiring layer, wherein the recess portion of the wiring layer includes a raised portion, which is raised higher than an outer peripheral portion of a bottom surface, at a central portion of the bottom surface.

Abstract: A radiographic system that includes a radiation generation apparatus configured to emit radiation, a radiographic apparatus configured to generate a radiographic image based on the radiation, a control apparatus configured to communicate with the radiographic apparatus to receive the radiographic image and control operation, the radiographic system includes an obtaining unit configured to obtain a plurality of dose index values using the radiation image generated based on the radiation.

Abstract: A wiring substrate includes: a wiring layer; an insulating layer that is laminated on the wiring layer; an opening portion that passes through the insulating layer to the wiring layer; and an electric conductor film that is formed at the opening portion of the insulating layer. A surface of the insulating layer includes a smoothed portion that is not covered by the electric conductor film, and a roughened portion that includes an inner wall surface of the opening portion covered by the electric conductor film and that have surface roughness that is greater than surface roughness of the smoothed portion.

Abstract: A semiconductor device includes a flexible wiring substrate. The wiring substrate includes at least two mounting portions and at least one connecting portion. The mounting portions are stacked spaced apart from each other. Each connecting portion is bent to connect two mounting portions that are adjacent in a stacking direction. The semiconductor device further includes at least one semiconductor chip mounted on at least one of the at least two mounting portions and a plurality of conductive connecting members connecting the mounting portions to each other in the stacking direction.

Abstract: An interconnect substrate includes a substrate, and a first connection terminal and a second connection terminal that are disposed on a surface of the substrate, wherein the first connection terminal includes a first columnar electrode and a first bump disposed on the first columnar electrode, the first columnar electrode having a flat or convex surface and having a first diameter, wherein the second connection terminal includes a second columnar electrode and a second bump disposed on the second columnar electrode, the second columnar electrode having a concave surface and having a second diameter larger than the first diameter, and wherein a melting point of the first bump and the second bump is lower than a melting point of the first columnar electrode and the second columnar electrode.

Abstract: A radiation imaging system comprises a plurality of imaging apparatuses configured to generate images based on radiation emitted from a radiation generator, and a control apparatus configured to communicate with the plurality of imaging apparatuses. Each of the plurality of imaging apparatuses generates imaging information with a smaller data size than an image obtained by an imaging operation based on the image. The control apparatus acquires the imaging information from each of the plurality of imaging apparatuses, and selects, from the plurality of imaging apparatuses based on the imaging information, an imaging apparatus from which an image obtained by an imaging operation is acquired.

Abstract: A radiation imaging system includes a plurality of imaging apparatuses configured to generate images based on radiation emitted from radiation generating apparatuses configured to perform radiation irradiation and a control apparatus configured to communicate with the plurality of the imaging apparatuses. The control apparatus comprises: an obtainment unit configured to obtain imaging information from each of the plurality of imaging apparatuses, a selection unit configured to select one imaging apparatus from the plurality of imaging apparatuses based on the imaging information obtained by the obtainment unit, and an image obtainment unit configured to obtain an image from the imaging apparatus selected by the selection unit, and the control apparatus further comprises a setting unit configured to set an imaging apparatus from which imaging information is obtained by the obtainment unit.

Abstract: A wiring substrate includes: a wiring layer; an insulating layer covering the wiring layer, and including a first opening portion exposing the wiring layer and a second opening portion exposing the wiring layer, wherein a diameter of the second opening portion is larger than that of the first opening portion; a first metal layer formed in the first opening portion and the second opening portion, and having a recess in the second opening portion; and a second metal layer that is formed on the first metal layer formed in the first opening portion and the second opening portion, wherein a portion of the second metal layer fills the recess. The first metal layer and the second metal layer serve as connection terminals to be electrically connected to an electronic component.

Abstract: A radiation imaging system includes: an imaging unit configured to transfer a radiation image generated based on received radiation; and a control unit configured to determine, based on a transfer status of the radiation image, whether to continue or interrupt to transfer the radiation image.

Abstract: A wiring substrate includes: a wiring layer; an insulating layer covering the wiring layer, and including a first opening portion exposing the wiring layer and a second opening portion exposing the wiring layer, wherein a diameter of the second opening portion is larger than that of the first opening portion; a first metal layer formed in the first opening portion and the second opening portion, and having a recess in the second opening portion; and a second metal layer that is formed on the first metal layer formed in the first opening portion and the second opening portion, wherein a portion of the second metal layer fills the recess. The first metal layer and the second metal layer serve as connection terminals to be electrically connected to an electronic component.

Abstract: An interconnect substrate includes a substrate, and a first connection terminal and a second connection terminal that are disposed on a surface of the substrate, wherein the first connection terminal includes a first columnar electrode and a first bump disposed on the first columnar electrode, the first columnar electrode having a flat or convex surface and having a first diameter, wherein the second connection terminal includes a second columnar electrode and a second bump disposed on the second columnar electrode, the second columnar electrode having a concave surface and having a second diameter larger than the first diameter, and wherein a melting point of the first bump and the second bump is lower than a melting point of the first columnar electrode and the second columnar electrode.