Patents by Inventor Hing Yiu

Hing Yiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180335390
    Abstract: A method of determining concentration of a target organic compound in a sample, the method comprising dissolving a target sample in an organic solvent to obtain a sample solution, applying a probing device to the sample solution to form a target analyte, wherein the probing device is an SMIP probe comprising a solvatochromic molecularly imprinted polymer, and the SMIP probe comprises a solvatochromic functional group or a solvatochromic functional monomer the colour and/or fluorescence properties of which will change upon coupling or encountering the target organic compound or when the target organic compound is captured by the SMIP probe, and detecting or determining presence and concentration of the target organic compound with reference to a responsive optical signal such as colorimetric, luminescent and/or fluorescent response of the target analyte.
    Type: Application
    Filed: July 29, 2018
    Publication date: November 22, 2018
    Inventor: Hing Yiu Leung
  • Publication number: 20070214019
    Abstract: A method of archiving on a removable media, desired information retrieved from a medical device implanted within a patient. The method comprising the steps of transferring patient data from a medical device to a computer, performing an operation on said patient data within the computer to separate it into a first category of desired information and a second category of undesired information, copying desired information to removable media from computer, and deleting undesired information from computer.
    Type: Application
    Filed: March 6, 2007
    Publication date: September 13, 2007
    Inventors: Twins Shui Hing YIU, Jenkin Ji Khuen TONG
  • Patent number: 6200205
    Abstract: A lapping tool has an elongate shank mechanically coupled to a platform, having a generally planar working surface, by a universal joint comprising a ball and socket. A cavity is provided for entrapping grinding paste. Normally, the parts are made of electrically conductive materials so that current can be passed from the shank via the working surface to surface of a workpiece that is to be polished.
    Type: Grant
    Filed: January 12, 1999
    Date of Patent: March 13, 2001
    Inventor: Hing Yiu