Abstract: A transistor (200) is provided with a semiconductor chip (1) inside a resin package (20). An outer lead (41, 42, 43, 44) is arranged on a first side surface (23) of the resin package (20) to serve as an external drain electrode. A lead frame (5) includes the outer lead (41, 42, 43, 44) and a sheet-like portion (51). The sheet-like portion (51) is connected to a first surface (1a) of the semiconductor chip (1) for holding a drain electrode. An outer lead (45, 46, 47, 48) is arranged on a second side surface (24) of the resin package (20) to serve as an external source electrode. The outer lead (45, 46, 47, 48) is connected by a wire (4) to a second surface (1b) of the semiconductor chip (1) for holding a source electrode. An ejector pin site (22) formed on a top surface (21) of the resin package (20) is located on the side of the first side surface (23).

Abstract: A transistor (200) is provided with a semiconductor chip (1) inside a resin package (20). An outer lead (41, 42, 43, 44) is arranged on a first side surface (23) of the resin package (20) to serve as an external drain electrode. A lead frame (5) includes the outer lead (41, 42, 43, 44) and a sheet-like portion (51). The sheet-like portion (51) is connected to a first surface (1a) of the semiconductor chip (1) for holding a drain electrode. An outer lead (45, 46, 47, 48) is arranged on a second side surface (24) of the resin package (20) to serve as an external source electrode. The outer lead (45, 46, 47, 48) is connected by a wire (4) to a second surface (1b) of the semiconductor chip (1) for holding a source electrode. An ejector pin site (22) formed on a top surface (21) of the resin package (20) is located on the side of the first side surface (23).