Patents by Inventor Hing To

Hing To has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11983141
    Abstract: A system for executing an application on a pool of reconfigurable processors with first and second reconfigurable processors having first and second architectures that are different from each other is presented. The system comprises an archive of configuration files with first and second configuration files for executing the application on the first and second reconfigurable processors, respectively, and a host system that is operatively coupled to the first and second reconfigurable processors. The host system comprises a runtime processor that allocates reconfigurable processors for executing the application and an auto-discovery module that is configured to perform discovery of whether the reconfigurable processors include at least one of the first reconfigurable processors and whether the reconfigurable processors include at least one of the second reconfigurable processors.
    Type: Grant
    Filed: September 9, 2022
    Date of Patent: May 14, 2024
    Assignee: SambaNova Systems, Inc.
    Inventors: Greg Dykema, Maran Wilson, Guoyao Feng, Kuan Zhou, Tianyu Sun, Taylor Lee, Kin Hing Leung, Arnav Goel, Conrad Turlik, Milad Sharif
  • Patent number: 11974701
    Abstract: According to one example, a cookware vessel includes a bracket coupled to an exterior of a vessel, and a detachable handle. The handle includes a grip portion, a coupling fixedly attached to the grip portion, an actuator rotatingly coupled to the handle, and a spring. The coupling has a channel that is configured to surround at least a portion of an upper horizontally extending rod of the bracket. The actuator has a top portion configured to engage and disengage an upper edge of the bracket when the actuator is rotated forward and backward. The actuator also has hooks configured to engage and disengage a lower horizontally extending rod of the bracket when the actuator is rotated forward and backward. The spring is configured to apply a force to the actuator so as to rotate the actuator forward, when the actuator is released by a user.
    Type: Grant
    Filed: September 29, 2021
    Date of Patent: May 7, 2024
    Assignee: Meyer Intellectual Properties Limited
    Inventors: Hing Fai Chan, Stanley Kin Sui Cheng
  • Patent number: 11975059
    Abstract: The invention features multi-specific fusion protein complexes with one domain comprising IL-15 or a functional variant and a binding domain specific to IL-12 or IL-18.
    Type: Grant
    Filed: December 1, 2023
    Date of Patent: May 7, 2024
    Assignee: Altor Bioscience, LLC.
    Inventors: Warren D. Marcus, Robert Newman, Bai Liu, Lijing You, Lin Kong, Peter Rhode, Hing C. Wong
  • Publication number: 20240145566
    Abstract: A method includes forming a structure having a dummy gate stack over a multi-layer stack (ML) disposed on a semiconductor substrate, the ML including alternating channel layers and non-channel layers; recessing the ML in source/drain (S/D) regions; removing the non-channel layers to form first openings between the channel layers; depositing a dielectric material in the first openings; recessing the dielectric material to form undercuts; forming inner spacers in the undercuts; forming epitaxial S/D features in the S/D regions; removing the dummy gate stack to form a gate trench; removing the dielectric material from the gate trench to form second openings between the channel layers; and forming a metal gate stack in the gate trench and the second openings.
    Type: Application
    Filed: January 26, 2023
    Publication date: May 2, 2024
    Inventors: Ka-Hing Fung, Wei-Yang Lee, Huiling Shang
  • Publication number: 20240132561
    Abstract: Provided herein are multi-chain chimeric polypeptides that include: (a) a first chimeric polypeptide including a first target-binding domain, a soluble tissue factor domain, and a first domain of a pair of affinity domains; and (b) a second chimeric polypeptide including a second domain of a pair of affinity domains and a second target-binding domain, where the first chimeric polypeptide and the second chimeric polypeptide associate through the binding of the first domain and the second domain of the pair of affinity domains. Also provided here are methods of using these multi-chain chimeric polypeptides and nucleic acids encoding these multi-chain chimeric polypeptides.
    Type: Application
    Filed: October 30, 2023
    Publication date: April 25, 2024
    Applicant: HCW Biologics, Inc.
    Inventor: Hing Wong
  • Publication number: 20240131115
    Abstract: The invention features combination therapies using an IL-15-based superagonist complex and an antibody to effectively treat subjects with cancer and infectious diseases.
    Type: Application
    Filed: December 22, 2023
    Publication date: April 25, 2024
    Inventors: Bai Liu, Peter Rhode, Wenxin Xu, Hing C. Wong
  • Publication number: 20240135352
    Abstract: A platform and process for electronic payment processing using electronic communications from different communication channels or bands. The system and process can generate alerts using fraud detection and verify payment requests using historical data and pattern recognition. The system and process can categorize images and extract payment data.
    Type: Application
    Filed: January 3, 2024
    Publication date: April 25, 2024
    Applicant: Bank of Montreal
    Inventors: Brian Chan, Kashif Arshad, Peter Hing-Cheong Poon, Vikram Pal
  • Patent number: 11965007
    Abstract: The invention features multi-specific fusion protein complexes with one domain comprising IL-15 or a functional variant and a binding domain specific to IL-7 or IL-21.
    Type: Grant
    Filed: October 18, 2021
    Date of Patent: April 23, 2024
    Assignee: Altor Bioscience, LLC.
    Inventor: Hing C. Wong
  • Publication number: 20240124543
    Abstract: Provided herein are multi-chain chimeric polypeptides that include: (a) a first chimeric polypeptide including a first target-binding domain, a soluble tissue factor domain, and a first domain of a pair of affinity domains; and (b) a second chimeric polypeptide including a second domain of a pair of affinity domains and a second target-binding domain, where the first chimeric polypeptide and the second chimeric polypeptide associate through the binding of the first domain and the second domain of the pair of affinity domains. Also provided here are methods of using these multi-chain chimeric polypeptides and nucleic acids encoding these multi-chain chimeric polypeptides.
    Type: Application
    Filed: October 30, 2023
    Publication date: April 18, 2024
    Applicant: HCW Biologics, Inc.
    Inventor: Hing Wong
  • Publication number: 20240124544
    Abstract: Provided herein are multi-chain chimeric polypeptides that include: (a) a first chimeric polypeptide including a first target-binding domain, a soluble tissue factor domain, and a first domain of a pair of affinity domains; and (b) a second chimeric polypeptide including a second domain of a pair of affinity domains and a second target-binding domain, where the first chimeric polypeptide and the second chimeric polypeptide associate through the binding of the first domain and the second domain of the pair of affinity domains. Also provided here are methods of using these multi-chain chimeric polypeptides and nucleic acids encoding these multi-chain chimeric polypeptides.
    Type: Application
    Filed: October 30, 2023
    Publication date: April 18, 2024
    Applicant: HCW Biologics, Inc.
    Inventor: Hing Wong
  • Patent number: 11957552
    Abstract: A garment comprises a main body including a front portion, a back portion, and a gusset connecting the front portion and the back portion. The gusset has left and right lateral edges partially defining respective left and right leg openings of the garment. A layer of absorbent material is coupled to an inner face of the main body at least at the gusset. A layer of waterproof material is sandwiched between the main body and the layer of absorbent material. Left and right elastic bands couple the layer of absorbent material and the layer of waterproof material to the main body along the respective left and right lateral edges of the gusset. A method for manufacturing the absorbent garment is also provided.
    Type: Grant
    Filed: September 15, 2021
    Date of Patent: April 16, 2024
    Assignee: Mast Industries (Far East) Limited
    Inventors: Suet Hing Yip, Fung Yee Debby Au
  • Publication number: 20240116127
    Abstract: An ultrasonic transducer that is configured to selectively operate at first or second resonant frequency during wire bonding operations includes an elongated transducer body an aperture for mounting a piezoelectric driver stack for driving the ultrasonic transducer to operate at the first or second resonant frequency and a mounting flange connected to the transducer body at a first nodal vibration region of the transducer body when the ultrasonic transducer is operated at the first resonant frequency. The elongated transducer has a length substantially equal to two wavelengths of a first oscillatory wave that is transmitted along the length of the transducer body when the transducer is operated at the first resonant frequency, and substantially equal to a half wavelength of a second oscillatory wave that is transmitted along the length of the transducer body when the transducer is operated at the second resonant frequency.
    Type: Application
    Filed: August 2, 2023
    Publication date: April 11, 2024
    Inventors: Tsz Kit YU, Ka Shing KWAN, Hoi Ting LAM, Hing Leung LI
  • Publication number: 20240116126
    Abstract: An ultrasonic transducer includes an elongated transducer body with an aperture for mounting a piezoelectric driver stack for driving the ultrasonic transducer to operate at a first resonant frequency, a mounting flange for mounting the transducer body to a wire bonding machine, a rigid connecting member having first and second ends which are respectively connected to the mounting flange and the transducer body at a first nodal vibration region of the transducer body when the ultrasonic transducer is operated at the first resonant frequency and a flexible connecting member extending between the mounting flange and the transducer body at a second nodal vibration region of the transducer body when the ultrasonic transducer is operated at the first resonant frequency.
    Type: Application
    Filed: October 11, 2022
    Publication date: April 11, 2024
    Inventors: Tsz Kit YU, Ka Shing KWAN, Hoi Ting LAM, Hing Leung LI
  • Patent number: 11954203
    Abstract: Methods and devices for determining whether a mobile device has been compromised. The mobile device has a managed portion of memory and an unmanaged portion of memory, a managed profile and an unmanaged profile, and the managed profile includes files stored in the managed portion of memory and the unmanaged profile includes files stored in the unmanaged portion of memory. The managed profile is governed by a device policy set by a remote administrator. File tree structure information for the unmanaged profile of the mobile device is obtained that details at least a portion of a tree-based structure of folders and files in the unmanaged portion of memory. It is determined from the file tree structure information that the mobile device has been compromised and, based on that determination, an action is taken.
    Type: Grant
    Filed: February 1, 2023
    Date of Patent: April 9, 2024
    Assignee: BlackBerry Limited
    Inventors: Chang Fung Yang, Robert Joseph Lombardi, Chi Hing Ng, Johnathan George White
  • Publication number: 20240105508
    Abstract: Disclosed herein are integrated circuit (IC) devices with contacts using nitridized molybdenum. For example, a contact arrangement for an IC device may include a semiconductor material and a contact extending into a portion of the semiconductor material. The contact may include molybdenum. The molybdenum may be in a first layer and a second layer, where the second layer may further include nitrogen. The first layer may have a thickness between about 5 nanometers and 16 nanometers, and the second layer may have a thickness between about 0.5 nanometers to 2.5 nanometers. The contact may further include a fill material (e.g., an electrically conductive material) and the second layer may be in contact with the fill material. The molybdenum may have a low resistance, and thus may improve the electrical performance of the contact. The nitridized molybdenum may prevent oxidation during the fabrication of the contact.
    Type: Application
    Filed: September 27, 2022
    Publication date: March 28, 2024
    Applicant: Intel Corporation
    Inventors: Jitendra Kumar Jha, Justin Mueller, Nazila Haratipour, Gilbert W. Dewey, Chi-Hing Choi, Jack T. Kavalieros, Siddharth Chouksey, Nancy Zelick, Jean-Philippe Turmaud, I-Cheng Tung, Blake Bluestein
  • Publication number: 20240105519
    Abstract: An embodiment method includes: forming a dielectric-containing substrate over a semiconductor substrate; forming a stack of first semiconductor layers and second semiconductor layers over the dielectric-containing substrate, wherein the first semiconductor layers and the second semiconductor layers have different material compositions and alternate with one another within the stack; patterning the first semiconductor layer and the second semiconductor layers into a fin structure such that the fin structure includes sacrificial layers including the second semiconductor layers and channel layers including the first semiconductor layers; forming source/drain features adjacent to the sacrificial layers and the channel layers; removing the sacrificial layers of the fin structure so that the channel layers of the fin structure are exposed; and forming a gate structure around the exposed channel layers, wherein the dielectric-containing substrate is interposed between the gate structure and the semiconductor substra
    Type: Application
    Filed: November 28, 2023
    Publication date: March 28, 2024
    Inventor: Ka-Hing Fung
  • Publication number: 20240100138
    Abstract: The invention features multi-specific fusion protein complexes with one domain comprising IL-15 or a functional variant and a binding domain specific to IL-12 or IL-18.
    Type: Application
    Filed: December 1, 2023
    Publication date: March 28, 2024
    Inventors: Warren D. Marcus, Robert Newman, Bai Liu, Lijing You, Lin Kong, Peter Rhode, Hing C. Wong
  • Patent number: D1022117
    Type: Grant
    Filed: March 18, 2022
    Date of Patent: April 9, 2024
    Assignee: Wisewell Holdings
    Inventors: Sami Khoreibi, Sebastien Wakim, Hing Wah Tsang, Paul Daniel Farrugia
  • Patent number: D1023031
    Type: Grant
    Filed: March 18, 2022
    Date of Patent: April 16, 2024
    Assignee: Wisewell Holdings
    Inventors: Sami Khoreibi, Sebastien Wakim, Mia Ighniades, Hing Wah Tsang, Wyatt Kwok Lun Wong
  • Patent number: D1027112
    Type: Grant
    Filed: March 18, 2022
    Date of Patent: May 14, 2024
    Assignee: Wisewell Holdings
    Inventors: Sami Khoreibi, Sebastien Wakim, Hing Wah Tsang, Paul Daniel Farrugia