Patents by Inventor Hiroaki Doi

Hiroaki Doi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11964290
    Abstract: In a compressed-fluid discharge control device, there are formed a valve chamber communicated with a discharge channel and supply channels for supplying a compressed fluid, and a pilot chamber into which the compressed fluid is introduced from the supply channels. A diaphragm valve for communicating or cutting off communication of the supply channels and the discharge channel seats on or separates from a valve seat provided in the valve chamber. Pilot channels through which a compressed fluid supplied to the pilot chamber passes are formed in the diaphragm valve. The compressed-fluid discharge control device has a pilot chamber opening/closing valve for opening or closing the pilot chamber. The pilot chamber opening/closing valve includes a solenoid valve which is opened in response to energization thereof and closed in response to de-energization thereof.
    Type: Grant
    Filed: September 12, 2018
    Date of Patent: April 23, 2024
    Assignee: SMC CORPORATION
    Inventors: Yoshitada Doi, Hiroaki Sasaki, Masayuki Oshima
  • Patent number: 7230320
    Abstract: In an electronic circuit device including a substrate including a front surface on which an electronic circuit element is mounted and a reverse surface opposite to the front surface in a thickness direction of the substrate, an electrically conductive terminal member electrically connected to the electronic circuit element, a lead frame extending perpendicular to the thickness direction to face the reverse surface in the thickness direction, and a sealing resin covering at least partially the electronic circuit element, substrate and lead frame while at least a part of the electrically conductive terminal member is prevented from being covered by the sealing resin, the substrate extends to project outward from an end of the lead frame in a transverse direction perpendicular to the thickness direction while the end of the lead frame is covered by the sealing resin.
    Type: Grant
    Filed: July 29, 2003
    Date of Patent: June 12, 2007
    Assignee: Hitachi, Ltd.
    Inventors: Hiroaki Doi, Noriyoshi Urushiwara, Akira Matsushita
  • Patent number: 6889516
    Abstract: A cooling system for a motor is prevented from exhibiting a thermal fatigue failure due to a temperature cycle. The operation or stopping of the cooling motor fan 6 of the forced cooling system is controlled using the difference between the temperature thereof and the operation start temperature Tis of the power converter 3. Thus expansion of the temperature range is suppressed.
    Type: Grant
    Filed: July 24, 2003
    Date of Patent: May 10, 2005
    Assignee: Hitachi, Ltd.
    Inventors: Kaname Sasaki, Hiroaki Doi, Haruki Hamada, Masaaki Hayashi, Ryuichi Saito
  • Publication number: 20040194497
    Abstract: A cooling system for a motor is prevented from a thermal fatigue failure due to the temperature cycle. The operation or stop of the forced cooling motor fan 6 of the forcible cooling system is controlled using the difference between the temperature thereof and the operation start temperature Tis of the power converter 3, thus expansion of the temperature range is suppressed.
    Type: Application
    Filed: July 24, 2003
    Publication date: October 7, 2004
    Inventors: Kaname Sasaki, Hiroaki Doi, Haruki Hamada, Masaaki Hayashi, Ryuichi Saito
  • Publication number: 20040159919
    Abstract: In an electronic circuit device including a substrate including a front surface on which an electronic circuit element is mounted and a reverse surface opposite to the front surface in a thickness direction of the substrate, an electrically conductive terminal member electrically connected to the electronic circuit element, a lead frame extending perpendicular to the thickness direction to face the reverse surface in the thickness direction, and a sealing resin covering at least partially the electronic circuit element, substrate and lead frame while at least a part of the electrically conductive terminal member is prevented from being covered by the sealing resin, the substrate extends to project outward from an end of the lead frame in a transverse direction perpendicular to the thickness direction while the end of the lead frame is covered by the sealing resin.
    Type: Application
    Filed: July 29, 2003
    Publication date: August 19, 2004
    Applicant: Hitachi, Ltd.
    Inventors: Hiroaki Doi, Noriyoshi Urushiwara, Akira Matsushita
  • Patent number: 6265784
    Abstract: A resin sealed semiconductor device is provided with an organic resin wiring substrate, an LSI chip having a semiconductor integrated circuit and mounted in a bare chip package form to the organic resin wiring substrate through a plurality of electrical bonding members, and a resin charged into a gap portion between the organic resin wiring substrate and the LSI chip. In this resin sealed semiconductor device, a modulus of longitudinal elasticity of the resin to be charged, its coefficient of linear thermal expansion and its fillet shape are optimized. The resin charged is also preferably colored in black to minimize adverse effects of visible rags on the LSI chip.
    Type: Grant
    Filed: November 10, 1999
    Date of Patent: July 24, 2001
    Assignee: Hitachi, Ltd.
    Inventors: Kenya Kawano, Hiroaki Doi, Akio Yasukawa, Hideo Miura
  • Patent number: 4528223
    Abstract: Composite fibrous products such as composite cloth, composite strings, composite knitted goods, etc., produced by using combination yarns obtained by twisting one or more aromatic polyamide continuous filament yarns and one or more continuous glass yarns have high rigidity and excellent reinforcing effects.
    Type: Grant
    Filed: October 26, 1981
    Date of Patent: July 9, 1985
    Assignees: Hitachi, Ltd., Hitachi Chemical Co., Ltd., Fuji Fiber Glass Co., Ltd.
    Inventors: Tetsuo Kumazawa, Hiroaki Doi, Yasuo Miyadera, Atsushi Fujioka, Tadashi Nagai