Patents by Inventor Hilal Ezzeddine
Hilal Ezzeddine has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9240766Abstract: A coupling circuit, including: a coupler including a first conductive line and a second conductive line coupled to the first one; at each end of the second line of the coupler, a two-output signal splitter; and at each output of each splitter, a filtering function.Type: GrantFiled: March 27, 2014Date of Patent: January 19, 2016Assignee: STMICROELECTRONICS (TOURS) SASInventors: Claire Laporte, Hilal Ezzeddine
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Patent number: 9117693Abstract: A passive integrated circuit formed on a substrate, including contact areas of a conductive material specifically capable of receiving bonding pads, wherein the conductive material further creates connections between regions of a lower metallization level.Type: GrantFiled: June 8, 2011Date of Patent: August 25, 2015Assignee: STMICROELECTRONICS (TOURS) SASInventors: Claire Laporte, Hilal Ezzeddine
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Patent number: 8981870Abstract: A distributed differential coupler, including a first conductive line and two second conductive lines coupled to the first one, each second conductive line including two conductive sections electrically in series, their respective junctions points being intended to be grounded.Type: GrantFiled: August 10, 2012Date of Patent: March 17, 2015Assignee: STMicroelectronics (Tours) SASInventors: Eric Colleoni, Hilal Ezzeddine
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Publication number: 20140292614Abstract: A coupling circuit, including: a coupler including a first conductive line and a second conductive line coupled to the first one; at each end of the second line of the coupler, a two-output signal splitter; and at each output of each splitter, a filtering function.Type: ApplicationFiled: March 27, 2014Publication date: October 2, 2014Applicant: STMicroelectronics (Tours) SASInventors: Claire Laporte, Hilal Ezzeddine
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Patent number: 8810333Abstract: A multiband coupling circuit including: a number of paths equal to the number of frequency bands, each path having a first terminal and a second terminal; a third terminal and a fourth terminal; a number of distributed couplers equal to the number of paths, all couplers being identical and sized according to the highest frequency band, and each coupler including a first conductive line between first and second ports connected to the first and second terminals of the concerned path, and a second conductive line coupled to the first one between third and fourth ports; a first set of attenuations between the third ports of the couplers and the third terminal of the circuit; and an array of filters between the fourth ports of the coupler and the fourth terminal of the circuit.Type: GrantFiled: September 15, 2011Date of Patent: August 19, 2014Assignee: STMicroelectronics (Tours) SASInventors: Claire Laporte, Hilal Ezzeddine
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Patent number: 8797121Abstract: A distributed coupler including a first line intended to convey a radio signal between its two ends and a second line intended to sample, by coupling, part of the signal, wherein: one of the lines is formed on an insulating substrate; and the other line is formed in a lead frame supporting the substrate, one line being above the other.Type: GrantFiled: September 8, 2011Date of Patent: August 5, 2014Assignee: STMicroelectronics (Tours) SASInventors: Hilal Ezzeddine, Claire Laporte
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Patent number: 8773217Abstract: A distributed-line directional coupler including: a first conductive line between first and second ports intended to convey a signal to be transmitted; and a second conductive line, coupled to the first one, between third and fourth ports, the second line being interrupted approximately at its middle, the two intermediary ends being connected to attenuators.Type: GrantFiled: May 31, 2013Date of Patent: July 8, 2014Assignee: STMicroelectronics (Tours) SASInventors: François Dupont, Hilal Ezzeddine, Sylvain Charley
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Publication number: 20130257559Abstract: A distributed-line directional coupler including: a first conductive line between first and second ports intended to convey a signal to be transmitted; and a second conductive line, coupled to the first one, between third and fourth ports, the second line being interrupted approximately at its middle, the two intermediary ends being connected to attenuators.Type: ApplicationFiled: May 31, 2013Publication date: October 3, 2013Inventors: François Dupont, Hilal Ezzeddine, Sylvain Charley
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Patent number: 8476987Abstract: A distributed-line directional coupler including: a first conductive line between first and second ports intended to convey a signal to be transmitted; and a second conductive line, coupled to the first one, between third and fourth ports, the second line being interrupted approximately at its middle, the two intermediary ends being connected to attenuators.Type: GrantFiled: November 18, 2008Date of Patent: July 2, 2013Assignee: STMicroelectronics (Tours) SASInventors: François Dupont, Hilal Ezzeddine, Sylvain Charley
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Patent number: 8410864Abstract: A coupler including: a first conductive line intended to convey a signal to be transmitted between first and second terminals; a second conductive line, coupled to the first one and having one end intended to provide, on a third terminal, data relative to a signal reflected on the second terminal; and an inductive and/or capacitive impedance matching circuit, interposed between the other end of the second line and a fourth terminal of the coupler.Type: GrantFiled: June 29, 2009Date of Patent: April 2, 2013Assignee: STMicroelectronics (Tours) SASInventors: Sylvain Charley, François Dupont, Hilal Ezzeddine
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Patent number: 8384494Abstract: A distributed multiband coupling circuit including: a number n of first and of second terminals equal to the number of frequency bands; a third terminal and a fourth terminal; a number n of distributed couplers equal to the number of frequency bands, all couplers being identical and sized according to the highest frequency band, and each coupler including a first conductive line between first and second ports intended to convey a signal to be transmitted in the concerned frequency band, and a second conductive line coupled to the first one between third and fourth ports; a first set of resistive splitters in cascade between the third ports of the couplers, a terminal of the splitter associated with the first coupler being connected to the third terminal of the coupling circuit; and a second set of resistive splitters in cascade between the fourth ports of the couplers, a terminal of the splitter associated with the first coupler being connected to the fourth terminal of the coupling circuit.Type: GrantFiled: June 23, 2010Date of Patent: February 26, 2013Assignee: STMicroelectronics (Tours) SASInventors: Claire Laporte, Hilal Ezzeddine
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Publication number: 20130038403Abstract: A distributed differential coupler, including a first conductive line and two second conductive lines coupled to the first one, each second conductive line including two conductive sections electrically in series, their respective junctions points being intended to be grounded.Type: ApplicationFiled: August 10, 2012Publication date: February 14, 2013Applicant: STMicroelectronics (Tours) SASInventors: Eric Colleoni, Hilal Ezzeddine
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Patent number: 8299869Abstract: A balun including on the common-mode side, an inductive element in series with a first capacitive element between a first common-mode access terminal and the ground; and on the differential-mode side, two inductive windings in series having first respective ends defining differential access terminals and having second common ends connected to ground, second capacitive elements being respectively connected in parallel on the differential-mode windings.Type: GrantFiled: December 28, 2009Date of Patent: October 30, 2012Assignee: STMicroelectronics (Tours) SASInventors: Claire Laporte, Hilal Ezzeddine
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Patent number: 8203416Abstract: A spiral structure having at least one planar winding in at least one first conductive level to form at least one inductive element, wherein the winding is surrounded with a conductive plane and at least one track is formed in a second conductive level and has two ends connected by conductive vias to the plane of the first level, at diametrically opposite positions with respect to the center of the winding.Type: GrantFiled: May 21, 2008Date of Patent: June 19, 2012Assignee: STMicroelectronics S.A.Inventor: Hilal Ezzeddine
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Publication number: 20120122410Abstract: A multiband coupling circuit including: a number of paths equal to the number of frequency bands, each path having a first terminal and a second terminal; a third terminal and a fourth terminal; a number of distributed couplers equal to the number of paths, all couplers being identical and sized according to the highest frequency band, and each coupler including a first conductive line between first and second ports connected to the first and second terminals of the concerned path, and a second conductive line coupled to the first one between third and fourth ports; a first set of attenuations between the third ports of the couplers and the third terminal of the circuit; and an array of filters between the fourth ports of the coupler and the fourth terminal of the circuit.Type: ApplicationFiled: September 15, 2011Publication date: May 17, 2012Applicant: STMicroelectronics (Tours) SASInventors: Claire Laporte, Hilal Ezzeddine
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Publication number: 20120062333Abstract: A distributed coupler including a first line intended to convey a radio signal between its two ends and a second line intended to sample, by coupling, part of the signal, wherein: one of the lines is formed on an insulating substrate; and the other line is formed in a lead frame supporting the substrate, one line being above the other.Type: ApplicationFiled: September 8, 2011Publication date: March 15, 2012Applicant: STMicroelectronics (Tours) SASInventors: Hilal Ezzeddine, Claire Laporte
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Publication number: 20110304014Abstract: A passive integrated circuit formed on a substrate, including contact areas of a conductive material specifically capable of receiving bonding pads, wherein the conductive material further creates connections between regions of a lower metallization level.Type: ApplicationFiled: June 8, 2011Publication date: December 15, 2011Applicant: STMicroelectronics (Tours) SASInventors: Claire Laporte, Hilal Ezzeddine
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Patent number: 8063729Abstract: A mode-switching transformer comprising a first line in common mode and a second line in differential mode, each line comprising two sections in series respectively coupled with one of the two sections of the other line and all sections having the same lengths, the common mode line being connected in series with a capacitor, to lower the central frequency of the transformer passband, the ?/4 lengths of the sections being chosen to correspond to a central frequency greater than the central frequency desired for the transformer.Type: GrantFiled: September 2, 2010Date of Patent: November 22, 2011Assignee: STMicroelectronics, S.A.Inventor: Hilal Ezzeddine
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Patent number: 7952458Abstract: A mode-switching transformer with a 1-to-4 impedance ratio having a first planar winding formed in a first conductive level from a first differential mode terminal outside of the winding; a second planar winding formed in a second conductive level from a second differential mode terminal outside of the winding; a via of interconnection of the central ends of the first and second windings intended to be connected to ground; and at least one third planar winding in one of the two conductive levels, interdigited with the first or the second winding from a first common-mode terminal outside of the winding, the internal end of the third winding being connected to the via for direct grounding.Type: GrantFiled: November 29, 2006Date of Patent: May 31, 2011Assignee: STMicroelectronics S.A.Inventor: Hilal Ezzeddine
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Publication number: 20110001575Abstract: A distributed multiband coupling circuit including: a number n of first and of second terminals equal to the number of frequency bands; a third terminal and a fourth terminal; a number n of distributed couplers equal to the number of frequency bands, all couplers being identical and sized according to the highest frequency band, and each coupler including a first conductive line between first and second ports intended to convey a signal to be transmitted in the concerned frequency band, and a second conductive line coupled to the first one between third and fourth ports; a first set of resistive splitters in cascade between the third ports of the couplers, a terminal of the splitter associated with the first coupler being connected to the third terminal of the coupling circuit; and a second set of resistive splitters in cascade between the fourth ports of the couplers, a terminal of the splitter associated with the first coupler being connected to the fourth terminal of the coupling circuit.Type: ApplicationFiled: June 23, 2010Publication date: January 6, 2011Applicant: STMicroelectronics (Tours) SASInventors: Claire Laporte, Hilal Ezzeddine