Abstract: In order to package an electronic component, a leadframe is provided having at least one flag portion (2) and at least one lead portion (7) extending towards the flag portion (2). The lead portion (7) includes an end portion (10) of reduced thickness adjacent the flag portion (2) and a channel (9) between the end portion (10) and the rest of the lead portion. The leadframe is etched to form the channel (9) and the end portion(10), which together form a locking step. The electronic component (3) is then mounted on the flag portion (2) and electrically connected to the end of the lead portion (7). The electronic component (3), the electrical connection (5), at least the end portion (10) and the intermediate portion (9) of the lead portion (7) and at least part of the flag portion (2) are encapsulated in a plastics molding compound, which enters and fills the locking step, and is then cured.

Abstract: A leadframe (1) includes a main frame having longitudinal outer rails (4) and a number of sub-frame (8) separated from the main frame by a slit (6) extending around at least part of the perimeter of the sub-frame (8). A plurality of flag portions (2), on which a semiconductor die is to be mounted, extend from the mainframe and a plurality of lead portions (12) extend from the sub-frame (8) towards the flag portions (2). The sub-frame (8) is bent twice in a zig-zag fashion so as to be in a plane parallel to that of the main frame so that the corresponding flag and lead portions overlap without affecting the dimensions of the outer edge portion of the main frame.