Abstract: In one embodiment, an apparatus is configured for insertion into a network device and includes a printed circuit board, at least one electronic component mounted on the printed circuit board and configured for direct air-cooling, and an enclosure comprising a plurality of electronic components, an electrical connector, a fluid inlet connector, and a fluid outlet connector. A dielectric liquid is disposed within the enclosure for immersion cooling of said plurality of electronic components during operation of the network device.

Abstract: A system and method are disclosed herein. The system includes one or more processors and a memory having programming instructions stored thereon, which, when executed by the one or more processors, performs operations. The operations include retrieving historical account activity. The operations further include constructing a training data set that includes the historical inflow data, the historical outflow data, and known forecast information from the historical account activity. The operations further include generating a combined prediction model configured to forecast future inflow activity and future outflow activity. The operations further include receiving current inflow activity, current outflow activity, and current balance information for a user.

Abstract: In one embodiment, an apparatus includes an enclosure configured for connection to a printed circuit board, a substrate within the enclosure, a plurality of components mounted on the substrate, a fluid inlet connector, a fluid outlet connector, and a plurality of flow channels within the enclosure, at least one of the components disposed in each the flow channels and segregated from other components in another of the flow channels. The enclosure is configured for immersion cooling of the components.

Abstract: In one embodiment, an apparatus includes an enclosure configured for connection to a printed circuit board, a substrate within the enclosure, a plurality of components mounted on the substrate, a fluid inlet connector, a fluid outlet connector, and a plurality of flow channels within the enclosure, at least one of the components disposed in each the flow channels and segregated from other components in another of the flow channels. The enclosure is configured for immersion cooling of the components.

Abstract: Presented herein is a plurality of arrangements of cold plates having interior chambers. The interior chamber includes a plurality of fins with a first fin zone and a second fin zone. The cold plate further includes a first fluid inlet and a first fluid outlet. The cold plates can be connected such that each cold plate allows unidirectional flow or counter flow configurations. Unidirectional flow or counter flow cold plates can be arranged in rows and in combination of rows.

Abstract: Presented herein is a plurality of arrangements of cold plates having interior chambers. The interior chamber includes a plurality of fins with a first fin zone and a second fin zone. The cold plate further includes a first fluid inlet and a first fluid outlet. The cold plates can be connected such that each cold plate allows unidirectional flow or counter flow configurations. Unidirectional flow or counter flow cold plates can be arranged in rows and in combination of rows.

Abstract: Presented herein are optical module cage designs and heatsink configurations for improved air cooling of pluggable optical modules disposed within the optical module cages. The designs and configurations presented herein facilitate efficient air cooling of higher power pluggable optical modules by enhancing airflow through the optical module cages, increasing contact between the optical modules and the heatsinks, and/or increasing the heatsink dissipation surface area.

Abstract: In one embodiment, an apparatus includes an enclosure configured for connection to a printed circuit board, a substrate within the enclosure, a plurality of components mounted on the substrate, a fluid inlet connector, a fluid outlet connector, and a plurality of flow channels within the enclosure, at least one of the components disposed in each the flow channels and segregated from other components in another of the flow channels. The enclosure is configured for immersion cooling of the components.

Abstract: In one embodiment, an apparatus is configured for insertion into a network device and includes a printed circuit board, at least one electronic component mounted on the printed circuit board and configured for direct air-cooling, and an enclosure comprising a plurality of electronic components, an electrical connector, a fluid inlet connector, and a fluid outlet connector. A dielectric liquid is disposed within the enclosure for immersion cooling of said plurality of electronic components during operation of the network device.

Abstract: Presented herein are optical module cage designs and heatsink configurations for improved air cooling of pluggable optical modules disposed within the optical module cages. The designs and configurations presented herein facilitate efficient air cooling of higher power pluggable optical modules by enhancing airflow through the optical module cages, increasing contact between the optical modules and the heatsinks, and/or increasing the heatsink dissipation surface area.

Abstract: A network communications device includes a chassis, a plurality of modules removably inserted into a plurality of slots in the chassis. A coolant is delivered to a first group of the plurality of modules with a first flow control valve in a first cooling loop and the coolant is delivered to a second group of the plurality of modules with a second flow control valve in a second cooling loop. The network communication device further includes a plurality of sensors for monitoring a temperature in the first cooling loop and the second cooling loop and a control system for controlling delivery of the coolant to the first group and the second group, where the control system controls transmitting a signal to one of the first flow control valve and the second flow control valve to modify a flow of the coolant.

Abstract: In one embodiment, a network communications device includes a chassis, a plurality of modules removably inserted into a plurality of slots in the chassis, at least a portion of the modules each comprising a connector for receiving coolant for cooling components on the module, a controller for controlling coolant distribution to the modules, and a leak detection system for identifying a leak of the coolant and transmitting an indication of the leak to the controller.

Abstract: According to one aspect, an apparatus includes a first component, a plurality of line card slots, a fan array, and a sensor arrangement. The first component has a first opening defined therein and a second opening defined therein. The first component includes a first configurable line card flapper is arranged to at least partially cover the first opening and a second configurable line card flapper is arranged to at least partially cover the second opening. The plurality of line card slots includes a first line card slot associated with the first opening and a second line card slot associated with the second opening. The fan array includes a plurality of fans. The sensor arrangement includes at least one sensor arranged to monitor at least one condition. The first and second configurable line card flappers are arranged to be configured using information obtained from the sensor arrangement.

Abstract: An apparatus includes a cage structure and a cooling plate configured to contain a cooling liquid to cool the cage structure. The cage structure has a front end, a top surface adjacent to the front end, a first opening at the front end, and a second opening on the top surface. The first opening is configured to receive a pluggable optical module. The cooling plate is disposed on top of the second opening of the cage structure. The apparatus may further include a deformable pad disposed at the second opening of the cage structure and beneath the cooling plate.

Abstract: Presented herein is a plurality of arrangements of cold plates having interior chambers. The interior chamber includes a plurality of fins with a first fin zone and a second fin zone. The cold plate further includes a first fluid inlet and a first fluid outlet. The cold plates can be connected such that each cold plate allows unidirectional flow or counter flow configurations. Unidirectional flow or counter flow cold plates can be arranged in rows and in combination of rows.

Abstract: Presented herein are optical module cage designs and heatsink configurations for improved air cooling of pluggable optical modules disposed within the optical module cages. The designs and configurations presented herein facilitate efficient air cooling of higher power pluggable optical modules by enhancing airflow through the optical module cages, increasing contact between the optical modules and the heatsinks, and/or increasing the heatsink dissipation surface area.

Abstract: Presented herein are optical module cage designs and heatsink configurations for improved air cooling of pluggable optical modules disposed within the optical module cages. The designs and configurations presented herein facilitate efficient air cooling of higher power pluggable optical modules by enhancing airflow through the optical module cages, increasing contact between the optical modules and the heatsinks, and/or increasing the heatsink dissipation surface area.

Abstract: In one embodiment, an optical module cage includes a first opening for slidably receiving an optical module, a second opening positioned adjacent to the first opening for slidably receiving a riding heatsink separate from the optical module or an integrated heatsink connected to the optical module, and a guide rail interposed between the first opening and the second opening, wherein the guide rail is configured to support the riding heatsink and not interfere with insertion of the integrated heatsink.

Abstract: In one embodiment, an apparatus includes a frame for attaching to a module with contacts of the module exposed for mating with a connector operable to couple the module to a printed circuit board, the frame comprising a seal for positioning on opposing faces of the module adjacent to the contacts to protect a module to connector interface from contaminants passing through a network device with the module installed in the network device.

Abstract: In one embodiment, an optical module cage includes a first opening for slidably receiving an optical module, a second opening positioned adjacent to the first opening for slidably receiving a riding heatsink separate from the optical module or an integrated heatsink connected to the optical module, and a guide rail interposed between the first opening and the second opening, wherein the guide rail is configured to support the riding heatsink and not interfere with insertion of the integrated heatsink.