Patents by Inventor Hing Yiu

Hing Yiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6200205
    Abstract: A lapping tool has an elongate shank mechanically coupled to a platform, having a generally planar working surface, by a universal joint comprising a ball and socket. A cavity is provided for entrapping grinding paste. Normally, the parts are made of electrically conductive materials so that current can be passed from the shank via the working surface to surface of a workpiece that is to be polished.
    Type: Grant
    Filed: January 12, 1999
    Date of Patent: March 13, 2001
    Inventor: Hing Yiu