Patents by Inventor Hikaru Uchiyama

Hikaru Uchiyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140023547
    Abstract: There is provided chips for injection molding wherein the surfaces of chips made of an aluminum-containing magnesium alloy are coated with carbon powder. A molded article produced by injection molding of such chips for injection molding had excellent bending properties and tensile strength, which vary in a small range. Furthermore, a scrap formed during injection-molding of the chips for injection molding has improved recyclability.
    Type: Application
    Filed: April 6, 2012
    Publication date: January 23, 2014
    Applicants: STU CO., LTD., OKAYAMA PREFECTURAL GOVERNMENT
    Inventors: Yutaka Mitooka, Makoto Hino, Koji Murakami, Hikaru Uchiyama, Yoshiaki Hashimoto