Abstract: A conductive composition capable of producing a conductive coating with excellent flexibility and a high conductivity comparable to that of metallic silver, without using high temperatures as film forming conditions. The conductive composition includes a particulate silver compound and a binder, and optionally a reducing agent and a binder. Silver oxide, silver carbonate and silver acetate and the like are used as the particulate silver compound. Ethylene glycol, diethylene glycol, and ethylene glycol diacetate and the like are used as the reducing agent, and a fine powder of a thermosetting resin such as a polyvalent phenol compound, phenol resin, alkyd resin or polyester resin, or a thermoplastic resin such as a styrene resin or polyethylene terephthalate, with an average particle diameter from 20 nm to 5 ?m is used as the binder. Furthermore, the average particle diameter of the particulate silver compound may be from 0.01 to 10 ?m.

Abstract: A conductive composition capable of producing a conductive paint with excellent flexibility and a high conductivity comparable to that of metallic silver, without using high temperatures as film forming conditions. The conductive composition includes a particulate silver compound and a binder, and optionally a reducing agent and a binder. Silver oxide, silver carbonate and silver acetate and the like are used as the particulate silver compound. Ethylene glycol, diethylene glycol, and ethylene glycol diacetate and the like are used as the reducing agent, and a fine powder of a thermosetting resin such as a polyvalent phenol compound, phenol resin, alkyd resin or polyester resin, or a thermoplastic resin such as a styrene resin or polyethylene terephthalate, with an average particle diameter from 20 nm to 5 ?m is used as the binder. Furthermore, the average particle diameter of the particulate silver compound is preferably from 0.01 to 10 ?m.

Abstract: An electrically conductive composition can be obtained that provides an electrically conductive coating having low volume resistivity and high electrical conductivity comparable to that of metallic silver independent of high-temperature film deposition conditions, while also enabling the line width of an electrical circuit to be sufficiently narrow without having to increase thickness in the case of forming an electrical circuit of a flexible circuit board and so forth.

Abstract: The distance from the end of the cable to the dielectric weak point of said cable is measured by applying a D.C. high voltage to said cable and generating a discharge at the dielectric weak point, obtaining a pair of pulse signals one by differentiating a surge signal generated and the other reflected at said dielectric weak point, limiting the amplitude of said pair of pulse signals, and measuring the interval between said pair of pulse signals.