Patents by Inventor Hing Kuan

Hing Kuan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Delineation of wafers
    Publication number: 20060145074
    Abstract: A method of junction delineation of non-epitaxial wafers comprises the steps of preparing a sample of the wafer, staining the sample using a mixture of between one and three parts hydrofluoric acid to fifty parts nitric acid to twenty parts water, and scanning the sample with a scanning electron microscope.
    Type: Application
    Filed: January 6, 2005
    Publication date: July 6, 2006
    Inventor: Hing Kuan