Patents by Inventor Hilal Ezzeddine

Hilal Ezzeddine has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9240766
    Abstract: A coupling circuit, including: a coupler including a first conductive line and a second conductive line coupled to the first one; at each end of the second line of the coupler, a two-output signal splitter; and at each output of each splitter, a filtering function.
    Type: Grant
    Filed: March 27, 2014
    Date of Patent: January 19, 2016
    Assignee: STMICROELECTRONICS (TOURS) SAS
    Inventors: Claire Laporte, Hilal Ezzeddine
  • Patent number: 9117693
    Abstract: A passive integrated circuit formed on a substrate, including contact areas of a conductive material specifically capable of receiving bonding pads, wherein the conductive material further creates connections between regions of a lower metallization level.
    Type: Grant
    Filed: June 8, 2011
    Date of Patent: August 25, 2015
    Assignee: STMICROELECTRONICS (TOURS) SAS
    Inventors: Claire Laporte, Hilal Ezzeddine
  • Patent number: 8981870
    Abstract: A distributed differential coupler, including a first conductive line and two second conductive lines coupled to the first one, each second conductive line including two conductive sections electrically in series, their respective junctions points being intended to be grounded.
    Type: Grant
    Filed: August 10, 2012
    Date of Patent: March 17, 2015
    Assignee: STMicroelectronics (Tours) SAS
    Inventors: Eric Colleoni, Hilal Ezzeddine
  • Publication number: 20140292614
    Abstract: A coupling circuit, including: a coupler including a first conductive line and a second conductive line coupled to the first one; at each end of the second line of the coupler, a two-output signal splitter; and at each output of each splitter, a filtering function.
    Type: Application
    Filed: March 27, 2014
    Publication date: October 2, 2014
    Applicant: STMicroelectronics (Tours) SAS
    Inventors: Claire Laporte, Hilal Ezzeddine
  • Patent number: 8810333
    Abstract: A multiband coupling circuit including: a number of paths equal to the number of frequency bands, each path having a first terminal and a second terminal; a third terminal and a fourth terminal; a number of distributed couplers equal to the number of paths, all couplers being identical and sized according to the highest frequency band, and each coupler including a first conductive line between first and second ports connected to the first and second terminals of the concerned path, and a second conductive line coupled to the first one between third and fourth ports; a first set of attenuations between the third ports of the couplers and the third terminal of the circuit; and an array of filters between the fourth ports of the coupler and the fourth terminal of the circuit.
    Type: Grant
    Filed: September 15, 2011
    Date of Patent: August 19, 2014
    Assignee: STMicroelectronics (Tours) SAS
    Inventors: Claire Laporte, Hilal Ezzeddine
  • Patent number: 8797121
    Abstract: A distributed coupler including a first line intended to convey a radio signal between its two ends and a second line intended to sample, by coupling, part of the signal, wherein: one of the lines is formed on an insulating substrate; and the other line is formed in a lead frame supporting the substrate, one line being above the other.
    Type: Grant
    Filed: September 8, 2011
    Date of Patent: August 5, 2014
    Assignee: STMicroelectronics (Tours) SAS
    Inventors: Hilal Ezzeddine, Claire Laporte
  • Patent number: 8773217
    Abstract: A distributed-line directional coupler including: a first conductive line between first and second ports intended to convey a signal to be transmitted; and a second conductive line, coupled to the first one, between third and fourth ports, the second line being interrupted approximately at its middle, the two intermediary ends being connected to attenuators.
    Type: Grant
    Filed: May 31, 2013
    Date of Patent: July 8, 2014
    Assignee: STMicroelectronics (Tours) SAS
    Inventors: François Dupont, Hilal Ezzeddine, Sylvain Charley
  • Publication number: 20130257559
    Abstract: A distributed-line directional coupler including: a first conductive line between first and second ports intended to convey a signal to be transmitted; and a second conductive line, coupled to the first one, between third and fourth ports, the second line being interrupted approximately at its middle, the two intermediary ends being connected to attenuators.
    Type: Application
    Filed: May 31, 2013
    Publication date: October 3, 2013
    Inventors: François Dupont, Hilal Ezzeddine, Sylvain Charley
  • Patent number: 8476987
    Abstract: A distributed-line directional coupler including: a first conductive line between first and second ports intended to convey a signal to be transmitted; and a second conductive line, coupled to the first one, between third and fourth ports, the second line being interrupted approximately at its middle, the two intermediary ends being connected to attenuators.
    Type: Grant
    Filed: November 18, 2008
    Date of Patent: July 2, 2013
    Assignee: STMicroelectronics (Tours) SAS
    Inventors: François Dupont, Hilal Ezzeddine, Sylvain Charley
  • Patent number: 8410864
    Abstract: A coupler including: a first conductive line intended to convey a signal to be transmitted between first and second terminals; a second conductive line, coupled to the first one and having one end intended to provide, on a third terminal, data relative to a signal reflected on the second terminal; and an inductive and/or capacitive impedance matching circuit, interposed between the other end of the second line and a fourth terminal of the coupler.
    Type: Grant
    Filed: June 29, 2009
    Date of Patent: April 2, 2013
    Assignee: STMicroelectronics (Tours) SAS
    Inventors: Sylvain Charley, François Dupont, Hilal Ezzeddine
  • Patent number: 8384494
    Abstract: A distributed multiband coupling circuit including: a number n of first and of second terminals equal to the number of frequency bands; a third terminal and a fourth terminal; a number n of distributed couplers equal to the number of frequency bands, all couplers being identical and sized according to the highest frequency band, and each coupler including a first conductive line between first and second ports intended to convey a signal to be transmitted in the concerned frequency band, and a second conductive line coupled to the first one between third and fourth ports; a first set of resistive splitters in cascade between the third ports of the couplers, a terminal of the splitter associated with the first coupler being connected to the third terminal of the coupling circuit; and a second set of resistive splitters in cascade between the fourth ports of the couplers, a terminal of the splitter associated with the first coupler being connected to the fourth terminal of the coupling circuit.
    Type: Grant
    Filed: June 23, 2010
    Date of Patent: February 26, 2013
    Assignee: STMicroelectronics (Tours) SAS
    Inventors: Claire Laporte, Hilal Ezzeddine
  • Publication number: 20130038403
    Abstract: A distributed differential coupler, including a first conductive line and two second conductive lines coupled to the first one, each second conductive line including two conductive sections electrically in series, their respective junctions points being intended to be grounded.
    Type: Application
    Filed: August 10, 2012
    Publication date: February 14, 2013
    Applicant: STMicroelectronics (Tours) SAS
    Inventors: Eric Colleoni, Hilal Ezzeddine
  • Patent number: 8299869
    Abstract: A balun including on the common-mode side, an inductive element in series with a first capacitive element between a first common-mode access terminal and the ground; and on the differential-mode side, two inductive windings in series having first respective ends defining differential access terminals and having second common ends connected to ground, second capacitive elements being respectively connected in parallel on the differential-mode windings.
    Type: Grant
    Filed: December 28, 2009
    Date of Patent: October 30, 2012
    Assignee: STMicroelectronics (Tours) SAS
    Inventors: Claire Laporte, Hilal Ezzeddine
  • Patent number: 8203416
    Abstract: A spiral structure having at least one planar winding in at least one first conductive level to form at least one inductive element, wherein the winding is surrounded with a conductive plane and at least one track is formed in a second conductive level and has two ends connected by conductive vias to the plane of the first level, at diametrically opposite positions with respect to the center of the winding.
    Type: Grant
    Filed: May 21, 2008
    Date of Patent: June 19, 2012
    Assignee: STMicroelectronics S.A.
    Inventor: Hilal Ezzeddine
  • Publication number: 20120122410
    Abstract: A multiband coupling circuit including: a number of paths equal to the number of frequency bands, each path having a first terminal and a second terminal; a third terminal and a fourth terminal; a number of distributed couplers equal to the number of paths, all couplers being identical and sized according to the highest frequency band, and each coupler including a first conductive line between first and second ports connected to the first and second terminals of the concerned path, and a second conductive line coupled to the first one between third and fourth ports; a first set of attenuations between the third ports of the couplers and the third terminal of the circuit; and an array of filters between the fourth ports of the coupler and the fourth terminal of the circuit.
    Type: Application
    Filed: September 15, 2011
    Publication date: May 17, 2012
    Applicant: STMicroelectronics (Tours) SAS
    Inventors: Claire Laporte, Hilal Ezzeddine
  • Publication number: 20120062333
    Abstract: A distributed coupler including a first line intended to convey a radio signal between its two ends and a second line intended to sample, by coupling, part of the signal, wherein: one of the lines is formed on an insulating substrate; and the other line is formed in a lead frame supporting the substrate, one line being above the other.
    Type: Application
    Filed: September 8, 2011
    Publication date: March 15, 2012
    Applicant: STMicroelectronics (Tours) SAS
    Inventors: Hilal Ezzeddine, Claire Laporte
  • Publication number: 20110304014
    Abstract: A passive integrated circuit formed on a substrate, including contact areas of a conductive material specifically capable of receiving bonding pads, wherein the conductive material further creates connections between regions of a lower metallization level.
    Type: Application
    Filed: June 8, 2011
    Publication date: December 15, 2011
    Applicant: STMicroelectronics (Tours) SAS
    Inventors: Claire Laporte, Hilal Ezzeddine
  • Patent number: 8063729
    Abstract: A mode-switching transformer comprising a first line in common mode and a second line in differential mode, each line comprising two sections in series respectively coupled with one of the two sections of the other line and all sections having the same lengths, the common mode line being connected in series with a capacitor, to lower the central frequency of the transformer passband, the ?/4 lengths of the sections being chosen to correspond to a central frequency greater than the central frequency desired for the transformer.
    Type: Grant
    Filed: September 2, 2010
    Date of Patent: November 22, 2011
    Assignee: STMicroelectronics, S.A.
    Inventor: Hilal Ezzeddine
  • Patent number: 7952458
    Abstract: A mode-switching transformer with a 1-to-4 impedance ratio having a first planar winding formed in a first conductive level from a first differential mode terminal outside of the winding; a second planar winding formed in a second conductive level from a second differential mode terminal outside of the winding; a via of interconnection of the central ends of the first and second windings intended to be connected to ground; and at least one third planar winding in one of the two conductive levels, interdigited with the first or the second winding from a first common-mode terminal outside of the winding, the internal end of the third winding being connected to the via for direct grounding.
    Type: Grant
    Filed: November 29, 2006
    Date of Patent: May 31, 2011
    Assignee: STMicroelectronics S.A.
    Inventor: Hilal Ezzeddine
  • Publication number: 20110001575
    Abstract: A distributed multiband coupling circuit including: a number n of first and of second terminals equal to the number of frequency bands; a third terminal and a fourth terminal; a number n of distributed couplers equal to the number of frequency bands, all couplers being identical and sized according to the highest frequency band, and each coupler including a first conductive line between first and second ports intended to convey a signal to be transmitted in the concerned frequency band, and a second conductive line coupled to the first one between third and fourth ports; a first set of resistive splitters in cascade between the third ports of the couplers, a terminal of the splitter associated with the first coupler being connected to the third terminal of the coupling circuit; and a second set of resistive splitters in cascade between the fourth ports of the couplers, a terminal of the splitter associated with the first coupler being connected to the fourth terminal of the coupling circuit.
    Type: Application
    Filed: June 23, 2010
    Publication date: January 6, 2011
    Applicant: STMicroelectronics (Tours) SAS
    Inventors: Claire Laporte, Hilal Ezzeddine