Patents by Inventor Hiroaki ISHIZAKI

Hiroaki ISHIZAKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD FOR PRODUCING SUPPORT SUBSTRATE FOR BONDED WAFER, AND SUPPORT SUBSTRATE FOR BONDED WAFER
    Publication number: 20230395423
    Abstract: A producing method of a handle wafer for a bonded wafer produced by bonding an active wafer and the handle wafer through an insulation film includes: preparing a handle wafer body made from a monocrystalline silicon wafer; forming an oxide film on the handle wafer body; depositing a polycrystalline silicon layer on the oxide film; forming a protective oxide film on a surface of the polycrystalline silicon layer; and polishing to remove the protective oxide film and polishing the polycrystalline silicon layer.
    Type: Application
    Filed: October 18, 2021
    Publication date: December 7, 2023
    Applicant: SUMCO CORPORATION
    Inventors: Naoya NONAKA, Daisuke HIEDA, Hiroaki ISHIZAKI, Toshiyuki ISAMI, Koudai MOROIWA
  • SUPPORT SUBSTRATE FOR BONDED WAFER
    Publication number: 20230230875
    Abstract: A handle wafer used for a bonded wafer that is produced by bonding an active wafer and the handle wafer through an insulation film is provided. The handle wafer includes a handle wafer body and a polycrystalline silicon layer deposited on a side close to a bonding surface of the handle wafer body. The polycrystalline silicon layer has a polycrystalline silicon grain size of 0.419 ?m or less.
    Type: Application
    Filed: May 27, 2021
    Publication date: July 20, 2023
    Applicant: SUMCO CORPORATION
    Inventors: Shota SHIBUYA, Daisuke HIEDA, Hiroaki ISHIZAKI