Abstract: A transducer assembly for a bonding apparatus is provided that comprises a horn having first and second base ends and a bonding tool attached to the horn between the first and second base ends. First and second ultrasonic generators are secured to the first and second base ends respectively. A first fastening mechanism is located on the horn between the bonding tool and the first ultrasonic generator and a second fastening mechanism is located on the horn between the bonding tool and the second ultrasonic generator such that the horn is releasably attachable to a mounting interface using the first and second fastening mechanisms. There are also transducer mounting positions disposed on the mounting interface for mounting the mounting interface to a bond head.

Abstract: A capillary holder for mounting a capillary onto a horn is provided that comprises a mounting hole formed in the horn that has a first width along a first axis that is smaller than a width of the capillary and a second width along a second axis perpendicular to the first axis that is larger than the width of the capillary. In particular, the mounting hole is configured such that application of a flexion force to reduce the second width simultaneously expands the first width so as to fit the capillary when the first width is larger than the width of the capillary, and removal of said flexion force contracts the first width whereby to grip the capillary using an elastic force of the horn.

Abstract: A bonding tool and method for bonding a semiconductor chip to a surface is provided wherein the bonding tool includes a bonding tip comprising a ceramic material, preferably titanium carbide. The bonding tip is operative to hold the chip and a bonding energy generator such as an ultrasonic transducer is coupled to the bonding tip for applying bonding energy to the bonding tip and the chip to bond the chip to the surface. The bonding tip may further include martensite such that the titanium carbide is present in a hard phase and the martensite is present in a soft phase as a binder for the same.