Patents by Inventor Hing Kuong Wong

Hing Kuong Wong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of operating a clamping system of a wire bonding machine
    Patent number: 8360304
    Abstract: A method of operating a wire bonding machine is provided. The method includes the steps of: (1) providing a workpiece secured in a bonding position by a device clamp of a wire bonding machine; (2) raising the device clamp to a first height above the workpiece, the device clamp remaining at the first height for a first predetermined period of time; and (3) raising the device clamp to a second height above the workpiece after step (2), the second height being further away from the workpiece than the first height.
    Type: Grant
    Filed: July 19, 2010
    Date of Patent: January 29, 2013
    Assignee: Kulicke and Soffa Industries Inc.
    Inventors: Sung Sig Kang, Hing Kuong Wong, Samuel Capistrano, III, Abdul Shukor Mohd Salleh, Wun Man Oranna Yauw
  • METHOD OF OPERATING A CLAMPING SYSTEM OF A WIRE BONDING MACHINE
    Publication number: 20120104075
    Abstract: A method of operating a wire bonding machine is provided. The method includes the steps of: (1) providing a workpiece secured in a bonding position by a device clamp of a wire bonding machine; (2) raising the device clamp to a first height above the workpiece, the device clamp remaining at the first height for a first predetermined period of time; and (3) raising the device clamp to a second height above the workpiece after step (2), the second height being further away from the workpiece than the first height.
    Type: Application
    Filed: July 19, 2010
    Publication date: May 3, 2012
    Applicant: KULICKE AND SOFFA INDUSTRIES, INC.
    Inventors: Sung SIK Kang, Hing Kuong Wong, Samuel Capistrano, III, Mohd Salleh Abdul Shukor, Oranna Yauw