Patents by Inventor Hiroaki Hase

Hiroaki Hase has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050094188
    Abstract: An image transmission device is disclosed which transmits image data to one or a plurality of devices that are capable of receiving image data, and is connected to a transmission data management computer. The image transmission device includes a transmittee data acquisition unit that acquires transmittee data, a first transmission unit that transmits image data to one or a plurality of transmittee devices as indicated by the transmittee data, and a second transmission unit that transmits transmitted image data and transmittee data to the transmission data management computer when image data is transmitted to one or a plurality of transmittee devices by the first transmission unit. A transmission data management system is also disclosed, and includes the aforementioned image transmission device, a transmission data management computer that stores data transmitted from the image transmission device, and a network that connects the image transmission device and the transmission data management computer.
    Type: Application
    Filed: October 29, 2003
    Publication date: May 5, 2005
    Applicant: KYOCERA MITA CORPORATION
    Inventors: Masayoshi Suzuki, Hiroaki Hase, Kiyoshi Hori
  • Patent number: 6147152
    Abstract: A polypropylene resin composition is diclosed which comprises (a) 50-80% by weight of a specific polypropylene/ethylene-propylene copolymer composition, (b) 5-40% by weight of a specific ethylene/.alpha.-olefin copolymer rubber, (c) 1-10% by weight of a specific hydrogenated diene block copolymer, and (d) 10-30% by weight of talc, wherein the polypropylene component of the component (a) has a melt flow rate of 100-1,000 g/10 min and a C.sub.f value (cross fractionation ratio) of not more than 0.5. The resin composition has excellent flowability and can impart excellent rigidity, high-temperature rigidity and impact resistance, and well-balanced combination thereof to the molded articles.
    Type: Grant
    Filed: May 4, 1999
    Date of Patent: November 14, 2000
    Assignees: Toyota Jidosha Kabushiki Kaisha, Chisso Corporation
    Inventors: Yoshihiro Kanome, Takao Nomura, Kouichi Hatada, Shinei Gima, Teruaki Hayashida, Osamu Kojima, Ken Shimizu, Hiroaki Hase
  • Patent number: 5830582
    Abstract: Disclosed is a flame-retardant resin laminate including a layer formed from a flame-retardant olefin resin composition and a layer formed from an olefin resin, wherein the flame-retardant olefin resin composition comprises 2.5 to 67% by weight of ammonium polyphosphate, 0.4 to 52.5% by weight of a nitrogen-containing organic compound, and 30 to 90% by weight of an olefin resin and has a weight ratio of the nitrogen-containing organic compound to the ammonium polyphosphate of 0.05 to 3. The flame-retardant resin laminate hardly generates black smoke or toxic gas, even when exposed to high temperatures or contacted with flames, and has excellent appearance, printability, weathering resistance and scratch resistance.
    Type: Grant
    Filed: September 30, 1996
    Date of Patent: November 3, 1998
    Assignee: Chisso Corporation
    Inventors: Hiroaki Hase, Shinichi Akitaya
  • Patent number: 5300364
    Abstract: The present invention provides a flexible metal-clad laminate obtained by directly applying a polyimide precursor to a metallic conductive foil, and then drying, heating and curing the precursor to form a polyimide film, this flexible metal-clad laminate being characterized in that the polyimide film is composed of two or more polyimide layers, the linear thermal expansion coefficient of at least one of the second and later polyimide layers is larger than that of the first layer brought into contact with the metallic conductive foil, and the requirements of the following formulae are met:3.0<Q.sub.n-1 .times.t.sub.n <50,t.sub.n-1 >t.sub.n and ##EQU1## wherein t.sub.n is the thickness (.mu.m) of the outermost layer (the nth layer) of the polyimide layers, t.sub.n-1 is the thickness (.mu.m) of the film comprising the first layer to the (n-1)th layer of the polyimide layers, and Q.sub.
    Type: Grant
    Filed: April 29, 1992
    Date of Patent: April 5, 1994
    Assignee: Chisso Corporation
    Inventors: Hiroaki Hase, Kazutsune Kikuta, Atsushi Takahashi, Shiro Konotsune
  • Patent number: 5192619
    Abstract: A flexible copper-applied substrate comprises a copper foil and a resin layer comprising a composite material of a polyimide and a polyimide silicone, the resin layer being directly formed on the surface of the copper foil, said substrate being producible by applying a polyamide acid composite composed of a mixed solution of a polyamide acid and a polyamide acid alkylsilane to a copper foil and heating.
    Type: Grant
    Filed: November 4, 1991
    Date of Patent: March 9, 1993
    Assignee: Chisso Corporation
    Inventors: Shiro Konotsune, Kazutsune Kikuta, Masaya Uetsuki, Hiroaki Hase