Patents by Inventor Hinghung A. Chan

Hinghung A. Chan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Localized soldering by inductive heating
    Patent number: 4983804
    Abstract: Disclosed is a method for selective soldering of components by inductive heating. A ferromagnetic material is provided as part of the components so that an applied electromagnetic field will create sufficient heat to melt the solder. The Curie temperature of the material is chosen to be just above the melting temperature of the solder to regulate the amount of heating.
    Type: Grant
    Filed: December 21, 1989
    Date of Patent: January 8, 1991
    Assignee: AT&T Bell Laboratories
    Inventors: Hinghung A. Chan, Michael A. Oien