Patents by Inventor Hin Goh

Hin Goh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package flip chip interconnect having spacer
    Publication number: 20060192295
    Abstract: A flip chip lead frame package includes a die and a lead frame having a die paddle and leads, and has a spacer to maintain a separation between the die and the die paddle. Also, methods for making the package are disclosed.
    Type: Application
    Filed: November 17, 2005
    Publication date: August 31, 2006
    Applicant: ChipPAC, Inc.
    Inventors: Jae Lee, Geun Kim, Sheila Alvarez, Robinson Quiazon, Hin Goh, Frederick Dahilig