Patents by Inventor Hilton Erskine

Hilton Erskine has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11913130
    Abstract: A data storage device comprising a recording head having a high damping magnetic alloy layer including at least one magnetic alloy element, and a 5d transition element; the high damping magnetic alloy layer having a mixed face-centered cubic (fcc) and body-centered cubic (bcc) crystal structure, and the mixed fcc and bcc crystal structure comprising fcc and bcc grains, with the bcc grains having an elongated shape relative to the fcc grains, a larger size than the fcc grains, and slip deformation, thereby providing the high damping magnetic alloy layer with a damping constant of up to about 0.07.
    Type: Grant
    Filed: June 2, 2022
    Date of Patent: February 27, 2024
    Assignee: Seagate Technology LLC
    Inventors: Jie Gong, Steven C. Riemer, John A. Rice, Hilton Erskine, Michael C. Kautzky, Xuelian Xu
  • Patent number: 11377749
    Abstract: A method includes immersing a wafer in an electrolyte including a plurality of compounds having elements of a high damping magnetic alloy with very low impurity and small uniform grain size. The method also includes applying a pulsed current with a certain range of duty cycle and pulse length to the wafer when the wafer is immersed in an electrolyte. The wafer is removed from the electrolyte when a layer of the high damping magnetic alloy is formed on the wafer.
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: July 5, 2022
    Assignee: SEAGATE TECHNOLOGY LLC
    Inventors: Jie Gong, Steven C. Riemer, John A. Rice, Hilton Erskine, Michael C. Kautzky, Xuelian Xu
  • Publication number: 20190112722
    Abstract: A method includes immersing a wafer in an electrolyte including a plurality of compounds having elements of a high damping magnetic alloy with very low impurity and small uniform grain size. The method also includes applying a pulsed current with a certain range of duty cycle and pulse length to the wafer when the wafer is immersed in an electrolyte. The wafer is removed from the electrolyte when a layer of the high damping magnetic alloy is formed on the wafer.
    Type: Application
    Filed: October 17, 2017
    Publication date: April 18, 2019
    Inventors: Jie Gong, Steven C. Riemer, John A. Rice, Hilton Erskine, Michael C. Kautzky