Patents by Inventor Hing Siu

Hing Siu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flip chip bonding tool
    Publication number: 20060076391
    Abstract: A bonding tool and method for bonding a semiconductor chip to a surface is provided wherein the bonding tool includes a bonding tip comprising a ceramic material, preferably titanium carbide. The bonding tip is operative to hold the chip and a bonding energy generator such as an ultrasonic transducer is coupled to the bonding tip for applying bonding energy to the bonding tip and the chip to bond the chip to the surface. The bonding tip may further include martensite such that the titanium carbide is present in a hard phase and the martensite is present in a soft phase as a binder for the same.
    Type: Application
    Filed: October 13, 2004
    Publication date: April 13, 2006
    Applicant: ASM Assembly Automation Ltd.
    Inventors: Ran Fu, Deming Liu, Chi Chaw, Hing Li, Chak Pang, Hing Siu