Patents by Inventor Hikoji Okuyama

Hikoji Okuyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6863586
    Abstract: A sealing plug used for sealing an arc tube, and formed from a plurality of sintered layers. The sealing plug is obtained by conducting a slurry preparation step of preparing slurries corresponding to each layer of the sealing plug by mixing together a tungsten powder, a silica powder, an organic binder, an organic solvent, and a dispersant; a preform manufacturing step of manufacturing layers of a preform by repeating the process of dipping the metal lead wire into the slurries with the metal lead wire in a perpendicular position, and drying the slurry adhering when the metal lead wire is removed; and a sintering step of sintering the manufactured preform.
    Type: Grant
    Filed: October 15, 2002
    Date of Patent: March 8, 2005
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventor: Hikoji Okuyama
  • Publication number: 20030080684
    Abstract: A sealing plug used for sealing an arc tube, and formed from a plurality of sintered layers. The sealing plug is obtained by conducting a slurry preparation step of preparing slurries corresponding to each layer of the sealing plug by mixing together a tungsten powder, a silica powder, an organic binder, an organic solvent, and a dispersant; a preform manufacturing step of manufacturing layers of a preform by repeating the process of dipping the metal lead wire into the slurries with the metal lead wire in a perpendicular position, and drying the slurry adhering when the metal lead wire is removed; and a sintering step of sintering the manufactured preform.
    Type: Application
    Filed: October 15, 2002
    Publication date: May 1, 2003
    Inventor: Hikoji Okuyama
  • Patent number: 6485591
    Abstract: The invention relates to a method of laminating ceramic greenware sheets with electrodes embedded therein (25) which is formed on a support by pressure-adhering a ceramic greenware sheet with an electrode embedded therein onto a second ceramic greenware sheet or other electrodes (23), then peeling off the support alone and transferring the ceramic greenware sheet with the embedded electrodes onto the second ceramic greenware sheet or the other electrodes. This manufacturing method enables it to laminate ceramic greenware sheets each the thickness of which is as thin as 20 micrometers or less, while maintaining their mechanical strength and embedded electrodes in the ceramic greenware sheets, thereby enabling it to prevent a occurrence of surface irregularities due to the thickness of the electrodes even when laminating to a high degree.
    Type: Grant
    Filed: August 4, 1994
    Date of Patent: November 26, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Keiichi Nakao, Hideyuki Okinaka, Yasutaka Horibe, Hikoji Okuyama, Masahiro Katoh, Takashi Iguchi, Akira Ohmi, Yoshiyuki Miura