Patents by Inventor Hiroaki Fukuzawa

Hiroaki Fukuzawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chemical-mechanical polishing apparatus
    Patent number: 6364742
    Abstract: A chemical-mechanical polishing apparatus includes a polishing pad, a polishing table, a wafer holder, a dresser for setting the polishing pad each time after a specified number of wafers are chemically and mechanically polished; and a conditioning controller for controlling the conditions of setting the polishing pad based on a polishing rate and a required length of polishing time. The chemical-mechanical polishing apparatus can suitably correct, after every polishing of the specified number of wafers, the setting conditions of the polishing pad and can properly conduct the subsequent polishing.
    Type: Grant
    Filed: October 15, 1999
    Date of Patent: April 2, 2002
    Assignee: NEC Corporation
    Inventor: Hiroaki Fukuzawa