Patents by Inventor Hiroaki Date
Hiroaki Date has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7551435Abstract: Electronic components differing in height (a CPU 2a, a capacitor 2b, and coil elements 2c) are mounted on a printed circuit board 1. A heat-absorbing member 3 is provided above the printed circuit board 1 in such a way that the member 3 contacts not only the top surface of the CPU 2a that is the shortest but the sides of the capacitor 2b and the coil elements 2c. To circulate a cooling medium, a flow path 4 is formed in the heat-absorbing member 3. Heat generated at the CPU 2a is transmitted from its top surface to the cooling medium in the flow path 4 via the heat-absorbing member 3; heat generated at the capacitor 2b and the coil elements 2c is transmitted from their sides to the cooling medium in the flow path 4 via the heat-absorbing member 3.Type: GrantFiled: September 11, 2007Date of Patent: June 23, 2009Assignee: Fujitsu LimitedInventors: Jun Taniguchi, Hiroki Uchida, Hideshi Tokuhira, Minoru Ishinabe, Masanobu Ishiduka, Hiroaki Date, Masatomo Asano, Nobuhiro Nanri
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Patent number: 7502227Abstract: A body flow path in a first housing having an MPU element communicates with an inner flow path and outer flow path formed in an inner heat-dissipating board and an outer heat-dissipating board, respectively, and a pump drives a cooling liquid to circulate in these flow paths. A beam is arranged between a pivot provided in a second housing and a pivot provided in the inner heat-dissipating board, a beam is arranged between the pivot of the inner heat-dissipating board and a pivot provided in the outer heat-dissipating board, and the inner heat-dissipating board and the outer heat-dissipating board are movable to the second housing. According to the operation of opening the second housing, a distance between the second housing and the inner heat-dissipating board, and a distance between the inner flow path and the outer flow path are increased.Type: GrantFiled: March 22, 2005Date of Patent: March 10, 2009Assignee: Fujitsu LimitedInventors: Hiroki Uchida, Jun Taniguchi, Hideshi Tokuhira, Minoru Ishinabe, Masanobu Ishiduka, Hiroaki Date
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Publication number: 20090052135Abstract: A body flow path in a first housing having an MPU element communicates with an inner flow path and outer flow path formed in an inner heat-dissipating board and an outer heat-dissipating board, respectively, and a pump drives a cooling liquid to circulate in these flow paths. A beam is arranged between a pivot provided in a second housing and a pivot provided in the inner heat-dissipating board, a beam is arranged between the pivot of the inner heat-dissipating board and a pivot provided in the outer heat-dissipating board, and the inner heat-dissipating board and the outer heat-dissipating board are movable to the second housing. According to the operation of opening the second housing, a distance between the second housing and the inner heat-dissipating board, and a distance between the inner flow path and the outer flow path are increased.Type: ApplicationFiled: October 14, 2008Publication date: February 26, 2009Applicant: FUJITSU LIMITEDInventors: Hiroki UCHIDA, Jun Taniguchi, Hideshi Tokuhira, Minoru Ishinabe, Masanobu Ishiduka, Hiroaki Date
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Patent number: 7455320Abstract: A shock absorbing steering apparatus for use in a vehicle, including a steering column to be fixed to a portion of a body of the vehicle such that the steering column is releasable from the body of the vehicle and movable in a forward direction of the vehicle in the event of a secondary collision of an occupant of the vehicle upon a collision of the vehicle, and wherein one of the steering column and the portion of the vehicle body includes a mounting portion, while the other of the steering column and the portion of the vehicle body includes a holding portion. The steering apparatus further includes an impact energy absorbing member to be mounted on the mounting portion.Type: GrantFiled: April 28, 2004Date of Patent: November 25, 2008Assignee: Toyota Jidosha Kabushiki KaishaInventors: Kenji Imamura, Shigeru Hoshino, Kiminori Yoshino, Hideo Kondo, Junichi Nakano, Hiroaki Date, Hitoshi Nakanishi
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Publication number: 20080220290Abstract: To provide a magnetic recording medium manufacturing method capable of transferring a pattern that can serve as a source for forming anodized alumina-nanoholes with high precision and realizing high productivity, and a large-capacity magnetic recording medium capable of achieving high density recording. The method includes forming a metallic layer on a concavo-convex pattern formed on a surface of a mold; bonding a substrate using an adhesive to a surface of the metallic layer on the side opposite to the mold; separating the mold from the metallic layer; forming, through nanohole formation treatment, a porous layer in which a plurality of nanoholes are formed to orient in a direction substantially perpendicular to a substrate plane by using as a nanohole source a concavo-convex pattern which has been formed by transferring the concavo-convex pattern in the mold to the metallic layer; and charging a magnetic material inside the nanoholes.Type: ApplicationFiled: December 28, 2007Publication date: September 11, 2008Applicants: Fujitsu Limited, Kanagawa Academy of Science and TechnologyInventors: Ken-ichi Itoh, Hideyuki Kikuchi, Hiroshi Nakao, Hirotaka Oshima, Takahiro Umada, Hideki Masuda, Kazuyuki Nishio, Mitsuo Takeuchi, Hiroaki Date
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Publication number: 20080145646Abstract: A bonding agent and an adhesive sheet for strongly bonding a plurality of components constituting the electronic device for the lifetime of the device, and for lowering a bonding force thereof for easily separating these components on the occasion of decomposing the electronic device. According to the present invention, a plurality of components can be easily decomposed only by executing a heat treatment through bonding of a plurality of components with a bonding agent including a thermo-melting microcapsules which includes a mold releasing agent.Type: ApplicationFiled: August 30, 2007Publication date: June 19, 2008Applicant: FUJITSU LIMITEDInventors: Katsuji EBISU, Hiroaki DATE, Michinori KUTAMI, Shigeharu SUZUKI
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Publication number: 20080111334Abstract: To offer a suspension apparatus for a vehicle with high utility, a suspension apparatus having a damping-force generating device which includes a body-side unit attached so as to project upward from a mount portion formed at a part of the vehicle is provided with a projecting-portion-displacement permitting mechanism for permitting a displacement of at least a projecting portion such that an amount of projection of the projecting portion decreases. The projecting-portion-displacement permitting mechanism is configured as follows, for instance. In a structure in which a downward movement of the body-side unit is prohibited by a pin of a solenoid, the solenoid is energized and the pin is withdrawn, thereby releasing the prohibition of the movement of the body-side unit. In consequence, the body side-unit is permitted to move downward.Type: ApplicationFiled: October 19, 2005Publication date: May 15, 2008Applicants: TOYOTA JIDOSHA KABUSHIKI KAISHA, KAYABA INDUSTRY CO., LTD.Inventors: Hirofumi Inoue, Hidenori Kajino, Hiroaki Date, Tomoo Kubota
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Publication number: 20080055860Abstract: Electronic components differing in height (a CPU 2a, a capacitor 2b, and coil elements 2c) are mounted on a printed circuit board 1. A heat-absorbing member 3 is provided above the printed circuit board 1 in such a way that the member 3 contacts not only the top surface of the CPU 2a that is the shortest but the sides of the capacitor 2b and the coil elements 2c. To circulate a cooling medium, a flow path 4 is formed in the heat-absorbing member 3. Heat generated at the CPU2a is transmitted from its top surface to the cooling medium in the flow path 4 via the heat-absorbing member 3; heat generated at the capacitor 2b and the coil elements 2c is transmitted from their sides to the cooling medium in the flow path 4 via the heat-absorbing member 3.Type: ApplicationFiled: September 11, 2007Publication date: March 6, 2008Inventors: Jun Taniguchi, Hiroki Uchida, Hideshi Tokuhira, Minoru Ishinabe, Masanobu Ishiduka, Hiroaki Date, Masatomo Asano, Nobuhiro Nanri
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Publication number: 20070289706Abstract: A process for producing a multilayer board includes the steps of applying a bonding ink to the terminal of the first substrate, the bonding ink including a thermosetting resin containing a filler and a curing agent, the filler being formed of metal particles plated with solder, the metal particles each having a first melting point, and the solder having a second melting point lower than the first melting point; bonding the second substrate to a bonding sheet composed of a thermosetting resin and having a through hole disposed in a portion corresponding to the terminal of the second substrate; and heating and pressurizing the first and second substrates with the bonding sheet in such a manner that the terminals are opposite each other to effect curing of the bonding sheet and the bonding ink and to form an integral structure.Type: ApplicationFiled: January 4, 2007Publication date: December 20, 2007Applicant: FUJITSU LIMITEDInventors: Takashi Nakagawa, Seiichi Sugano, Kenji Iida, Yasutomo Maehara, Hitoshi Suzuki, Kaoru Sugimoto, Kenji Fukuzono, Takashi Kanda, Hiroaki Date, Tomohisa Yagi
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Publication number: 20070224380Abstract: To easily separate an adhesive sheet and an adhesive agent adhered to an adherend leaving almost no residues thereof to the adherend, the thermo-melting micro-capsule internally including a mold releasing agent dispersed within the adhesive agent layer, the adhesive agent layer is thereby easily separated from the adherend leaving almost no residues on the adherend by only heating the layer. Moreover, gaps can be formed in the adhesive agent layer through expansion of a thermo-expanding particle by adding the thermo-expanding particle to the adhesive agent layer and thereby an adhesive force of the adhesive agent layer is remarkably lowered by the mold releasing agent penetrating into such gaps.Type: ApplicationFiled: March 23, 2007Publication date: September 27, 2007Applicant: FUJITSU LIMITEDInventors: Katsuji EBISU, Hiroaki DATE
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Publication number: 20070188490Abstract: An apparatus, a method and a program segment mesh model data into analytic surfaces based on robust curvature estimation and region growing by extracting, from mesh model data, analytic surface regions (planar, cylindrical, conical, spherical and toric surface regions) and by automatically recognizing fillet surface regions, linear-extrusion surface regions and surface regions of revolution from the extracted regions and edges.Type: ApplicationFiled: March 31, 2006Publication date: August 16, 2007Applicant: National University Corporation Hokkaido UniversityInventors: Satoshi Kanai, Takeshi Kishinami, Tomohiro Mizoguchi, Hiroaki Date
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Publication number: 20070000655Abstract: To realize a flat heat exchanger with superior stability of the flow path, a heat exchanger for liquid cooling in which a cooling liquid flows inside the heat exchanger includes a pouch made of a water-resistant sheet having an inflow port and an outflow port for the cooling liquid; a heat exchange plate overlapping with the pouch; a presser plate pressing the pouch against the heat exchange plate; wherein protrusions and depressions delimiting a flow path linking the inflow port and the outflow port are formed on the inner side of at least one of the heat exchange plate and the presser plate.Type: ApplicationFiled: October 24, 2005Publication date: January 4, 2007Inventors: Hiroki Uchida, Hideshi Tokuhira, Minoru Ishinabe, Hiroaki Date, Jun Taniguchi
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Patent number: 7155914Abstract: A cooling structure for electronic equipment is designed for cooling a heat-generating body (2a) disposed inside a case (20) by recovering heat generated by the heat-generating body (2a) and dissipating the heat to the outside of the case (20). The cooling structure includes a heat-receiving section (4) for recovering heat generated in the heat-generating body (2a), a thermally insulated space (6) provided with an air inflow orifice (42a) and an air outflow orifice (42b) and thermally insulated from the heat-generating body (2a) and heat-receiving section (4) by a thermally insulating member (40), a heat-dissipating section (7) provided inside the thermally insulated space (6), a heat transfer member (5) for transferring the heat recovered in the heat-receiving section (4) to the heat-dissipating section (7), and a fan (22) for generating forcibly an air flow in the thermally insulated space (6).Type: GrantFiled: September 12, 2005Date of Patent: January 2, 2007Assignee: Fujitsu LimitedInventors: Minoru Ishinabe, Hiroki Uchida, Hideshi Tokuhira, Hiroaki Date, Wataru Tanaka
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Publication number: 20060265198Abstract: A feature edge extraction technique supports automatic creation of a solid model from a 3D or triangular mesh model. The technique extracts feature edges from the 3D mesh model according to a global normal-line evaluation method and an improved watershed method. The technique uses data related to the 3D mesh model, defines an area with a Euclidean distance, globally evaluates normals of triangles in the area, calculates edge and vertex feature values, carries out discretization and differentiation on the calculated vertex feature values, extracts feature edges satisfying requirements, divides the mesh model into segments each consisting of connected triangles according to the improved watershed method that is capable of grouping vertexes, extracts the boundaries of each segment as feature edges, allows a user to interactively select required feature edges from among the extracted feature edges, and outputs data related to the selected feature edges.Type: ApplicationFiled: August 31, 2005Publication date: November 23, 2006Inventors: Satoshi Kanai, Takeshi Kishinami, Tomohiro Mizoguchi, Hiroaki Date
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Publication number: 20060181070Abstract: A shock absorbing steering apparatus for use in a vehicle, including a steering column to be fixed to a portion of a body of the vehicle such that the steering column is releasable from the body of the vehicle and movable in a forward direction of the vehicle in the event of a secondary collision of an occupant of the vehicle upon a collision of the vehicle, and wherein one of the steering column and the portion of the vehicle body includes a mounting portion, while the other of the steering column and the portion of the vehicle body includes a holding portion. The steering apparatus further includes an impact energy absorbing member to be mounted on the mounting portion.Type: ApplicationFiled: April 28, 2004Publication date: August 17, 2006Inventors: Kenji Imamura, Shigeru Hoshino, Kiminori Yoshino, Hideo Kondo, Junichi Nakano, Hiroaki Date, Hitoshi Nakanishi
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Publication number: 20060133032Abstract: A body flow path in a first housing having an MPU element communicates with an inner flow path and outer flow path formed in an inner heat-dissipating board and an outer heat-dissipating board, respectively, and a pump drives a cooling liquid to circulate in these flow paths. A beam is arranged between a pivot provided in a second housing and a pivot provided in the inner heat-dissipating board, a beam is arranged between the pivot of the inner heat-dissipating board and a pivot provided in the outer heat-dissipating board, and the inner heat-dissipating board and the outer heat-dissipating board are movable to the second housing. According to the operation of opening the second housing, a distance between the second housing and the inner heat-dissipating board, and a distance between the inner flow path and the outer flow path are increased.Type: ApplicationFiled: March 22, 2005Publication date: June 22, 2006Inventors: Hiroki Uchida, Jun Taniguchi, Hideshi Tokuhira, Minoru Ishinabe, Masanobu Ishiduka, Hiroaki Date
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Publication number: 20060065970Abstract: A plurality of carbon fibers having a surface having a metal-plated layer (Cu-plated layer) are stood vertically on a flat plate-like provisional substrate by electrostatic flocking, and one end of the carbon fibers is provisionally adhered to the provisional substrate with an adhesive. The other end of the carbon fibers which is not provisionally adhered is contacted with a substrate (Cu plate) having a surface coated with a solder paste and, in this state, a brazing material (solder) is melted and cooled, and carbon fibers and a substrate are brazed (soldered). After completion of mechanical and thermal connection between the substrate and the carbon fibers, this is immersed in an organic solvent, and the provisionally adhered provisional substrate is peeled from the carbon fibers to manufacture a radiating fin.Type: ApplicationFiled: December 27, 2004Publication date: March 30, 2006Inventors: Hiroki Uchida, Hideshi Tokuhira, Minoru Ishinabe, Hiroaki Date, Jun Taniguchi
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Publication number: 20060050073Abstract: A triangulated mesh generating method includes a first step of capturing data on triangulated mesh generated on the surface of a material in a computer and sequentially generating the tetrahedral mesh based on the surface triangulated mesh by using the computer, a second step of capturing the data on the tetrahedral mesh generated by the first step and dividing refining the tetrahedral mesh, and a third step of capturing the data on tetrahedral mesh generated by the second step and reducing and simplifying the number of tetrahedral meshes.Type: ApplicationFiled: August 31, 2005Publication date: March 9, 2006Inventors: Satoshi Kanai, Hiroaki Date, Kenji Kishinami, Ichiro Nishigaki
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Publication number: 20060044309Abstract: A finite-element analyzing system executable by a computer includes an analyzing-condition setting unit that captures data on a solid model of a product and sets an analyzing condition, a high-density tetrahedral mesh generating unit that captures the solid model and the analyzing condition and adds an identification sign to an element, to which the analyzing condition is set, based on at least a setting element size, thereby generating a tetrahedral mesh with high density, a multi-resolution tetrahedral mesh generating unit that captures the tetrahedral mesh which is generated by the tetrahedral mesh generating unit and additionally has the identification sign, and a finite-element analyzing unit 4 that captures the tetrahedral mesh with multi-resolution which controls the resolution generated by the multi-resolution tetrahedral mesh generating unit and performs the finite-element analysis by using the analyzing condition.Type: ApplicationFiled: August 31, 2005Publication date: March 2, 2006Inventors: Satoshi Kanai, Hiroaki Date, Kenji Kishinami, Ichiro Nishigaki
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Publication number: 20060038285Abstract: A small-size and light-weight electronic apparatus with a cooling structure capable of exhibiting good cooling performance is provided. A cover member with a plurality of grooves for forming a channel is joined by brazing to a housing on a lid body side to which an LCD panel is attached, and these grooves are covered with the housing to form a channel for circulating a coolant. The housing constitutes a part of the channel, and the channel for the coolant is integrated into the housing. Heat generated by a main body is transferred to the lid body side by the coolant and dissipated outside through the housing that performs the function of a heat-radiation plate.Type: ApplicationFiled: November 19, 2004Publication date: February 23, 2006Inventors: Hideshi Tokuhira, Hiroaki Date, Hiroki Uchida, Minoru Ishinabe