Patents by Inventor Hilmar Kraus

Hilmar Kraus has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for encapsulating electrical and/or electronic components in a housing
    Patent number: 8821778
    Abstract: The invention relates to a method for encapsulating electrical and/or electronic components in a housing, the components being arranged on a printed circuit or a strip conductor in an assembly. Said assembly is positioned in the housing and is encapsulated with a curing, electrically insulating molding compound. The method according to the invention is characterized by encapsulating preferably in a molding chamber at a pressure below atmospheric pressure and by removing the negative pressure after encapsulation and before curing.
    Type: Grant
    Filed: August 25, 2008
    Date of Patent: September 2, 2014
    Inventor: Hilmar Kraus
  • Assembly comprising electric and/or electronic components
    Patent number: 8263880
    Abstract: A module of electric and/or electronic components, wherein the module is cast with a curable electrically insulating casting material in a housing, characterized in that at least one terminal extending at least slightly into the housing and remaining accessible from outside the housing is provided on the housing, is electrically connected to the module, and is cast together with the module from the inside.
    Type: Grant
    Filed: May 27, 2009
    Date of Patent: September 11, 2012
    Inventor: Hilmar Kraus
  • Method For Encapsulating Electrical And/Or Electronic Components In A Housing
    Publication number: 20090120685
    Abstract: The invention relates to a method for encapsulating electrical and/or electronic components in a housing, the components being arranged on a printed circuit or a strip conductor in an assembly. Said assembly is positioned in the housing and is encapsulated with a curing, electrically insulating moulding compound. The method according to the invention is characterized by encapsulating preferably in a molding chamber at a pressure below atmospheric pressure and by removing the negative pressure after encapsulation and before curing.
    Type: Application
    Filed: August 25, 2008
    Publication date: May 14, 2009
    Inventor: Hilmar Kraus