Patents by Inventor Hiroaki Inous

Hiroaki Inous has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate plating method and apparatus
    Publication number: 20060144714
    Abstract: A method and apparatus plate a substrate to form wiring by efficiently filling a fine recess formed in a semiconductor substrate with plating metal without a void or contamination. The plating of the substrate to fill a wiring recess formed in the semiconductor substrate with plating metal includes performing an electroless plating process of forming an initial layer on the substrate, and performing an electrolytic plating process of filling the wiring recess with the plating metal, while the initial layer serves as a feeding layer.
    Type: Application
    Filed: February 24, 2006
    Publication date: July 6, 2006
    Inventors: Akihisa Hongo, Naoaki Ogure, Hiroaki Inous, Satoshi Sendai, Tetsuma Ikegami, Koji Mishima, Shuichi Okuyama, Mizuki Nagai, Ryoichi Kimizuka, Megumi Maruyama