Patents by Inventor Hiraki Murai

Hiraki Murai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermosetting resin composition, and prepreg, laminate for circuit board, and printed circuit board each made therewith
    Publication number: 20040076805
    Abstract: The present invention discloses a thermosetting resin composition which comprises (A) 35 to 75 parts by weight of a thermosetting resin comprising a compound having a dihydrobenzoxazine ring as a main component, (B) 10 to 25 parts by weight of a polycondensation product of a phenol, a compound having a triazine ring and an aldehyde, and (C) 10 to 45 parts by weight of an epoxy resin, based on 100 parts by weight of the total amount of organic solid components of Components (A), (B) and (C), and (i) a bisphenol F epoxy resin having a weight average molecular weight of 1,000 to 3,000, or (ii) a mixed epoxy resin of bisphenol F epoxy resin and bisphenol A epoxy resin having a weight average molecular weight of 1,000 to 3,000, is contained in Component (C) in an amount of 0 to 100% by weight of Component (C); and a prepreg, a laminated board for a wiring board and a wiring board using the same.
    Type: Application
    Filed: July 9, 2003
    Publication date: April 22, 2004
    Inventors: Kenichi Oohori, Yoshihiro Nakamura, Hiraki Murai, Yoshiyuki Takeda, Yasuyuki Hirai, Shinichi Kamoshida, Minoru Kakitani, Norihiro Abe, Syunichi Numata, Teruki Aizawa, Ken Nanaumi