Patents by Inventor Hillman Bailey

Hillman Bailey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230239970
    Abstract: A heater assembly that that is effective at maintaining heating lamps at acceptable temperatures is disclosed. The heater assembly utilizes radiative heat transfer to transfer unwanted heat buildup in the heating lamps to a cooling base. One or more high emissivity films are disposed between the heating lamps and the cooling base to facilitate heat transfer. Further, a reflective coating is applied to a portion of the heating lamps to reflect heat away from the cooling base. The heater assembly may be utilized in a high vacuum environment as it does not rely on convective cooling.
    Type: Application
    Filed: January 25, 2022
    Publication date: July 27, 2023
    Inventors: Dursun Moore, Julian G. Blake, Hillman Bailey, James D. Strassner, Paul Forderhase
  • Patent number: 10001335
    Abstract: In certain embodiments, a trigger assembly including a bi-stable switch system configured to selectively engage a portion of the sear in a first state and to transition from the first state to a second state to selectively disengage the portion of the sear in response to an electrical signal.
    Type: Grant
    Filed: July 31, 2015
    Date of Patent: June 19, 2018
    Assignee: TrackingPoint, Inc.
    Inventors: Roy Patterson, Mark Delz, Ehren Achee, Kevin D Brase, Hillman Bailey, Jason Peter Schauble
  • Publication number: 20160061549
    Abstract: In certain embodiments, a trigger assembly including a bi-stable switch system configured to selectively engage a portion of the sear in a first state and to transition from the first state to a second state to selectively disengage the portion of the sear in response to an electrical signal.
    Type: Application
    Filed: July 31, 2015
    Publication date: March 3, 2016
    Applicant: TRACKINGPOINT, INC.
    Inventors: Roy Patterson, Mark Delz, Ehren Achee, Kevin D. Brase, Hillman Bailey, Jason Peter Schauble
  • Publication number: 20060176466
    Abstract: The present invention is directed to a chucking system to modulate substrates so as to properly shape and position the same with respect to a wafer upon which a pattern is to be formed with the substrate. The chucking system includes a chuck body having first and second opposed sides. A side surface extends therebetween. The first side includes first and second spaced-apart recesses defining first and second spaced-apart support regions. The first support region cinctures the second support region and the first and second recesses. The second support region cinctures the second recess, with a portion of the body in superimposition with the second recess being transparent to radiation having a predetermined wavelength. The second side and the side surface define exterior surfaces. The body includes throughways placing the first and second recesses in fluid communication with one of the exterior surfaces.
    Type: Application
    Filed: March 27, 2006
    Publication date: August 10, 2006
    Inventors: Byung Choi, Ronald Voisin, Sidlgata Sreenivasan, Michael Watts, Daniel Babbs, Mario Meissl, Hillman Bailey, Norman Schumaker
  • Patent number: 7019819
    Abstract: The present invention is directed to a chucking system to modulate substrates so as to properly shape and position the same with respect to a wafer upon which a pattern is to be formed with the substrate. The chucking system includes a chuck body having first and second opposed sides. A side surface extends therebetween. The first side includes first and second spaced-apart recesses defining first and second spaced-apart support regions. The first support region cinctures the second support region and the first and second recesses. The second support region cinctures the second recess, with a portion of the body in superimposition with the second recess being transparent to radiation having a predetermined wavelength. The second side and the side surface define exterior surfaces. The body includes throughways placing the first and second recesses in fluid communication with one of the exterior surfaces.
    Type: Grant
    Filed: November 13, 2002
    Date of Patent: March 28, 2006
    Assignee: Molecular Imprints, Inc.
    Inventors: Byung J. Choi, Ronald D. Voisin, Sidlgata V. Sreenivasan, Michael P. C. Watts, Daniel Babbs, Mario J. Meissl, Hillman Bailey, Norman E. Schumaker
  • Patent number: 6982783
    Abstract: The present invention is directed to a chucking system to modulate substrates so as to properly shape and position the same with respect to a wafer upon which a pattern is to be formed with the substrate.
    Type: Grant
    Filed: June 9, 2004
    Date of Patent: January 3, 2006
    Assignee: Molecular Imprints, Inc.
    Inventors: Byung J. Choi, Ronald D. Voisin, Sidlgata V. Sreenivasan, Michael P. C. Watts, Daniel Babbs, Mario J. Meissl, Hillman Bailey, Norman E. Schumaker
  • Publication number: 20040223131
    Abstract: The present invention is directed to a chucking system to modulate substrates so as to properly shape and position the same with respect to a wafer upon which a pattern is to be formed with the substrate.
    Type: Application
    Filed: June 9, 2004
    Publication date: November 11, 2004
    Applicant: MOLECULAR IMPRINTS, INC.
    Inventors: Byung J. Choi, Ronald D. Voisin, Sidlgata V. Sreenivasan, Michael P.C. Watts, Daniel Babbs, Mario J. Meissl, Hillman Bailey, Norman E. Schumaker
  • Publication number: 20040090611
    Abstract: The present invention is directed to a chucking system to modulate substrates so as to properly shape and position the same with respect to a wafer upon which a pattern is to be formed with the substrate. The chucking system includes a chuck body having first and second opposed sides. A side surface extends therebetween. The first side includes first and second spaced-apart recesses defining first and second spaced-apart support regions. The first support region cinctures the second support region and the first and second recesses. The second support region cinctures the second recess, with a portion of the body in superimposition with the second recess being transparent to radiation having a predetermined wavelength. The second side and the side surface define exterior surfaces. The body includes throughways placing the first and second recesses in fluid communication with one of the exterior surfaces.
    Type: Application
    Filed: November 13, 2002
    Publication date: May 13, 2004
    Applicant: MOLECULAR IMPRINTS, INC.
    Inventors: Byung J. Choi, Ronald D. Voisin, Sidlgata V. Sreenivasan, Michael P.C. Watts, Daniel Babbs, Mario J. Meissl, Hillman Bailey, Norman E. Schumaker