Patents by Inventor Hingloi A. Hung

Hingloi A. Hung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Millimeter-wave LTCC package
    Patent number: 5982250
    Abstract: A waveguide to microstrip transition (124) formed in a multi-layer substrate (208) is disclosed. The waveguide to microstrip transition (124) may be incorporated into a hermetically sealed package including a metal base (202), a multi-layer circuit (208), a metal ring (206), and a metal cover (204). The multi-layer circuit (208) has at least a first dielectric layer (230), a second dielectric layer (222), and a first conductive layer (218) disposed between the bottom side of the first dielectric layer (230) and the top side of the second dielectric layer (222). The multi-layer circuit (208) includes a waveguide (234). An electromagnetically reflective material (236) coats the walls of the waveguide (234) to allow signals to propagate by reflection through the waveguide (234) toward the first dielectric layer (230). Plated through vias (126) are located in at least the first dielectric layer (230).
    Type: Grant
    Filed: November 26, 1997
    Date of Patent: November 9, 1999
    Assignee: TWR Inc.
    Inventors: Hingloi A. Hung, Randy J. Duprey, Raquel T. Villeages