Patents by Inventor Hila Elimelech

Hila Elimelech has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Composite component fabrication using inkjet printing
    Patent number: 11351610
    Abstract: The disclosure relates to methods and compositions for direct printing of composite components. Specifically, the disclosure relates to the continuous printing of colored resin and metallic composite components using inkjet printing.
    Type: Grant
    Filed: March 7, 2017
    Date of Patent: June 7, 2022
    Assignee: Nano Dimension Technologies, LTD.
    Inventors: Sharon Fima, Hila Elimelech
  • Inkjet printing of three-dimensional ceramic pattern
    Patent number: 11155004
    Abstract: The disclosure relates to systems, methods and compositions for inkjet printing of ceramic dielectric portions. Specifically, the disclosure relates to systems, methods and compositions for the inkjet printing of three dimensional patterns formed from pre-ceramic polymer derived interpenetrated networks that are comprised of at least two phases, or bi-continuous phases, one formed by free radical polymerization and the other by sol-gel polymerization.
    Type: Grant
    Filed: March 18, 2019
    Date of Patent: October 26, 2021
    Assignee: Nano-Dimension Technologies
    Inventors: Hila Elimelech, Lior Yedidya
  • Double-sided and multilayered printed circuit board fabrication using inkjet printing
    Patent number: 11039541
    Abstract: The disclosure relates to methods, kits and compositions for direct printing of double-sided and/or multilayered printed circuit boards. Specifically, the disclosure relates to the printing of conductive leads and insulating portions of printed circuit boards using inkjet printing.
    Type: Grant
    Filed: November 22, 2015
    Date of Patent: June 15, 2021
    Assignee: Nano Dimension Technologies, LTD.
    Inventors: Sharon Fima, Hila Elimelech
  • INKJET PRINTING OF THREE-DIMENSIONAL CERAMIC PATTERN
    Publication number: 20210046670
    Abstract: The disclosure relates to systems, methods and compositions for inkjet printing of ceramic dielectric portions. Specifically, the disclosure relates to systems, methods and compositions for the inkjet printing of three dimensional patterns formed from pre-ceramic polymer derived interpenetrated networks that are comprised of at least two phases, or bi-continuous phases, one formed by free radical polymerization and the other by sol-gel polymerization.
    Type: Application
    Filed: March 18, 2019
    Publication date: February 18, 2021
    Applicant: NANO DIMENSIONS TECHNOLOGIES LTD.
    Inventors: Hila Elimelech, Lior Yedidya
  • Rigid-flexible printed circuit bord fabrication using inkjet printing
    Patent number: 10893612
    Abstract: The disclosure relates to methods and compositions for direct printing of rigid flexible electronic objects. Specifically, the disclosure relates to methods, systems and compositions for the direct, optionally simultaneous inkjet printing of rigid-flexible electronics, for example, rigid-flexible PCBs, FPCs, TFTs, antennae solar cells, RFIDs and the like, using a combination of print heads with flexible and rigid conductive and dielectric ink compositions.
    Type: Grant
    Filed: January 11, 2018
    Date of Patent: January 12, 2021
    Assignee: Nano Dimension Technologies Ltd.
    Inventors: Hila Elimelech, Einav Amit
  • Suspension polymerization compositions, methods and uses thereof
    Patent number: 10626233
    Abstract: The disclosure relates to thermosetting reinforced resin compositions and methods of forming boards, sheets and/or films using of porous particulates impregnated with embedded live monomer and/or oligomer and/or polymer configured to partially leach out a functional terminal end of the live monomer and/or oligomer and/or polymer and react with a cross-linking agent and photoinitiated polymer radicals to form a reinforced board, sheet and/or film of hybrid interpenetrating networks.
    Type: Grant
    Filed: May 16, 2017
    Date of Patent: April 21, 2020
    Assignee: NANO-DIMENSION TECHNOLOGIES, LTD.
    Inventor: Hila Elimelech
  • COMPOSITE COMPONENT FABRICATION USING INKJET PRINTING
    Publication number: 20200070245
    Abstract: The disclosure relates to methods and compositions for direct printing of composite components. Specifically, the disclosure relates to the continuous printing of colored resin and metallic composite components using inkjet printing.
    Type: Application
    Filed: March 7, 2017
    Publication date: March 5, 2020
    Applicant: NANO DIMENSIONS TECHNOLOGIES LTD.
    Inventors: Sharon Fima, Hila Elimelech
  • RIGID-FLEXIBLE PRINTED CIRCUIT BORD FABRICATION USING INKJET PRINTING
    Publication number: 20200037451
    Abstract: The disclosure relates to methods and compositions for direct printing of rigid flexible electronic objects. Specifically, the disclosure relates to methods, systems and compositions for the direct, optionally simultaneous inkjet printing of rigid-flexible electronics, for example, rigid-flexible PCBs, FPCs, TFTs, antennae solar cells, RFIDs and the like, using a combination of print heads with flexible and rigid conductive and dielectric ink compositions.
    Type: Application
    Filed: January 11, 2018
    Publication date: January 30, 2020
    Applicant: NANO DIMENSIONS TECHNOLOGIES LTD.
    Inventors: Hila Elimelech, Einav Amit
  • Uspension polymerization compositions, methods and uses thereof
    Patent number: 10385175
    Abstract: The disclosure relates to thermosetting reinforced resin compositions and methods of forming boards, sheets and/or films using of porous particulates impregnated with embedded live monomer and/or oligomer and/or polymer configured to partially leach out a functional terminal end of the live monomer and/or oligomer and/or polymer and react with a cross-linking agent and photoinitiated polymer radicals to form a reinforced board, sheet and/or film of hybrid interpenetrating networks.
    Type: Grant
    Filed: October 29, 2015
    Date of Patent: August 20, 2019
    Assignee: Nano Dimension Technologies, LTD.
    Inventor: Hila Elimelech
  • DOUBLE-SIDED AND MULTILAYERED PRINTED CIRCUIT BOARD FABRICATION USING INKJET PRINTING
    Publication number: 20190098771
    Abstract: The disclosure relates to methods, kits and compositions for direct printing of double-sided and/or multilayered printed circuit boards. Specifically, the disclosure relates to the printing of conductive leads and insulating portions of printed circuit boards using inkjet printing.
    Type: Application
    Filed: November 22, 2015
    Publication date: March 28, 2019
    Applicant: Nano Dimension Technologies, LTD.
    Inventors: Sharon Fima, Hila Elimelech
  • SUSPENSION POLYMERIZATION COMPOSITIONS, METHODS AND USES THEREOF
    Publication number: 20170298197
    Abstract: The disclosure relates to thermosetting reinforced resin compositions and methods of forming boards, sheets and/or films using of porous particulates impregnated with embedded live monomer and/or oligomer and/or polymer configured to partially leach out a functional terminal end of the live monomer and/or oligomer and/or polymer and react with a cross-linking agent and photoinitiated polymer radicals to form a reinforced board, sheet and/or film of hybrid interpenetrating networks.
    Type: Application
    Filed: May 16, 2017
    Publication date: October 19, 2017
    Applicant: Nano Dimension Technologies, LTD.
    Inventor: Hila Elimelech
  • USPENSION POLYMERIZATION COMPOSITIONS, METHODS AND USES THEREOF
    Publication number: 20170247519
    Abstract: The disclosure relates to thermosetting reinforced resin compositions and methods of forming boards, sheets and/or films using of porous particulates impregnated with embedded live monomer and/or oligomer and/or polymer configured to partially leach out a functional terminal end of the live monomer and/or oligomer and/or polymer and react with a cross-linking agent and photoinitiated polymer radicals to form a reinforced board, sheet and/or film of hybrid interpenetrating networks.
    Type: Application
    Filed: October 29, 2015
    Publication date: August 31, 2017
    Applicant: Nano Dimension Technologies, LTD.
    Inventor: Hila Elimelech