Patents by Inventor Hiroaki Funada

Hiroaki Funada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for forming a pattern film with a narrower width
    Patent number: 7866029
    Abstract: A method for forming a pattern film with a narrower width than the resolution of an exposure machine and a resist used independently of etching is provided. The method comprises the steps of: forming a first frame layer having end surfaces facing each other across a space having a width W1; forming a second frame layer having end surfaces facing each other across a space having a width W2 that is larger than the width W1, the space having the width W2 being located right above the space having the width W1; forming a trench-forming film provided with a trench having a minimum width W3 that is smaller than the width W1 so as to fill at least a part of the spaces having the width W1 and the width W2 respectively; and forming a pattern film so as to fill at least a part of the trench.
    Type: Grant
    Filed: March 22, 2007
    Date of Patent: January 11, 2011
    Assignee: TDK Corporation
    Inventors: Hirotaka Gomi, Mitsuharu Isobe, Noriyuki Ito, Hiroaki Funada, Takeshi Yamana, Makoto Terasawa, Yasuhiro Hasegawa
  • Forming method of pattern film with narrower width and thin-film magnetic head having magnetic pole layer with narrower width
    Publication number: 20070223141
    Abstract: A method for forming a pattern film with a narrower width than the resolution of an exposure machine and a resist used independently of etching is provided. The method comprises the steps of: forming a first frame layer having end surfaces facing each other across a space having a width W1; forming a second frame layer having end surfaces facing each other across a space having a width W2 that is larger than the width W1, the space having the width W2 being located right above the space having the width W1; forming a trench-forming film provided with a trench having a minimum width W3 that is smaller than the width W1 so as to fill at least a part of the spaces having the width W1 and the width W2 respectively; and forming a pattern film so as to fill at least a part of the trench.
    Type: Application
    Filed: March 22, 2007
    Publication date: September 27, 2007
    Applicant: TDK Corporation
    Inventors: Hirotaka Gomi, Mitsuharu Isobe, Noriyuki Ito, Hiroaki Funada, Takeshi Yamana, Makoto Terasawa, Yasuhiro Hasegawa