Patents by Inventor Hiroaki Furuichi
Hiroaki Furuichi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20110110213Abstract: In a laser welding method, detachment is suppressed and dislocation of an optical component is reduced by improving adhesiveness of an interface of a welded part to thereby improve yield and reliability of an optical pickup device. A manufacturing method of an optical pickup device includes: a step of bringing the optical component into contact with the holding member; a step of irradiating laser light; and a step of melting the holding member through the irradiation to weld the holding member to the optical component, wherein before the laser light is irradiated, surface roughness of a portion of the optical component to be welded is greater than surface roughness of the holding member in contact with the portion, whereby the melted holding member enters into an uneven part on a front surface of the optical component, improving adhesion strength.Type: ApplicationFiled: October 6, 2010Publication date: May 12, 2011Inventors: Satoshi ARAI, Hiroaki Furuichi, Mitsuo Satake
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Patent number: 7873970Abstract: The present invention provides an optical pickup device employing a disc protector that includes a plurality of first protrusions and at least one second protrusion disposed on the lens holder, wherein the first protrusions are formed by applying a first adhesive to a plurality of areas of a top surface of the lens holder, wherein the first protrusions are arranged at different locations in the tracking direction such that the objective lens is sandwiched between the first protrusions, wherein the at least one second protrusion protrudes is formed by applying a second adhesive to at least one area of the top surface of the lens holder, and wherein tips of the first protrusions are closer to the optical disc than a tip of the at least one second protrusion.Type: GrantFiled: July 30, 2007Date of Patent: January 18, 2011Assignee: Hitachi Media Electronics Co., Ltd.Inventors: Satoshi Arai, Hiroaki Furuichi, Yoshio Oozeki, Rika Nomura, Masayuki Okamura, Kazumi Takahashi, Mitsuo Satake
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Publication number: 20100162281Abstract: To provide an optical pickup device adapted such that for adhesion fixing of a holder for holding an LD or a light-receiving element to an optical pickup casing via an ultraviolet-curable adhesive, curing shrinkage during ultraviolet irradiation can be reduced and adhesion fixing achieved with high positioning accuracy. In a structure for adhesion fixing of a holder for holding an LD or a light-receiving element to an optical pickup casing via an ultraviolet-curable adhesive, since protrusions are provided at peripheral sections (UV irradiation light source side) on a bonding surface of the holder, a section exposed to strong UV light is first cured, then after the adhesive has moved from an uncured section, the amount of shrinkage of the first cured section in a Z-direction is reduced, and the uncured section is cured.Type: ApplicationFiled: November 24, 2009Publication date: June 24, 2010Applicant: HITACHI MEDIA ELECTRONICS CO., LTDInventors: Hiroaki FURUICHI, Kazumi TAKAHASHI, Hiroyasu YOSHIDA
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Patent number: 7739703Abstract: An optical pickup device having an optical module provided with an optical element and bonded and fixed to an optical pickup case, wherein the optical module is fixed to the optical pickup case by a first ultraviolet curing adhesive at at least two positions with an optical axis between the positions, the optical axis extending from the optical element to the optical pickup case, and at least a part of an exposed surface of the first ultraviolet curing adhesive is covered with a second ultraviolet curing adhesive higher in hardness or elastic modulus than the first ultraviolet curing adhesive to diminish an optical axis offset of the optical pickup device, further, a heat dissipating material higher in thermal conductivity than the first and second ultraviolet curing adhesives is brought into contact with both optical module and optical pickup case to improve the heat dissipating performance of the optical pickup device.Type: GrantFiled: February 1, 2007Date of Patent: June 15, 2010Assignee: Hitachi Media Electronics Co., Ltd.Inventors: Satoshi Arai, Hiroaki Furuichi, Yoshio Oozeki, Rika Nomura, Kazumi Takahashi
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Publication number: 20100034070Abstract: To provide a reliable optical pickup device, a pickup case and an optical component including a lens are fixed by laser welding to increase the welding strength and reduce the positional displacement due to environmental changes. In a laser welded portion between a pickup case and an optical component including a lens, the optical component is provided with a joint portion having a convex protrusion at a portion to be joined to the pickup case. Laser beam irradiation is performed extending longer than the protrusion to form a thick welded portion at an end of the protrusion, in order to increase welding strength between the optical component and the pickup case.Type: ApplicationFiled: April 10, 2009Publication date: February 11, 2010Inventors: Satoshi Arai, Hiroaki Furuichi, Mitsuo Satake
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Publication number: 20090323498Abstract: An optical pickup device includes a holder which holds an LD and a light-receiving element and an optical pickup case on which the holder is adhesively fixed via an ultraviolet cure adhesive, and is provided with a through hole on a bonding surface of the holder in order to reduce shrinkage when ultraviolet light is irradiated and to form a blind portion on which the ultraviolet light is not irradiated from a specific direction for adhesively fixing with high position accuracy.Type: ApplicationFiled: April 9, 2009Publication date: December 31, 2009Inventors: Hiroaki Furuichi, Yoshio Oozeki, Kazumi Takahashi, Taketoshi Moriyama, Hiroyasu Yoshida
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Publication number: 20090323503Abstract: A connection structure of Flexible printed circuits comprising: first and second Flexible printed circuits, respectively, including a base formed of a resin, a plurality of wiring patterns arranged side by side on the base, a cover formed of a resin to cover opposite sides of the wiring patterns to the base, and a connection portion in which the plurality of wiring patterns are not covered by the cover, the connection portions of the first and second Flexible printed circuits being connected with each other. The wiring patterns in the connection portions include a large width portion which is larger in width than the wiring patterns covered by the cover. The large width portions on the first Flexible printed circuit and the large width portions on the second Flexible printed circuit are connected to each other by means of soldering.Type: ApplicationFiled: April 9, 2009Publication date: December 31, 2009Inventors: Rika Nomura, Hiroaki Furuichi, Yoshi Oozeki, Kazuhiko Ito, Fumihito Ichikawa
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Patent number: 7613080Abstract: To provide an optical pickup device in which an optical parts module is fixedly adhered in a high positional precision to an optical pickup case, such that the adhesion strength can be sufficiently enhanced against a stress to be applied to the adhering faces from a flexible printed circuit board connected to the optical parts module, the present invention forms the adhering faces on at least two portions across the optical axis of the optical parts module, and also forms groove portions on the individual surfaces of the optical parts module and the optical pickup case for the adhering faces.Type: GrantFiled: December 7, 2005Date of Patent: November 3, 2009Assignee: Hitachi Media Electronics Co., Ltd.Inventors: Yoshio Oozeki, Hiroaki Furuichi, Satoshi Arai, Hideo Sotokawa
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Publication number: 20090129239Abstract: In laser welding an optical part to a pickup case of an optical pickup device, outgas deposition on a lens surface can be inhibited, and positional shifting of the optical part can be reduced. The optical part has a lens surface facing in an optical axis direction and a protruding part formed, to be joined to the pickup case, at an end portion thereof in a direction perpendicular to the optical axis. A joint surface between the protruding part and the pickup case extends in a direction parallel to the optical axis, and the joint surface is fixed by a weld portion formed by laser irradiation. The joint surface is parallel to a bottom surface of the pickup case, and the height from the bottom surface is approximately equal to the height of the center of the lens surface.Type: ApplicationFiled: November 6, 2008Publication date: May 21, 2009Inventors: Satoshi Arai, Hiroaki Furuichi, Kazumi Takahashi, Mitsuo Satake
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Patent number: 7475412Abstract: In order to improve reliability of an optical disk drive apparatus at low cost, a flexible substrate for making connection between an optical pick-up device incorporated in the optical disk drive apparatus and a drive side is divided into a first flexible substrate fixed to the optical pick-up body (for example, upper surface), and a second flexible substrate connected to the first flexible substrate and extending to the drive, wiring conductors formed on a connection end portion of the first flexible substrate and wiring conductors formed on a connection end portion of the second flexible substrate are superposed at a region adjacent an end of the case of the optical pick-up device body, and connected to each other by joining material, and a connection section between the wiring conductors is held down by a cover for protecting the optical pick-up device body.Type: GrantFiled: January 18, 2006Date of Patent: January 6, 2009Assignee: Hitachi Media Electronics Co., Ltd.Inventors: Satoshi Arai, Hiroaki Furuichi, Yoshio Oozeki, Hideo Sotokawa, Mitsuo Satake, Kazuhiko Ito, Masayoshi Watanabe
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Publication number: 20080087802Abstract: In an optical pickup device, a side surface parallel in the optical axis direction of an optical component is respectively fixed with an adhesive at wall surfaces (internal walls) provided opposing with each other of an accommodation case. In a part of the wall surfaces of the accommodation case, a recessed channel to be filled with the adhesive is formed. The recessed channel is provided with a stepped portion along the optical axis of the optical component at the wall surfaces of the accommodation case. A gap between the relevant side surfaces and the side surface of the optical component is formed to be reduced symmetrically toward both end portions from the center in the optical axis direction of the optical component. Accordingly, bonding strength is never lowered and position of the optical pickup device is stably maintained in an optical system.Type: ApplicationFiled: August 23, 2007Publication date: April 17, 2008Inventors: YOSHIO OZEKI, Hiroaki Furuichi, Rika Nomura, Kazuyuki Fukuda, Taketoshi Moriyama
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Publication number: 20080052734Abstract: The present invention provides an optical pickup device employing a disc protector that includes a plurality of first protrusions and at least one second protrusion disposed on the lens holder, wherein the first protrusions are formed by applying a first adhesive to a plurality of areas of a top surface of the lens holder, wherein the first protrusions are arranged at different locations in the tracking direction such that the objective lens is sandwiched between the first protrusions, wherein the at least one second protrusion protrudes is formed by applying a second adhesive to at least one area of the top surface of the lens holder, and wherein tips of the first protrusions are closer to the optical disc than a tip of the at least one second protrusion.Type: ApplicationFiled: July 30, 2007Publication date: February 28, 2008Inventors: Satoshi Arai, Hiroaki Furuichi, Yoshio Oozeki, Rika Nomura, Masayuki Okamura, Kazumi Takahashi, Mitsuo Satake
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Publication number: 20070183273Abstract: An optical pickup device having an optical module provided with an optical element and bonded and fixed to an optical pickup case, wherein the optical module is fixed to the optical pickup case by a first ultraviolet curing adhesive at at least two positions with an optical axis between the positions, the optical axis extending from the optical element to the optical pickup case, and at least a part of an exposed surface of the first ultraviolet curing adhesive is covered with a second ultraviolet curing adhesive higher in hardness or elastic modulus than the first ultraviolet curing adhesive to diminish an optical axis offset of the optical pickup device, further, a heat dissipating material higher in thermal conductivity than the first and second ultraviolet curing adhesives is brought into contact with both optical module and optical pickup case to improve the heat dissipating performance of the optical pickup device.Type: ApplicationFiled: February 1, 2007Publication date: August 9, 2007Inventors: Satoshi ARAI, Hiroaki FURUICHI, Yoshio OOZEKI, Rika NOMURA, Kazumi TAKAHASHI
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Publication number: 20070169136Abstract: In a joint of a first flexible printed circuit board (FPC board) dividedly manufactured and fixed to an optical pickup device main body and a second FPC board dividedly manufactured and inserted into a drive side connector in an optical pickup drive apparatus, the present invention is characterized in that an end face of a base film of at least one of the FPC boards extends outward from an end face of wiring conductor. In solder bonding of a first FPC board to a second FPC board, the present invention is characterized by having a solder dam formed at a leading end of wiring of the first FPC board so as to ensure a predetermined amount of solder for re-joint when the second FPC board is removed from the first FPC board and by narrowing an end of wiring of the second FPC board.Type: ApplicationFiled: December 8, 2006Publication date: July 19, 2007Inventors: Hiromichi Hiramatsu, Hiroaki Furuichi, Satoshi Arai, Rika Nomura, Mitsuo Satake
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Patent number: 7215886Abstract: The present invention is related to an optical communication module for transmitting high frequency signals (e.g., 10 Gbit/s and higher data rates) between an optical element and an external circuit. In an illustrative embodiment, the optical communication module includes signal transmission lines and ground lines formed on a ceramic substrate, a flexible wiring board, and a printed circuit board. The widths of the signal lines and the ground lines vary, as well as the spacing between the signal and ground lines. This facilitates characteristic impedance matching among the signal lines to within about 50?.Type: GrantFiled: August 15, 2002Date of Patent: May 8, 2007Assignee: Hitachi, Ltd.Inventors: Shigenobu Maruyama, Kazumi Kawamoto, Hiroaki Furuichi, Tooru Yoshida, Isamu Yoshida, Katsuya Oono, Osamu Yamada, Hiroshi Ibe, Shigeru Tokita, Tarou Tonoduka, Yasunori Iwafuji, Katsumi Kuroguchi
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Patent number: 7153758Abstract: In anodic bonding between a conductor or semiconductor and glass, in order to attain good adhesion at a lower bonding temperature than usual and improve the toughness at its boundary to obtain higher reliability for a bonded portion even in a case where bonded members are warped or dust is present at the bonding boundary, a soft metal film is formed on the surface of a conductor or semiconductor on which an active metal film having high reactivity with oxygen is formed, whereby a warp or dust, if any, can be absorbed by the deformation of the soft metal film, thereby to improve the adhesion at the boundary. Adhesion at the bonding boundary is improved even at a low bonding temperature of, e.g., about 200° C. Further, the toughness at the bonding boundary can be improved to increase reliability by roughening the bonded surface on the side of the glass.Type: GrantFiled: February 26, 2004Date of Patent: December 26, 2006Assignee: Hitachi, Ltd.Inventors: Shohei Hata, Hideo Sotokawa, Hiroaki Furuichi
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Publication number: 20060161940Abstract: In order to improve reliability of an optical disk drive apparatus at low cost, a flexible substrate for making connection between an optical pick-up device incorporated in the optical disk drive apparatus and a drive side is divided into a first flexible substrate fixed to the optical pick-up body (for example, upper surface), and a second flexible substrate connected to the first flexible substrate and extending to the drive, wiring conductors formed on a connection end portion of the first flexible substrate and wiring conductors formed on a connection end portion of the second flexible substrate are superposed at a region adjacent an end of the case of the optical pick-up device body, and connected to each other by joining material, and a connection section between the wiring conductors is held down by a cover for protecting the optical pick-up device body.Type: ApplicationFiled: January 18, 2006Publication date: July 20, 2006Inventors: Satoshi Arai, Hiroaki Furuichi, Yoshio Oozeki, Hideo Sotokawa, Mitsuo Satake, Kazuhiko Ito, Masayoshi Watanabe
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Patent number: 7037000Abstract: The present invention provides an optical transmission module comprising: a laser diode; a lens for condensing a laser beam from the laser diode; a fiber ferrule which is placed so that the laser beam condensed by the lens can enter a fiber core; and a lens aperture or a lens aperture portion which is provided at one of the lens itself, a position before the lens and a position after the lens. In addition, the present invention provides an optical transmission module in which instead of the lens aperture, an effective diameter of the lens on the fiber ferrule side is set at a value ranging from 0.1 times to less than 0.2 times of a distance between an emittance plane of the lens and an incidence plane of the fiber ferrule.Type: GrantFiled: July 30, 2003Date of Patent: May 2, 2006Assignee: OpNext Japan, Inc.Inventors: Hiroaki Furuichi, Hiroyasu Sasaki, Kazumi Kawamoto
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Publication number: 20060062139Abstract: To provide an optical pickup device in which an optical parts module is fixedly adhered in a high positional precision to an optical pickup case, such that the adhesion strength can be sufficiently enhanced against a stress to be applied to the adhering faces from a flexible printed circuit board connected to the optical parts module, the present invention forms the adhering faces on at least two portions across the optical axis of the optical parts module, and also forms groove portions on the individual surfaces of the optical parts module and the optical pickup case for the adhering faces.Type: ApplicationFiled: December 7, 2005Publication date: March 23, 2006Inventors: Yoshio Oozeki, Hiroaki Furuichi, Satoshi Arai, Hideo Sotokawa
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Patent number: 6983000Abstract: A laser diode module includes a laser diode device, a first photo detector part for receiving, first divided light that is a first portion of light when at least one of light emissions of the laser diode device is divided into two portions of light each traveling a different optical path, a second photo detector part for receiving second divided light that is a second portion of light thus divided via at least a wavelength selective member, and a controller which controls the lasing wavelength of the laser diode device on the basis of outputs of the first and second photo detector parts. A beam splitter provided between the laser diode and the wavelength selective member divides light emitted from the laser diode into the first and second divided light and a quarter-wave plate is provided in an optical path between the beam splitter and the wavelength selective member.Type: GrantFiled: July 15, 2003Date of Patent: January 3, 2006Assignee: Hitachi, Ltd.Inventors: Kimio Tatsuno, Hiroaki Furuichi, Kazumi Kawamoto, Katsumi Kuroguchi