Abstract: Substrate structure comprising a substrate (6) and a plasma grown layer (6a). The surface of the resulting substrate structure (7) is characterized by interrelated scaling components. The scaling components comprise a roughness exponent ?, a growth exponent ? and a dynamic exponent z, wherein the growth exponent ? has a value of less than 0.2 and the dynamic exponent z has a value of more than 6. Also disclosed is a method to provide such a substrate structure.

Abstract: Method and plasma treatment apparatus for treatment of a substrate surface (1) using an atmospheric pressure plasma. An atmospheric pressure plasma is provided in a treatment space (5) between a first electrode (2) and a second electrode (3). Furthermore, a substrate (1) and a mask web (7) in contact with the substrate (1) are provided. A plasma generating power is applied to the first and second electrode (2, 3) for treatment of surface areas of the substrate (1) exposed by the mask web (7), in which the substrate (1) and mask web (7) are moved synchronously through the treatment space (5).

Abstract: A method and apparatus for treatment of a substrate surface using an atmospheric pressure plasma is disclosed. The method comprises providing an atmospheric pressure plasma in a treatment space between a first electrode and a second electrode, providing a substrate in contact with the first electrode in the treatment space, and applying a plasma generating power to the first and second electrodes. The first electrode has a predefined structure of insulating areas and conductive areas for plasma treatment of surface areas of the substrate corresponding to the areas in contact with the conductive areas of the first electrode.

Abstract: A method and apparatus for manufacturing a multi-layer stack structure (12), the structure (12) comprising in order: a substrate (6a) a barrier layer (14) an adhesive layer (15) a barrier layer (14) a substrate (6b). The method comprises: a) providing two substrates (6a, 6b) in a single treatment space (5), the treatment space (5) comprising at least two electrodes (2, 3) for generating an atmospheric pressure glow discharge plasma in the treatment space (5); b) treating the facing surfaces of the two substrates (6a, 6b) simultaneously in the single treatment space (5); c) laminating the two treated substrates (6a, 6b) with an adhesive layer (15) in between the facing surfaces to obtain the multi-layer stack structure (12).

Abstract: Plasma treatment apparatus and method for treatment of a surface of a substrate. A dielectric barrier discharge electrode structure is provided having a treatment space (5) and comprising a first electrode (2) and a second electrode (3), and a power supply (11) connected to the first electrode (2) and the second electrode (3) for generating an atmospheric pressure plasma in the treatment space (5). The plasma treatment apparatus further comprises a magnetic layer (6) provided on a surface of at least the first electrode (2). The first electrode (2) is arranged to receive, in operation, the substrate (1) to be treated and a mask device (7) in contact with the substrate (1), the mask device (7) interacting with the magnetic layer (6).

Abstract: Disclosed are methods for deposition of a chemical compound or element using an atmospheric pressure glow discharge plasma in a treatment space comprising two electrodes connected to a power supply for providing electrical power during an on-time (ton). The treatment space is filled with a gas composition of an active and an inert gas mixture, including a precursor of the chemical compound or element to be deposited. Dust formation is prevented by using Nitrogen in the gas composition, applying short pulses and using a predetermined residence time of the gas composition in the treatment space. Best results are obtained when using a stabilized plasma.

Abstract: Substrate structure comprising a substrate (6) and a plasma grown layer (6a). The surface of the resulting substrate structure (7) is characterized by interrelated scaling components. The scaling components comprise a roughness exponent ?, a growth exponent ? and a dynamic exponent z, wherein the growth exponent ? has a value of less than 0.2 and the dynamic exponent z has a value of more than 6. Also disclosed is a method to provide such a substrate structure.

Abstract: fcPlasma treatment apparatus for treating a substrate (6) comprising at least two opposing electrodes (2, 3) and a treatment space (5). The at least two electrodes (2, 3) are connected to a plasma control unit (4) for generating an atmospheric pressure glow discharge plasma in the treatment space (5). A gas supply device (8) provides a gas mixture in the treatment space (5). In operation, a first layer of inorganic material is deposited on a polymeric substrate using a gas composition comprising oxygen having a concentration of 2% or less, while the power supply provides an energy of 30 J/cm2 or less. A second layer of inorganic material is deposited on the first layer using a gas composition comprising oxygen having a concentration of 3% or higher. During the second layer formation the power supply provides an energy of 40 J/cm2 or higher.

Abstract: Plasma treatment apparatus and method for producing a polymeric substrate using an atmospheric pressure glow discharge plasma in a treatment space formed between two or more opposing electrodes connected to a power supply using a gas composition in the treatment space comprising a precursor and oxygen. A first layer of inorganic material is deposited on a polymeric substrate with a largest thickness (d3) of at least 100% of an Rt-value being defined as the maximum peak to valley height of the profile of the polymeric substrate measured substantially perpendicular to the surface of the polymeric substrate. A second layer of inorganic material is deposited on the first layer, wherein in the treatment space the oxygen has a concentration of 3% or higher, and the power supply is controlled to provide an energy across a gap between the two or more opposing electrodes of 40 J/cm2 or higher.

Abstract: The present invention relates to a method of and arrangement for removing contaminants from a surface of a substrate by subjecting said substrate surface to an atmospheric pressure glow plasma. Said plasma is generated in a discharge space comprising a plurality of electrodes, by applying an alternating plasma energizing voltage to said electrodes causing a plasma current and a displacement current. Said plasma is stabilised by controlling said displacement current during plasma generation such that modification of properties of said substrate surface is prevented.

Abstract: Method and apparatus for treatment of a substrate surface (1) using an atmospheric pressure plasma. The method comprises providing an atmospheric pressure plasma in a treatment space (5) between a first electrode (2) and a second electrode (3), providing a substrate (1) in contact with the first electrode (2) in the treatment space (5), and applying a plasma generating power to the first and second electrode (2, 3). The first electrode (2) has a predefined structure of insulating areas (7) and conductive areas (8) for plasma treatment of surface areas of the substrate (1) corresponding to the areas in contact with the conductive areas (8) of the first electrode (2).

Abstract: A method and apparatus for manufacturing a multi-layer stack structure (12), the structure (12) comprising in order: a substrate (6a) a barrier layer (14) an adhesive layer (15) a barrier layer (14) a substrate (6b). The method comprises: a) providing two substrates (6a, 6b) in a single treatment space (5), the treatment space (5) comprising at least two electrodes (2, 3) for generating an atmospheric pressure glow discharge plasma in the treatment space (5); b) treating the facing surfaces of the two substrates (6a, 6b) simultaneously in the single treatment space (5); c) laminating the two treated substrates (6a, 6b) with an adhesive layer (15) in between the facing surfaces to obtain the multi-layer stack structure (12).

Abstract: Method and plasma treatment apparatus for treatment of a substrate surface (1) using an atmospheric pressure plasma. An atmospheric pressure plasma is provided in a treatment space (5) between a first electrode (2) and a second electrode (3). Furthermore, a substrate (1) and a mask web (7) in contact with the substrate (1) are provided. A plasma generating power is applied to the first and second electrode (2, 3) for treatment of surface areas of the substrate (1) exposed by the mask web (7), in which the substrate (1) and mask web (7) are moved synchronously through the treatment space (5).

Abstract: Plasma treatment apparatus and method for treating a substrate (6, 7) e.g. for deposition of a layer on the substrate (6, 7). Two opposing electrodes (2, 3) and a treatment space (5) are provided. A dielectric barrier (6, 7; 2a, 3a), comprising in operation the substrate, is provided in the treatment space (5) between the at least two opposing electrodes (2, 3) which are connected to a plasma control unit (4). A gap distance (g) is the free distance in the treatment space (5) of a gap between the at least two opposing electrodes (2, 3) in operation. A total dielectric distance (d) is the sum of the dielectric thickness of the dielectric layers (2a, 3a) and the substrate (6, 7). The product of gap distance (g) and total dielectric distance (d) is controlled to a value less than or equal to 1.0 mm2.

Abstract: Apparatus and method for atomic layer deposition on a surface of a substrate (6) in a treatment space. A gas supply device (15, 16) is present for providing various gas mixtures to the treatment space (1, 2). The gas supply device (15, 16) is arranged to provide a gas mixture with a precursor material to the treatment space for allowing reactive surface sites to react with precursor material molecules to give a surface covered by a monolayer of precursor molecules attached via the reactive sites to the surface of the substrate. Subsequently, a gas mixture comprising a reactive agent capable to convert the attached precursor molecules to active precursor sites is provided. A plasma generator (10) is present for generating an atmospheric pressure plasma in the gas mixture comprising the reactive agent, the plasma generator being arranged remote from the treatment space (1, 2).

Abstract: Method and apparatus for generating and sustaining a glow discharge plasma in a plasma discharge space comprising at least two spaced electrodes. The method and apparatus are arranged for performing the steps of introducing in the discharge space a gas or gas mixture under atmospheric pressure conditions, energizing the electrodes by applying an AC energizing voltage (Va) to the electrodes, and controlling the energizing voltage (Va) such that at plasma generation a sharp relative decrease of displacement current is provided.

Abstract: Plasma treatment apparatus and method for treatment of a surface of a substrate. A dielectric barrier discharge electrode structure is provided having a treatment space (5) and comprising a first electrode (2) and a second electrode (3), and a power supply (11) connected to the first electrode (2) and the second electrode (3) for generating an atmospheric pressure plasma in the treatment space (5). The plasma treatment apparatus further comprises a magnetic layer (6) provided on a surface of at least the first electrode (2). The first electrode (2) is arranged to receive, in operation, the substrate (1) to be treated and a mask device (7) in contact with the substrate (1), the mask device (7) interacting with the magnetic layer (6).

Abstract: Apparatus and method for atomic layer deposition on a surface of a substrate (6) in a treatment space. A gas supply device (15, 16) is present for providing various gas mixtures to the treatment space. The gas supply device (15, 16) is arranged to provide a gas mixture with a precursor material to the treatment space for allowing reactive surface sites to react with precursor material molecules to give a surface covered by a monolayer of precursor molecules attached via the reactive sites to the surface of the substrate. Subsequently, a gas mixture comprising a reactive agent capable to convert the attached precursor molecules to active precursor sites is provided. A plasma generator (10) is present for generating an atmospheric pressure plasma in the gas mixture comprising the reactive agent.

Abstract: Method and plasma generating apparatus for generating an atmospheric pressure glow discharge plasma in a treatment space (5) filled with a gas composition. Two electrodes (2, 3) are connected to a power supply (4) for providing electrical power during an on-time (ton). The power supply (4) is arranged to provide a periodic signal with an on-time (ton) which is shorter than a predetermined time period, the predetermined time period corresponding substantially to the time necessary for a dust coagulation center from the gas composition to become a cluster in the treatment space (5). This method and apparatus may be used for depositing a layer of material on a substrate (6) in the treatment space (5).

Abstract: Method and apparatus for deposition of a chemical compound or element using an atmospheric pressure glow discharge plasma in a treatment space (5) comprising two electrodes (2, 3) connected to a power supply (4) for providing electrical power during an on-time (ton), the treatment space is filled with a gas composition of an active and an inert gas mixture, including a precursor of the chemical compound or element to be deposited. Dust formation is prevented by using Nitrogen in the gas composition, applying short pulses and using a predetermined residence time of the gas composition in the treatment space. Best results are obtained when using a stabilized plasma.