Patents by Inventor Hirishi Sogou

Hirishi Sogou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Connecting member of a circuit substrate and method of manufacturing multilayer circuit substrates by using the same
    Patent number: 5484647
    Abstract: A connecting member of circuit substrates includes an organic porous base material provided with tackfree films on both sides, through-holes disposed at requested places which are filled with conductive resin compound up to the surface of the tackfree films. This structure enables inner-via-hole connection and can therefore attain a connecting member of circuit substrates and an electrical connector of high reliability and high quality.By using a connecting member of circuit substrates including the organic porous base material provided with tackfree films on both sides and through-holes disposed at requested places which are filled with conductive resin compound up to the surface of the tackfree films, it is possible to form a high-multilayer substrate easily from double sided boards or four-layer substrates which can be manufactured rather stably.
    Type: Grant
    Filed: September 20, 1994
    Date of Patent: January 16, 1996
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Seiichi Nakatani, Akihito Hatakeyama, Kouji Kawakita, Hirishi Sogou, Tatsuo Ogawa, Tamao Kojima