Patents by Inventor Hin P. E. Lee
Hin P. E. Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7092206Abstract: A magnetic head includes a magnetic write structure having a first magnetic layer having a first pole, a second magnetic layer having a second pole spaced apart from the first pole, and a third magnetic layer having a third pole contacting the second pole. The third pole has a third-pole width greater than a second-pole width. An inductive coil positioned adjacent to the third magnetic layer controllably magnetizes the third magnetic layer. The third magnetic layer is nonuniformly thick such that a thickness of the third pole is less than a thickness of the third magnetic layer at locations in registry with the inductive coil. The magnetic write structure is conveniently fabricated by depositing the magnetic layers and the inductive coil, masking the third magnetic layer other than the third pole, and removing a portion of the thickness of the third pole.Type: GrantFiled: June 25, 2003Date of Patent: August 15, 2006Assignee: Hitachi Global Storage Technologies Netherlands B.V.Inventors: Wen-Chien D. Hsiao, Hin P. E. Lee, Jyh-Shuey Lo, Yansheng Luo, Samuel W. Yuan
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Publication number: 20040264046Abstract: A magnetic head includes a magnetic write structure having a first magnetic layer having a first pole, a second magnetic layer having a second pole spaced apart from the first pole, and a third magnetic layer having a third pole contacting the second pole. The third pole has a third-pole width greater than a second-pole width. An inductive coil positioned adjacent to the third magnetic layer controllably magnetizes the third magnetic layer. The third magnetic layer is nonuniformly thick such that a thickness of the third pole is less than a thickness of the third magnetic layer at locations in registry with the inductive coil. The magnetic write structure is conveniently fabricated by depositing the magnetic layers and the inductive coil, masking the third magnetic layer other than the third pole, and removing a portion of the thickness of the third pole.Type: ApplicationFiled: June 25, 2003Publication date: December 30, 2004Applicant: Hitachi Global Storage TechnologiesInventors: Wen-Chien D. Hsiao, Hin P.E. Lee, Jyh-Shuey Lo, Yansheng Luo, Samuel W. Yuan
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Patent number: 5588199Abstract: A method of lapping magnetoresistive (MR) heads individually which provides an MR element having a desired height with minimized skew is described. During fabrication of the MR head, one or more shunt resistors are formed between the edge of the MR element and the head air bearing surface. The shunt resistors are electrically connected at each end to extensions of the MR electrical leads and connected to the MR element and to each other at points between the ends forming a resistor network. During lapping of the MR head, the resistance of the resistor network is measured by an Ohmmeter connected between the MR element leads. As portions of the shunt resistors are ground away, the changes in the measured resistance of the resistor network are used to monitor and control any skew in the lapping process.Type: GrantFiled: November 14, 1994Date of Patent: December 31, 1996Assignee: International Business Machines CorporationInventors: Mohamad T. Krounbi, Hin P. E. Lee, David J. Seagle
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Patent number: 5486968Abstract: Disclosed is a planarizing layer for use in an MR read/inductive write head combination, and a method for constructing the same. In the preferred embodiment, a planarizing layer comprising a plurality of planar sections of conductive material is formed in the plane of the lower pole piece of an inductive head. The planar sections, in cooperation with the lower pole piece, provide a substantially planar surface on which to form the inductive coil. Two of the planar sections are electrically coupled to respective MR leads, and include protrusions extending from the perimeter of the inductive coil to enable electrical access by a pair of read terminal pads. A third planar section is electrically coupled to the inner coil tap of the inductive coil, and includes a protrusion extending from the perimeter of the inductive coil to enable electrical access by a write terminal pad.Type: GrantFiled: November 10, 1993Date of Patent: January 23, 1996Assignee: International Business Machines CorporationInventors: Hin P. E. Lee, Douglas J. Werner
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Patent number: 5388019Abstract: Magnetic thin film structures are disclosed including a laminate of a layer of nonmagnetic material sandwiched between first and second layers of magnetic material and at least one edge closure layer of magnetic material disposed on a side edge of the laminate with the edge closure layer being in magnetic contact with the first and second layers of magnetic material. The edge closure layer eliminates magnetic edge closure domains and magnetic edge-curling walls in the yoke and poletip regions, or in a fluxguide of a magnetic recording head to substantially eliminate Barkhausen noise and wall network instabilities. Multiple layer laminates are also disclosed having a plurality of nonmagnetic layers each of which are sandwiched between layers of magnetic material and wherein the laminate includes edge closure layers that contact all the magnetic layers. Several methods are disclosed for fabricating the laminate.Type: GrantFiled: December 7, 1993Date of Patent: February 7, 1995Assignee: International Business Machines CorporationInventors: Bernell E. Argyle, Thomas C. Arnoldussen, Thomas J. Beaulieu, Dean A. Herman, Jr., Sol Krongelb, Hin P. E. Lee, Daniel A. Nepela, Bojan Petek, Lubomyr T. Romankiw, John C. Slonczewski
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Patent number: 5331728Abstract: Magnetic thin film structures including a laminate of a layer of nonmagnetic material sandwiched between first and second layers of magnetic material and at least one edge closure layer of magnetic material disposed on a side edge of the laminate with the edge closure layer being in magnetic contact with the first and second layers of magnetic material. The edge closure layer eliminates magnetic edge closure domains and magnetic edge-curling walls in the yoke and poletip regions, or in a fluxguide of a magnetic recording head to substantially eliminate Barkhausen noise and wall network instabilities. Multiple layer laminates are also disclosed having a plurality of nonmagnetic layers each of which are sandwiched between layers of magnetic material and wherein the laminate includes edge closure layers that contact all the magnetic layers. Several methods are disclosed for fabricating the laminate. In one class of technique, the side edges are deposited together with a top layer in a single plating operation.Type: GrantFiled: May 13, 1991Date of Patent: July 26, 1994Assignee: International Business Machines CorporationInventors: Bernell E. Argyle, Thomas C. Arnoldussen, Thomas J. Beaulieu, Dean A. Herman, Jr., Sol Krongelb, Hin P. E. Lee, Daniel A. Nepela, Bojan Petek, Lubomyr T. Romankiw, John C. Slonczewski
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Patent number: 5032945Abstract: Magnetic thin film structures are disclosed including a laminate of a layer of nonmagnetic material sandwiched between first and second layers of magnetic material and at least one edge closure layer of magnetic material disposed on a side edge of the laminate with the edge closure layer being in magnetic contact with the first and second layers of magnetic material. The edge closure layer eliminates magnetic edge closure domains and magnetic edge-curling walls in the yoke and poletip regions, or in a fluxguide of a magnetic recording head to substantially eliminate Barkhausen noise and wall network instabilities. Multiple layer laminates are also disclosed having a plurality of nonmagnetic layers each of which are sandwiched between layers of magnetic material and wherein the laminate includes edge closure layers that contact all the magnetic layers. Several methods are disclosed for fabricating the laminate.Type: GrantFiled: November 7, 1989Date of Patent: July 16, 1991Assignee: International Business Machines Corp.Inventors: Bernell E. Argyle, Thomas C. Arnoldussen, Thomas J. Beaulieu, Dean A. Herman, Jr., Sol Krongelb, Hin P. E. Lee, Daniel A. Nepela, Bojan Petek, Lubomyr T. Romankiw, John C. Slonczewski